JPH0161672U - - Google Patents
Info
- Publication number
- JPH0161672U JPH0161672U JP16521187U JP16521187U JPH0161672U JP H0161672 U JPH0161672 U JP H0161672U JP 16521187 U JP16521187 U JP 16521187U JP 16521187 U JP16521187 U JP 16521187U JP H0161672 U JPH0161672 U JP H0161672U
- Authority
- JP
- Japan
- Prior art keywords
- package
- leakage current
- semiconductor device
- leads
- current measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図はこの考案の一実施例である半導体装置
のリーク電流測定装置を示す要部断面図、第２図
はその装置によるリーク電流測定時の状態を示す
図、第３図は半導体装置を装着するＩＣキヤリヤ
の外観斜視図、第４図は従来の半導体装置のリー
ク電流測定装置によるリーク電流測定時の状態を
示す図である。
図において、１はセラミツクパツケージ本体、
２，３はリード、４は半導体チツプ、５，６はＡ
ｌワイヤ、７はメタル蓋、１３は半導体装置、１
８は電極である。なお、各図中同一符号は同一ま
たは相当部分を示す。
FIG. 1 is a cross-sectional view of the main parts of a leakage current measuring device for a semiconductor device, which is an embodiment of the invention, FIG. 2 is a diagram showing the state of the device when measuring leakage current, and FIG. FIG. 4 is a perspective view of the external appearance of the IC carrier to be mounted, and is a diagram showing a state when leakage current is measured by a conventional semiconductor device leakage current measuring device. In the figure, 1 is the ceramic package body;
2 and 3 are leads, 4 is a semiconductor chip, 5 and 6 are A
l wire, 7 is a metal lid, 13 is a semiconductor device, 1
8 is an electrode. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
プを収容するとともに、前記パツケージの外部に
複数のリードを突設して、前記パツケージ内で前
記リードと前記半導体チツプとをワイヤにより電
気接続した半導体装置に対し、いずれか一方のリ
ードに電圧を印加しながら他のリードを接地して
リードに流れるリーク電流を測定するリーク電流
測定装置において、 前記パツケージを接地するための電極をパツケ
ージに対し接離自在に設けたことを特徴とする半
導体装置のリーク電流測定装置。 (2) 前記パツケージが、メタル蓋とセラミツク
パツケージ本体とで構成されて、前記メタル蓋に
前記電極を接続させる実用新案登録請求の範囲第
１項記載の半導体装置のリーク電流測定装置。[Claims for Utility Model Registration] (1) A semiconductor chip is housed inside a flat package, a plurality of leads are provided protruding from the outside of the package, and the leads and the semiconductor chip are connected within the package. In a leakage current measurement device that measures leakage current flowing through a semiconductor device electrically connected to the package by applying a voltage to one of the leads while grounding the other lead, the electrode is used to ground the package. 1. A leakage current measuring device for a semiconductor device, characterized in that a leakage current measuring device for a semiconductor device is provided so as to be able to freely approach and separate from a package. (2) The leakage current measuring device for a semiconductor device according to claim 1, wherein the package is composed of a metal lid and a ceramic package body, and the electrode is connected to the metal lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16521187U JPH0161672U (en) | 1987-06-01 | 1987-10-27 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8585487 | 1987-06-01 | ||
| JP16521187U JPH0161672U (en) | 1987-06-01 | 1987-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0161672U true JPH0161672U (en) | 1989-04-19 |
Family
ID=31718600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16521187U Pending JPH0161672U (en) | 1987-06-01 | 1987-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0161672U (en) |
-
1987
- 1987-10-27 JP JP16521187U patent/JPH0161672U/ja active Pending
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