JPH0171460U - - Google Patents

Info

Publication number
JPH0171460U
JPH0171460U JP1987167129U JP16712987U JPH0171460U JP H0171460 U JPH0171460 U JP H0171460U JP 1987167129 U JP1987167129 U JP 1987167129U JP 16712987 U JP16712987 U JP 16712987U JP H0171460 U JPH0171460 U JP H0171460U
Authority
JP
Japan
Prior art keywords
circuit board
board device
pattern section
dividing means
divided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987167129U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987167129U priority Critical patent/JPH0171460U/ja
Publication of JPH0171460U publication Critical patent/JPH0171460U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す要部平面図、
第2図は分割状態を示す要部平面図、第3図イ,
ロは従来例の一面及び、その反対面を示す要部平
面図である。 10……回路基板装置、10a……第1の回路
基板部、10b……第2の回路基板部、11……
連結部、12……ミシン目、13a,13b,1
3c……配線パターン部、14……細線パターン
部、15……広巾状ハンダ留りパターン部。
FIG. 1 is a plan view of essential parts showing an embodiment of the present invention;
Figure 2 is a plan view of the main parts showing the divided state, Figure 3 A,
B is a principal part plan view showing one side and the opposite side of the conventional example. 10...Circuit board device, 10a...First circuit board section, 10b...Second circuit board section, 11...
Connecting portion, 12...Perforation, 13a, 13b, 1
3c... Wiring pattern section, 14... Thin line pattern section, 15... Wide soldering pattern section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 分割された若しくは、分割され得る状態となる
ように分割手段を有する回路基板装置において該
回路基板装置の分割部分は分割手段と、該分割手
段間に配された細線パターン部と、該細線パター
ン部に連接して配した広巾状の半田留りパターン
部とから構成されたことを特徴とする回路基板装
置。
In a circuit board device having a dividing means so as to be divided or capable of being divided, the dividing portion of the circuit board device includes the dividing means, a thin line pattern section disposed between the dividing means, and the thin line pattern section. 1. A circuit board device comprising: a wide solder clamp pattern section connected to the circuit board device;
JP1987167129U 1987-10-31 1987-10-31 Pending JPH0171460U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987167129U JPH0171460U (en) 1987-10-31 1987-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987167129U JPH0171460U (en) 1987-10-31 1987-10-31

Publications (1)

Publication Number Publication Date
JPH0171460U true JPH0171460U (en) 1989-05-12

Family

ID=31455144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987167129U Pending JPH0171460U (en) 1987-10-31 1987-10-31

Country Status (1)

Country Link
JP (1) JPH0171460U (en)

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