JPH0160559U - - Google Patents
Info
- Publication number
- JPH0160559U JPH0160559U JP1987155339U JP15533987U JPH0160559U JP H0160559 U JPH0160559 U JP H0160559U JP 1987155339 U JP1987155339 U JP 1987155339U JP 15533987 U JP15533987 U JP 15533987U JP H0160559 U JPH0160559 U JP H0160559U
- Authority
- JP
- Japan
- Prior art keywords
- side frame
- resin sealing
- tie bar
- light emitting
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987155339U JPH0639463Y2 (ja) | 1987-10-09 | 1987-10-09 | 発光ダイオード素子の樹脂封止用リードフレーム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987155339U JPH0639463Y2 (ja) | 1987-10-09 | 1987-10-09 | 発光ダイオード素子の樹脂封止用リードフレーム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0160559U true JPH0160559U (da) | 1989-04-17 |
| JPH0639463Y2 JPH0639463Y2 (ja) | 1994-10-12 |
Family
ID=31432879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987155339U Expired - Lifetime JPH0639463Y2 (ja) | 1987-10-09 | 1987-10-09 | 発光ダイオード素子の樹脂封止用リードフレーム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0639463Y2 (da) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63287045A (ja) * | 1987-05-19 | 1988-11-24 | Sharp Corp | 光半導体装置の製造方法 |
-
1987
- 1987-10-09 JP JP1987155339U patent/JPH0639463Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63287045A (ja) * | 1987-05-19 | 1988-11-24 | Sharp Corp | 光半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0639463Y2 (ja) | 1994-10-12 |