JPH0143652Y2 - - Google Patents

Info

Publication number
JPH0143652Y2
JPH0143652Y2 JP14191282U JP14191282U JPH0143652Y2 JP H0143652 Y2 JPH0143652 Y2 JP H0143652Y2 JP 14191282 U JP14191282 U JP 14191282U JP 14191282 U JP14191282 U JP 14191282U JP H0143652 Y2 JPH0143652 Y2 JP H0143652Y2
Authority
JP
Japan
Prior art keywords
printed wiring
check signal
conductive rubber
defect
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14191282U
Other languages
Japanese (ja)
Other versions
JPS5948075U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14191282U priority Critical patent/JPS5948075U/en
Publication of JPS5948075U publication Critical patent/JPS5948075U/en
Application granted granted Critical
Publication of JPH0143652Y2 publication Critical patent/JPH0143652Y2/ja
Granted legal-status Critical Current

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  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Description

【考案の詳細な説明】 本考案は印刷配線板の不良検出装置に関し、特
に、印刷配線板の印刷配線のシヨート不良や断線
不良を検出しうる不良検出装置に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a defect detection device for printed wiring boards, and more particularly to a defect detection device capable of detecting shot defects and disconnection defects in printed wiring on printed wiring boards.

任意の印刷配線を絶縁基板の片面や両面に印刷
した印刷配線板は、小形化・高密度化のために配
線と配線との間隔を非常に狭くしたり、あるいは
配線を細くしている。そのために、配線と配線と
がシヨートしたり、配線が断線したりする不良が
生じ易くなつてきた。
Printed wiring boards, in which arbitrary printed wiring is printed on one or both sides of an insulating substrate, have very narrow intervals between the wiring or thin wiring in order to achieve miniaturization and high density. As a result, defects such as shorting between wires and disconnection of wires are becoming more likely to occur.

ところで、従来、シヨート不良や断線不良を検
出するのに、ピンを用い、ピン先をスルーホール
に差し込み、ピン間にチエツク信号を流して行な
つていた。
By the way, in the past, to detect shot defects and disconnection defects, pins were used, the tips of the pins were inserted into through holes, and a check signal was passed between the pins.

しかしながら、最近、IC等を載置し接続する
ために、スルーホールを設けずに、ただ単に電極
を印刷した構成の印刷配線板が用いられるように
なつてきた。このような印刷配線板では、従来の
ようにピンだけを用いて不良検出を行なうことが
非常に困難であり、そのために平板状の導電性ゴ
ムをピンの代りに用いた装置が利用されるように
なつてきた。例えば、第1図に示す通り、一方の
電極にピン1を用い、他方の電極に導電性ゴム2
を用いるもので、断線不良の場合にはチエツク信
号がピン1と導電性ゴム2の間に流れなくなるの
で検出が容易である。が、シヨート不良の場合に
はピン1の間にチエツク信号が流れるが、シヨー
ト不良でなくてもピン1の間には導電ゴム2を通
してチエツク信号が流れるために、検出し難い欠
点があつた。
However, recently, in order to mount and connect ICs and the like, printed wiring boards that simply have electrodes printed on them without providing through holes have come to be used. In such printed wiring boards, it is very difficult to detect defects using only pins as in the past, so devices that use flat conductive rubber instead of pins are being used. I'm getting used to it. For example, as shown in Figure 1, use pin 1 for one electrode and conductive rubber 2 for the other electrode.
If a disconnection occurs, the check signal will no longer flow between the pin 1 and the conductive rubber 2, making it easy to detect. However, in the case of a shot defect, a check signal flows between pins 1, but even if there is no shot defect, the check signal flows between pins 1 through the conductive rubber 2, making it difficult to detect.

本考案は、以上の欠点を改良し、印刷配線のシ
ヨート不良や断線不良を確実に検出しうる印刷配
線板の不良検出装置の提供を目的とするものであ
る。
The present invention aims to improve the above-mentioned drawbacks and provide a printed wiring board defect detection device that can reliably detect shot defects and disconnection defects in printed wiring.

本考案は、上記の目的を達成するために、印刷
配線板の印刷配線にチエツク信号を流し、該チエ
ツク信号の変化を検出して印刷配線のシヨート不
良及び断線不良を検出しうる印刷配線板の不良検
出装置において、導電性ゴムと該導電性ゴムより
も突出している接触ピンとが設けられている基板
を有し、印刷配線板に設けられた印刷配線に前記
接触ピンのみを接触しチエツク信号を流すことに
よりシヨート不良を検出し、前記印刷配線板に前
記接触ピンと前記導電性ゴムとを接触し前記チエ
ツク信号を流すことにより断線不良を検出しうる
印刷配線板の不良検出装置を提供するものであ
る。
In order to achieve the above object, the present invention provides a printed wiring board that can send a check signal to the printed wiring of the printed wiring board, detect changes in the check signal, and detect short or disconnection defects in the printed wiring. A defect detection device has a substrate provided with conductive rubber and contact pins protruding beyond the conductive rubber, and only the contact pins are brought into contact with printed wiring provided on a printed wiring board to generate a check signal. The present invention provides a defect detection device for a printed wiring board, which can detect a shot defect by flowing the conductive rubber and detect a disconnection defect by bringing the contact pin and the conductive rubber into contact with the printed wiring board and flowing the check signal. be.

以下、本考案の実施例を図面に基づいて説明す
る。
Hereinafter, embodiments of the present invention will be described based on the drawings.

第2図において、11は基板である。12は基
板11を貫通している複数個の接触ピンであり、
バネにより弾力性が与えられている。13は基板
11の片面に接着剤等により固着された平板状の
導電性ゴムである。14はチエツク信号を発生し
その変化を検出するためのチエツク信号器であ
り、接触ピン12及び導電性ゴム13に接続され
ている。
In FIG. 2, 11 is a substrate. 12 is a plurality of contact pins penetrating the substrate 11;
The spring gives it elasticity. Reference numeral 13 denotes a flat conductive rubber plate fixed to one side of the substrate 11 with an adhesive or the like. Reference numeral 14 denotes a check signal device for generating a check signal and detecting a change thereof, and is connected to the contact pin 12 and the conductive rubber 13.

すなわち、先づ、第3図に示す通り、接触ピン
12を印刷配線板15に設けられたスルーホール
に接触し、押え板16により若干、印刷配線板1
5を押し下げる。これは、接触ピン12により多
少高低があるためで、印刷配線板15を押し下げ
ることにより、接触ピン12の接触ミスを防止で
きる。この段階において、接触ピン12の間にチ
エツク信号を流し、シヨート不良を検出する。
That is, as shown in FIG.
Press down on 5. This is because the contact pins 12 have some height, and by pushing down the printed wiring board 15, it is possible to prevent contact errors of the contact pins 12. At this stage, a check signal is passed between the contact pins 12 to detect a shot defect.

次に、押え板16により印刷配線板15をさら
に押し下げて、印刷配線板15に導電性ゴム13
を接触する。そして接触ピン12の間にチエツク
信号を流して断線不良を検出する。
Next, the printed wiring board 15 is further pressed down using the holding plate 16, and the conductive rubber 13 is attached to the printed wiring board 15.
contact. A check signal is then passed between the contact pins 12 to detect a disconnection defect.

以上の通り、本考案によれば、基板に接触ピン
と導電性ゴムとを段差を設けて取り付けており、
シヨート不良と断線不良とを別々に検出できるの
で検出ミスのない印刷配線板の不良検出装置が得
られる。
As described above, according to the present invention, the contact pins and the conductive rubber are attached to the board with steps,
Since short defects and disconnection defects can be detected separately, a defect detection device for printed wiring boards without detection errors can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の印刷配線板の不良検出装置によ
り不良を検出している状態の斜視図、第2図は本
考案の実施例の正面図、第3図は第2図の実施例
によりシヨート不良を検出している状態の正面
図、第4図は第2図の実施例により断線不良を検
出している状態の正面図を示す。 11……基板、12……接触ピン、13……導
電性ゴム、14……チエツク信号器。
Fig. 1 is a perspective view of a state in which a defect is detected by a conventional printed wiring board defect detection device, Fig. 2 is a front view of an embodiment of the present invention, and Fig. 3 is a shot diagram of the embodiment of Fig. 2. FIG. 4 shows a front view of a state in which a disconnection defect is detected by the embodiment of FIG. 2. 11... Board, 12... Contact pin, 13... Conductive rubber, 14... Check signal device.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷配線板の印刷配線にチエツク信号を流し、
該チエツク信号の変化を検出して印刷配線の良否
を判別しうる印刷配線板の不良検出装置におい
て、導電性ゴムと該導電性ゴムより突出している
接触ピンとが設けられている基板を有し、印刷配
線に前記接触ピンのみを接触しチエツク信号を流
すことによりシヨート不良を検出し、前記印刷配
線に前記接触ピンと前記導電性ゴムとを接触し前
記チエツク信号を流すことにより断線不良を検出
しうる印刷配線板の不良検出装置。
A check signal is sent to the printed wiring on the printed wiring board,
A defect detection device for a printed wiring board capable of determining whether the printed wiring is good or bad by detecting a change in the check signal, comprising a substrate provided with conductive rubber and a contact pin protruding from the conductive rubber, A shot defect can be detected by contacting only the contact pin with the printed wiring and sending a check signal, and a disconnection defect can be detected by bringing the contact pin and the conductive rubber into contact with the printed wiring and sending the check signal. Printed wiring board defect detection device.
JP14191282U 1982-09-21 1982-09-21 Printed wiring board defect detection device Granted JPS5948075U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14191282U JPS5948075U (en) 1982-09-21 1982-09-21 Printed wiring board defect detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14191282U JPS5948075U (en) 1982-09-21 1982-09-21 Printed wiring board defect detection device

Publications (2)

Publication Number Publication Date
JPS5948075U JPS5948075U (en) 1984-03-30
JPH0143652Y2 true JPH0143652Y2 (en) 1989-12-18

Family

ID=30317249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14191282U Granted JPS5948075U (en) 1982-09-21 1982-09-21 Printed wiring board defect detection device

Country Status (1)

Country Link
JP (1) JPS5948075U (en)

Also Published As

Publication number Publication date
JPS5948075U (en) 1984-03-30

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