JPH0143036B2 - - Google Patents
Info
- Publication number
- JPH0143036B2 JPH0143036B2 JP17474581A JP17474581A JPH0143036B2 JP H0143036 B2 JPH0143036 B2 JP H0143036B2 JP 17474581 A JP17474581 A JP 17474581A JP 17474581 A JP17474581 A JP 17474581A JP H0143036 B2 JPH0143036 B2 JP H0143036B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- plated
- plating
- plate
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17474581A JPS5877588A (ja) | 1981-10-31 | 1981-10-31 | メツキ方法及びその装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17474581A JPS5877588A (ja) | 1981-10-31 | 1981-10-31 | メツキ方法及びその装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5877588A JPS5877588A (ja) | 1983-05-10 |
JPH0143036B2 true JPH0143036B2 (enrdf_load_stackoverflow) | 1989-09-18 |
Family
ID=15983933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17474581A Granted JPS5877588A (ja) | 1981-10-31 | 1981-10-31 | メツキ方法及びその装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5877588A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009074126A (ja) * | 2007-09-20 | 2009-04-09 | Dowa Metaltech Kk | めっき方法およびその装置 |
CN103074651B (zh) * | 2013-02-16 | 2015-05-13 | 马国荣 | 用于盖板局部镀金的电镀夹具 |
-
1981
- 1981-10-31 JP JP17474581A patent/JPS5877588A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5877588A (ja) | 1983-05-10 |
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