JPS5832475U - Handling device electrode - Google Patents
Handling device electrodeInfo
- Publication number
- JPS5832475U JPS5832475U JP12771481U JP12771481U JPS5832475U JP S5832475 U JPS5832475 U JP S5832475U JP 12771481 U JP12771481 U JP 12771481U JP 12771481 U JP12771481 U JP 12771481U JP S5832475 U JPS5832475 U JP S5832475U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- handling device
- electrode
- device electrode
- under test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、本考案の一実施例を説明するだめの斜視図、
第２図は第１図の正面図すある。
１・・・・・・プリント板、２・・・・・・伝達軸、３
・・・・・・接触子、４・・・・・・導体面、５・・・
・・・被検査■ｃ、 ６・・・・・・位置決めブロック
、７・・・・・・プリント板コネクタ。FIG. 1 is a perspective view of an embodiment of the present invention;
FIG. 2 is a front view of FIG. 1. 1...Printed board, 2...Transmission shaft, 3
...Contactor, 4...Conductor surface, 5...
...Inspected ■c, 6...Positioning block, 7...Printed board connector.
Claims (1)
を行なうためのハンドリング装置の電極子において、−
面側に、前記被検査集積回路の端子列と合わせてプリン
ト配線した接触子を設け、反対側の面を前記被検査集積
回路の端子のうち、電極子でのインピーダンスを低くし
たい任意の端子に接触する接触子とスルーホールで結ば
れた導体面としたプリント板から構成されていることを
特徴とするハンドリング装置の電極子。In an electrode of a handling device for making an electrical connection between an integrated circuit to be tested and an integrated circuit testing device, -
A contact element printed and wired to match the terminal row of the integrated circuit under test is provided on one side, and the other side is connected to any terminal among the terminals of the integrated circuit under test for which the impedance at the electrode element is desired to be lowered. An electrode for a handling device, characterized in that it is composed of a printed board with a conductive surface connected to a contact with a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12771481U JPS5832475U (en) | 1981-08-27 | 1981-08-27 | Handling device electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12771481U JPS5832475U (en) | 1981-08-27 | 1981-08-27 | Handling device electrode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5832475U true JPS5832475U (en) | 1983-03-03 |
Family
ID=29921435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12771481U Pending JPS5832475U (en) | 1981-08-27 | 1981-08-27 | Handling device electrode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5832475U (en) |
-
1981
- 1981-08-27 JP JP12771481U patent/JPS5832475U/en active Pending
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