JPH0163144U - - Google Patents

Info

Publication number
JPH0163144U
JPH0163144U JP1987158269U JP15826987U JPH0163144U JP H0163144 U JPH0163144 U JP H0163144U JP 1987158269 U JP1987158269 U JP 1987158269U JP 15826987 U JP15826987 U JP 15826987U JP H0163144 U JPH0163144 U JP H0163144U
Authority
JP
Japan
Prior art keywords
semiconductor device
push
supports
processed
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987158269U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987158269U priority Critical patent/JPH0163144U/ja
Publication of JPH0163144U publication Critical patent/JPH0163144U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図ａは本考案の実施例の平面図、第１図ｂ
は第１図ａのＢ―Ｂ′で示すセンタ部の断面図で
ある。第２図は従来技術を示す断面図である。 １……アイランド、２……ツリピン、３……押
し下げ加工部、４……インナリード、５……半導
体装置。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体装置を搭載するアイランド部を支えるツ
    リピンの押し下げ加工部が複数段の階段状に加工
    されていることを特徴とする半導体搭載用のリー
    ドフレーム。
JP1987158269U 1987-10-16 1987-10-16 Pending JPH0163144U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987158269U JPH0163144U (ja) 1987-10-16 1987-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987158269U JPH0163144U (ja) 1987-10-16 1987-10-16

Publications (1)

Publication Number Publication Date
JPH0163144U true JPH0163144U (ja) 1989-04-24

Family

ID=31438440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987158269U Pending JPH0163144U (ja) 1987-10-16 1987-10-16

Country Status (1)

Country Link
JP (1) JPH0163144U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191333A (ja) * 2003-12-26 2005-07-14 Matsushita Electric Ind Co Ltd 半導体装置及び半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191333A (ja) * 2003-12-26 2005-07-14 Matsushita Electric Ind Co Ltd 半導体装置及び半導体装置の製造方法

Similar Documents

Publication Publication Date Title
JPH0163144U (ja)
JPH0262743U (ja)
JPH0291356U (ja)
JPH0295238U (ja)
JPH0325242U (ja)
JPH0479444U (ja)
JPS62163962U (ja)
JPH0226261U (ja)
JPS61195054U (ja)
JPH01157424U (ja)
JPH01123340U (ja)
JPS6255355U (ja)
JPS62163966U (ja)
JPS6420746U (ja)
JPH0296745U (ja)
JPH01117074U (ja)
JPS6420744U (ja)
JPS62140741U (ja)
JPH0160553U (ja)
JPH0472637U (ja)
JPH02148770U (ja)
JPH0325252U (ja)
JPH0220352U (ja)
JPH0229526U (ja)
JPS63191638U (ja)