JPS6390857U - - Google Patents
Info
- Publication number
- JPS6390857U JPS6390857U JP18580886U JP18580886U JPS6390857U JP S6390857 U JPS6390857 U JP S6390857U JP 18580886 U JP18580886 U JP 18580886U JP 18580886 U JP18580886 U JP 18580886U JP S6390857 U JPS6390857 U JP S6390857U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead portion
- semiconductors
- semiconductor element
- located inside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000000465 moulding Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18580886U JPS6390857U (da) | 1986-12-01 | 1986-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18580886U JPS6390857U (da) | 1986-12-01 | 1986-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6390857U true JPS6390857U (da) | 1988-06-13 |
Family
ID=31134781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18580886U Pending JPS6390857U (da) | 1986-12-01 | 1986-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6390857U (da) |
-
1986
- 1986-12-01 JP JP18580886U patent/JPS6390857U/ja active Pending