JPH0146591B2 - - Google Patents
Info
- Publication number
- JPH0146591B2 JPH0146591B2 JP18491381A JP18491381A JPH0146591B2 JP H0146591 B2 JPH0146591 B2 JP H0146591B2 JP 18491381 A JP18491381 A JP 18491381A JP 18491381 A JP18491381 A JP 18491381A JP H0146591 B2 JPH0146591 B2 JP H0146591B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- present
- alloys
- peeling
- ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacture And Refinement Of Metals (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18491381A JPS5887275A (ja) | 1981-11-18 | 1981-11-18 | Cu及びCu合金上のSn層の剥離法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18491381A JPS5887275A (ja) | 1981-11-18 | 1981-11-18 | Cu及びCu合金上のSn層の剥離法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5887275A JPS5887275A (ja) | 1983-05-25 |
JPH0146591B2 true JPH0146591B2 (en, 2012) | 1989-10-09 |
Family
ID=16161518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18491381A Granted JPS5887275A (ja) | 1981-11-18 | 1981-11-18 | Cu及びCu合金上のSn層の剥離法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5887275A (en, 2012) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2671276B2 (ja) * | 1986-08-29 | 1997-10-29 | 日鉱金属 株式会社 | 銅系スクラツプの処理方法 |
JP5481179B2 (ja) | 2009-12-15 | 2014-04-23 | Dowaメタルテック株式会社 | Cu系材料のSnめっき層の剥離方法 |
JP5481233B2 (ja) * | 2010-03-04 | 2014-04-23 | Dowaメタルテック株式会社 | Snイオンを含有する廃液の再生処理方法 |
-
1981
- 1981-11-18 JP JP18491381A patent/JPS5887275A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5887275A (ja) | 1983-05-25 |
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