JPH0141026B2 - - Google Patents
Info
- Publication number
- JPH0141026B2 JPH0141026B2 JP57104351A JP10435182A JPH0141026B2 JP H0141026 B2 JPH0141026 B2 JP H0141026B2 JP 57104351 A JP57104351 A JP 57104351A JP 10435182 A JP10435182 A JP 10435182A JP H0141026 B2 JPH0141026 B2 JP H0141026B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- point
- devices
- lead frame
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims abstract description 51
- 239000008188 pellet Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims description 14
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000002788 crimping Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7865—Means for transporting the components to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
Abstract
Description
【発明の詳細な説明】
本発明はワイヤボンデイング方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wire bonding method.
リードフレームにはペレツトが等間隔に複数個
貼付けられており、ペレツトを中心として各デバ
イスを形成し、前記ペレツトのパツドとリードフ
レームのリードとをワイヤボンダーを用いてワイ
ヤが接続される。従来のかかるワイヤボンデイン
グ方法は、ボンデイング部の手前で検出器により
１デバイスだけリードとペレツトの位置を検出
し、その後このデバイス部をボンデイング部に送
つてボンデイングしている。 A plurality of pellets are attached to the lead frame at equal intervals, and each device is formed around the pellets, and wires are connected between the pads of the pellets and the leads of the lead frame using a wire bonder. In the conventional wire bonding method, the positions of only one lead and pellet are detected by a detector before the bonding section, and then this device section is sent to the bonding section for bonding.
このように、１デバイス分だけ検出及びワイヤ
ボンデイングを行う毎にリードフレームを送るの
で、トランジスタ、ダイオード、液晶表示素子等
のようにワイヤ数が少なく、またピツチが狭く、
更にデバイスが非常に多いものにおいては、リー
ドフレームの送り時間の占める割合が非常に大き
く、また位置補正を行うための位置検出時間の占
める割合も大きく、生産性に劣る欠点を有する。
またリードフレームを送つて検出済のデバイス部
をボンデイングするので、リードフレームの送り
によるずれが生じ、高精度のボンデイングが行え
ない欠点を有する。 In this way, a lead frame is sent each time one device is detected and wire bonded, so the number of wires is small and the pitch is narrow, such as for transistors, diodes, liquid crystal display elements, etc.
Furthermore, in a device with a large number of devices, the lead frame feeding time occupies a very large proportion, and the position detection time for performing position correction occupies a large proportion, resulting in poor productivity.
Furthermore, since the detected device portion is bonded by feeding the lead frame, a shift occurs due to the feeding of the lead frame, which has the disadvantage that highly accurate bonding cannot be performed.
本発明は上記従来技術の欠点に鑑みなされたも
ので、送り時間の短縮、位置検出時間の短縮及び
高精度のボンデイングが行えるワイヤボンデイン
グ方法を提供することを目的とする。 The present invention has been made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a wire bonding method that can shorten feeding time, shorten position detection time, and perform highly accurate bonding.
以下、本発明を図示の実施例により説明する。 Hereinafter, the present invention will be explained with reference to illustrated embodiments.
図は本発明になるワイヤボンデイング方法の一
実施例を示し、第１図は平面図、第２図は正面図
である。１はペレツト２が等間隔に複数個貼付け
られたリードフレームで、前記ペレツト２の両側
にはリード３，４が形成されており、ペレツト２
とリード３，４とはワイヤ５により接続される。
またリードフレーム１にはリードフレーム１を位
置決めするための位置決め穴６が設けられてい
る。 The figures show an embodiment of the wire bonding method according to the present invention, with FIG. 1 being a plan view and FIG. 2 being a front view. 1 is a lead frame on which a plurality of pellets 2 are pasted at equal intervals; leads 3 and 4 are formed on both sides of the pellets 2;
and the leads 3 and 4 are connected by a wire 5.
Further, the lead frame 1 is provided with a positioning hole 6 for positioning the lead frame 1.
第３図はリードフレーム１の１つのデバイスを
示す拡大図である。第３図において、２ａ，２ｂ
はペレツト２のボンデイング点を、３ａ，４ａは
それぞれリード３，４のボンデイング点をそれぞ
れ示す。ここでは、ワイヤ５を２ａ点より３ａ点
へボンデイングし、２ｂ点より４ａ点へボンデイ
ングするものとする。 FIG. 3 is an enlarged view showing one device of the lead frame 1. FIG. In Figure 3, 2a, 2b
3a and 4a indicate the bonding points of the pellet 2, and 3a and 4a indicate the bonding points of the leads 3 and 4, respectively. Here, it is assumed that the wire 5 is bonded from point 2a to point 3a, and from point 2b to point 4a.
再び第１図、第２図において、１０はリードフ
レーム１の送りをガイドするガイドレール、１１
はリードフレーム１の位置決め穴１ａに係合して
リードフレーム１を位置決めする位置決めピン
で、ガイドレール１０に上下動可能に設けられて
いる。１２はリードフレーム１をボンデイング可
能な温度に加熱するヒートブロツクで、リードフ
レーム１の下面に接するようにガイドレール１０
の溝部１０ａに配設されている。１３はガイドレ
ール１０の側方に配設されたボンデイングヘツド
で、ワイヤ（図示せず）を挿通する工具１４を先
端に取付けたボンデイングアーム１５を保持して
いる。１６はボンデイングヘツド１３を搭載して
平面上のXY方向に移動可能なXY駆動装置、１
７，１８はXY駆動部１６をＸ方向、Ｙ方向にそ
れぞれ移動させるモータ、１９はガイドレール１
０に位置決めされたリードフレーム１のリード
３，４とペレツト２を検出する検出器で、図示の
実施例では工具１４より２デバイス分後方に配設
されるようにボンデイングヘツド１３に取付けら
れたフレーム２０に取付けられている。 Again in FIGS. 1 and 2, reference numeral 10 indicates a guide rail for guiding the feed of the lead frame 1;
is a positioning pin that engages with the positioning hole 1a of the lead frame 1 to position the lead frame 1, and is provided on the guide rail 10 so as to be movable up and down. 12 is a heat block that heats the lead frame 1 to a temperature that allows bonding;
It is arranged in the groove portion 10a of. A bonding head 13 is disposed on the side of the guide rail 10 and holds a bonding arm 15 having a tool 14 attached to its tip for inserting a wire (not shown). 16 is an XY drive device equipped with the bonding head 13 and movable in XY directions on a plane;
7 and 18 are motors that move the XY drive unit 16 in the X direction and Y direction, respectively; 19 is the guide rail 1
A detector for detecting the leads 3, 4 and pellet 2 of the lead frame 1 positioned at 0. In the illustrated embodiment, the frame is attached to the bonding head 13 so as to be located two devices behind the tool 14. It is attached to 20.
次に動作について説明する。今、例えば10デバ
イス分を１つの単位としてボンデイングを行うも
のとする。また前記リードフレーム１のデバイス
ピツチ及びボンデイング点２ａ，２ｂ，３ａ，４
ａの位置座標は予め図示しないマイクロコンピユ
ータに記憶されており、このマイクロコンピユー
タの指令により、XY駆動装置１６、即ちボンデ
イングヘツド１３はXY方向に、ボンデイングア
ーム１５、即ち工具１４は上下（Ｚ）方向にそれ
ぞれ移動される。 Next, the operation will be explained. For example, assume that bonding is performed for 10 devices as one unit. Also, the device pitch of the lead frame 1 and the bonding points 2a, 2b, 3a, 4
The position coordinates of point a are stored in advance in a microcomputer (not shown), and according to instructions from this microcomputer, the XY drive device 16, that is, the bonding head 13, moves in the XY direction, and the bonding arm 15, that is, the tool 14 moves in the vertical (Z) direction. will be moved respectively.
図示しない送り装置によつてリードフレーム１
が矢印Ａ方向に送られてリードフレーム１の第10
番目のペレツト２が検出器１９の下方の検出位置
Ｂに位置決めされると、その詳細は後記するが、
この最初の第10番目のデバイスのペレツト２上の
任意の基準の１点又は２点の映像が検出器１９に
よつて検出記憶され、その後記憶された映像に基
いて基準点に対する実際の検出点のずれ量がコン
ピユータで算出され、予めコンピユータに記憶さ
れたボンデイング点２ａ，２ｂ，３ａ，４ａが補
正されて記憶される。検出が終了すると、Ｘモー
タ１７が矢印Ｃ方向に１デバイス分駆動して第９
番目のペレツト２の上方に検出器１９が位置して
この第９番目のデバイスのボンデイング点が同様
に検出及び補正され、記憶される。本実施例にお
いては、工具１４と検出器１９とは２デバイス分
離れているので、まだこの状態においては第10番
目のペレツト２の上方には工具１４は位置してい
ない。次にＸモータ１７がＣ方向に１デバイス分
駆動して第８番目のペレツト２の上方に検出器１
９が位置すると、工具１４は第１０番目のペレツ
ト２の上方に位置し、先に検出記憶された第10番
目のペレツト２のボンデイング点２ａ，２ｂとリ
ード３，４のボンデイング点３ａ，４ａの検出信
号に従つてモータ１７，１８が駆動してボンデイ
ングヘツド１３が移動し、工具１４がボンデイン
グ点に導かれて第10番目のペレツト２のボンデイ
ング点２ａとリード３のボンデイング点３ａ及び
ペレツト２のボンデイング点２ｂとリード４のボ
ンデイング点４ａにワイヤ３を接続してボンデイ
ングを行う。このボンデイング時にボンデイング
ヘツド１３が停止している間に第８番目のデバイ
スのボンデイング点が前記と同様に検出及び補正
され、コンピユータに記憶される。以後、上記動
作を順次繰返して検出及びワイヤボンデイングを
行う。 The lead frame 1 is moved by a feeding device (not shown).
is sent in the direction of arrow A and the 10th
When the second pellet 2 is positioned at the detection position B below the detector 19, the details will be described later, but
An image of one or two arbitrary reference points on the pellet 2 of this first tenth device is detected and stored by the detector 19, and then an actual detection point with respect to the reference point is determined based on the stored image. The amount of deviation is calculated by a computer, and the bonding points 2a, 2b, 3a, 4a stored in advance in the computer are corrected and stored. When the detection is completed, the X motor 17 drives one device in the direction of arrow C to
A detector 19 is located above the ninth pellet 2 and the bonding point of this ninth device is similarly detected, corrected and stored. In this embodiment, the tool 14 and the detector 19 are separated by two devices, so the tool 14 is not yet located above the tenth pellet 2 in this state. Next, the X motor 17 drives one device in the C direction to place the detector 1 above the eighth pellet 2.
9, the tool 14 is positioned above the 10th pellet 2, and the bonding points 2a, 2b of the 10th pellet 2 and the bonding points 3a, 4a of the leads 3, 4 detected and stored previously are located. According to the detection signal, the motors 17 and 18 are driven to move the bonding head 13, and the tool 14 is guided to the bonding point to bond the bonding point 2a of the tenth pellet 2, the bonding point 3a of the lead 3, and the bonding point 3a of the pellet 2. Bonding is performed by connecting the wire 3 to the bonding point 2b and the bonding point 4a of the lead 4. During this bonding, while the bonding head 13 is stopped, the bonding point of the eighth device is detected and corrected in the same manner as described above, and is stored in the computer. Thereafter, the above operations are sequentially repeated to perform detection and wire bonding.
即ち、第４図に示すように、工程１、２におい
てはデバイス第10、第９番目について検出のみ行
う。工程３〜10においてはデバイス第８〜第１番
目について検出を行うと同時にデバイス第10〜第
３番目についてボンデイングを行う。工程11、12
においてはデバイス第２、第１番目についてボン
デイングを行う。 That is, as shown in FIG. 4, in steps 1 and 2, only the 10th and 9th devices are detected. In steps 3 to 10, detection is performed for the eighth to first devices, and at the same time bonding is performed for the tenth to third devices. Process 11, 12
In this step, bonding is performed for the second and first devices.
まず、１つのデバイスのボンデイング順序を第
５図によつて簡単に説明する。符号３０で示すタ
イミング状態は、ボンデイングヘツド１３がXY
駆動し、また工具１４が下降し、工具１４がボン
デイング点２ａのわずか上方に位置している。そ
して、３０と３１間はボンデイングヘツド１３が
停止し、この間に工具１４がボンデイング点２ａ
に圧着されワイヤ５がボンデイングされる。３１
と３２間に工具１４は上下動され、この間にボン
デイングヘツド１３がXY駆動されて工具１４は
ボンデイング点３ａのわずか上方に位置される。
そして３２と３３間はボンデイングヘツド１３が
停止し、この間に工具１４がボンデイング点２ｂ
に圧着されてワイヤ５がボンデイングされる。ボ
ンデイング終了後、ワイヤ５は公知の手段でボン
デイング点２ｂの付根より切断される。次にボン
デイング点２ｂと４ａに前記と同様にしてボンデ
イングされる。 First, the bonding order of one device will be briefly explained with reference to FIG. The timing state indicated by numeral 30 indicates that the bonding head 13 is
The tool 14 is moved down, and the tool 14 is located slightly above the bonding point 2a. Then, the bonding head 13 is stopped between 30 and 31, and the tool 14 is moved to the bonding point 2a during this period.
The wire 5 is bonded by pressure bonding. 31
The tool 14 is moved up and down between and 32, and during this time the bonding head 13 is driven in the XY direction so that the tool 14 is positioned slightly above the bonding point 3a.
Then, the bonding head 13 is stopped between 32 and 33, and during this time the tool 14 is moved to the bonding point 2b.
The wire 5 is bonded by crimping. After the bonding is completed, the wire 5 is cut from the base of the bonding point 2b by a known method. Next, bonding is performed at bonding points 2b and 4a in the same manner as described above.
前記１つのボンデイング工程は第４図に示すよ
うに、工程３〜12においてそれぞれ行われ、工程
１、２については第５図におけるボンデイングヘ
ツド１３のXY駆動のみで、工具１４の上下動は
行われない。 As shown in FIG. 4, the one bonding process is performed in steps 3 to 12, respectively, and in steps 1 and 2, only the XY drive of the bonding head 13 in FIG. 5 is performed, and the tool 14 is not moved up and down. do not have.
次にボンデイング点２ａ，２ｂ，３ａ，４ａの
補正方法について説明する。補正方法には、検出
点を１点設定し、この検出点のずれを検出してボ
ンデイング点を補正する１点検出方法と、検出点
を２点設定し、この検出点のずれを検出してボン
デイング点を補正する２点検出方法とがある。第
５図は１点検出方法のタイミングを、第６図は２
点検出方法のタイミングをそれぞれ示す。 Next, a method of correcting bonding points 2a, 2b, 3a, and 4a will be explained. There is a one-point detection method in which one detection point is set and the deviation of this detection point is detected to correct the bonding point, and the other is a one-point detection method in which two detection points are set and the deviation of this detection point is detected. There is a two-point detection method for correcting bonding points. Figure 5 shows the timing of the 1-point detection method, and Figure 6 shows the timing of the 2-point detection method.
The timing of each point detection method is shown.
まず、１点検出方法を第３図、第５図を参照し
て説明する。第３図に示すように、ペレツト２上
に検出用の規準検出点２Ａを設定し、この規準検
出点２Ａの座標を予めコンピユータに記憶させて
おく。この規準検出点２Ａの検出は、工具１４が
ボンデイング点２ａ上に位置し、ボンデイングヘ
ツド１３が停止している３０と３１間に基準検出
点２Ａの映像をメモリに記憶しておき、３１と３
４間に記憶した映像に基いて検出が行われる。工
具１４が例えば第10番目のボンデイング点２ａ上
に位置している時は検出器１９は第８番目のデバ
イスの規準検出点２Ａの上方に位置し、この検出
器１９によつて第８番目の規準検出点２Ａの実際
のずれ量が検出され、このずれ量によつて予めコ
ンピユータに記憶されているボンデイング点２
ａ，２ｂ，４ａ，４ｂが補正され、この補正され
たデータが第８番目のデバイスのボンデイング点
として記憶される。そして、工具１４が第８番目
のデバイスに位置した時はこの前記データに基い
てボンデイングされる。この検出及び補正は第４
図に示す工程１〜10についてそれぞれ行われる。 First, a method for detecting one point will be explained with reference to FIGS. 3 and 5. As shown in FIG. 3, a standard detection point 2A for detection is set on the pellet 2, and the coordinates of this standard detection point 2A are stored in the computer in advance. The detection of this reference detection point 2A is carried out by storing an image of the reference detection point 2A in a memory between 30 and 31 when the tool 14 is located above the bonding point 2a and the bonding head 13 is stopped.
Detection is performed based on the images stored during the four-hour period. When the tool 14 is located, for example, on the tenth bonding point 2a, the detector 19 is located above the reference detection point 2A of the eighth device, and this detector 19 detects the eighth bonding point 2a. The actual amount of deviation of the standard detection point 2A is detected, and the bonding point 2 stored in advance in the computer is determined based on this amount of deviation.
a, 2b, 4a, and 4b are corrected, and this corrected data is stored as the bonding point of the eighth device. Then, when the tool 14 is located at the eighth device, bonding is performed based on this data. This detection and correction is the fourth
Each of steps 1 to 10 shown in the figure is performed.
次に２点検出方法を第３図、第６図を参照して
説明する。第３図に示すように、ペレツト２上に
２つの検出用の規準検出点２Ａ，２Ｂを設定し、
この規準検出点２Ａ，２Ｂの座標を予めコンピユ
ータに記憶させておく。また第６図に示すよう
に、３３と３４間に工具１４が点２B′、即ち検
出器１９が規準検出点２Ｂの上方に位置するタイ
ミングを設定する。即ち、工具１４は３３と４０
間にボンデイングヘツド１３がXY駆動され２
B′点に移動し、この時検出器１９は工具１４の
位置より２デバイス先の規準検出点２Ｂの上方に
位置する。そして、４０と４１間はボンデイング
ヘツド１３が停止し、４１と３４間に再びボンデ
イングヘツド１３がXY駆動され工具１４はボン
デイング点２ｂの上方に位置する。そこで、３０
と３１間に検出器１９で基準検出点２Ａを、４０
と４１間に基準検出点２Ｂをそれぞれ記憶し、記
憶終了後記憶した映像に基いて検出する。そし
て、これら２つの検出点のずれ量で各ボンデイン
グ点２ａ，２ｂ，３ａ，４ａの補正をコンピユー
タにより行う。ここで、規準検出点２Ａ，２Ｂと
して、ボンデイング点２ａ，２ｂを検出するよう
にしてもよい。この場合は第４図のタイミングを
行わせ、３４と３５間にボンデイング点２ｂを検
出するようにすればよく、タイミングが簡素化さ
れる。 Next, a two-point detection method will be explained with reference to FIGS. 3 and 6. As shown in FIG. 3, two standard detection points 2A and 2B for detection are set on the pellet 2,
The coordinates of the reference detection points 2A and 2B are stored in the computer in advance. Further, as shown in FIG. 6, a timing is set between 33 and 34 when the tool 14 is located at point 2B', that is, the detector 19 is located above the reference detection point 2B. That is, the tool 14 has 33 and 40
In between, the bonding head 13 is driven in XY direction.
It moves to point B', and at this time the detector 19 is located above the reference detection point 2B, which is two devices ahead of the position of the tool 14. Then, the bonding head 13 is stopped between 40 and 41, and the bonding head 13 is again driven in the XY direction between 41 and 34, and the tool 14 is positioned above the bonding point 2b. Therefore, 30
and 31, the reference detection point 2A is set by the detector 19, and 40
A reference detection point 2B is stored between and 41, respectively, and after the storage is completed, detection is performed based on the stored video. Then, each bonding point 2a, 2b, 3a, 4a is corrected by a computer based on the amount of deviation between these two detection points. Here, the bonding points 2a and 2b may be detected as the reference detection points 2A and 2B. In this case, the timing shown in FIG. 4 may be used to detect the bonding point 2b between 34 and 35, thereby simplifying the timing.
このように次々に検出してはワイヤボンデイン
グを繰返し、10デバイスのワイヤボンデイングが
終了すると、10デバイス分だけリードフレーム１
をＡ方向に送る。また同時にＸモータ１７が駆動
してＡ方向と逆方向に12デバイス分（工具１４と
検出器１９とは２デバイス分離れているので、こ
の２デバイス分余分に移動させる）だけボンデイ
ングヘツド１３を移動させ、ボンデイングヘツド
１３をスタート位置に位置させる。これにより、
検出器１９は第20番目のペレツト２の上方に位置
する。そして前記した動作を繰返して第20番目か
ら第11番目のデバイスの検出及びワイヤボンデイ
ングを行う。以後順次前記動作を繰返して行う。 In this way, wire bonding is repeated by detecting one after another, and when wire bonding for 10 devices is completed, only 10 devices are connected to the lead frame.
Send in direction A. At the same time, the X motor 17 is driven to move the bonding head 13 by 12 devices in the direction opposite to the A direction (the tool 14 and the detector 19 are separated by 2 devices, so the bonding head 13 is moved by an additional 2 devices). and position the bonding head 13 at the starting position. This results in
The detector 19 is located above the 20th pellet 2. Then, the above-described operation is repeated to perform detection and wire bonding of the 20th to 11th devices. Thereafter, the above operations are repeated one after another.
ここで、トランジスタ、ダイオード、液晶表示
素子などのように各デバイスの間隔が狭いものに
おいては、例えば10デバイスで約50mm程度である
ので、Ｘモータ１７で駆動されるXY駆動装置１
６の親ねじと雌ネジの移動量は50mmの範囲です
む。 Here, in devices such as transistors, diodes, liquid crystal display elements, etc., where the distance between each device is narrow, for example, the distance between each device is about 50 mm for 10 devices, so the XY drive device 1 driven by the X motor 17
The amount of movement between the lead screw and female screw in No.6 is within 50mm.
このように、一度に複数デバイス分だけ検出と
ワイヤボンデイングを同時に行つて複数デバイス
分だけリードフレーム１を送るために、リードフ
レーム１の送り時間が非常に短縮される。例え
ば、10デバイスを一度に行うようにすると、送り
時間は約1/10ですみ、位置検出時間は2/10で済
む。またリードフレーム１は検出器１７で検出さ
れた状態の姿勢で工具１４が検出されたデバイス
部に移動してワイヤボンデイングが行われるの
で、ボンデイング精度も向上する。 In this way, since the detection and wire bonding are simultaneously performed for a plurality of devices at a time and the lead frame 1 is sent for a plurality of devices, the time required to feed the lead frame 1 is greatly shortened. For example, if 10 devices are processed at once, the sending time will be about 1/10 and the position detection time will be 2/10. Further, since wire bonding is performed by moving the lead frame 1 to the device portion where the tool 14 is detected in the attitude detected by the detector 17, bonding accuracy is also improved.
なお、上記実施例においては、工具１４と検出
器１９の間隔を２デバイス離したが、１デバイス
または３デバイス等の間隔離してもよい。 In the above embodiment, the tool 14 and the detector 19 are separated by two devices, but they may be separated by one device, three devices, or the like.
また上記実施例においては、検出器１９を工具
１４よりリードフレーム１の送り方向前方に配設
したが、リードフレーム１の送り方向手前に配設
してもよい。この場合は、ボンデイングヘツド１
３をリードフレーム１の送り方向と逆方向に送り
ながらデバイスを検出すると同時に検出されたデ
バイスについてボンデイングする動作を複数個の
デバイスについて行い、その後ワイヤボンデイン
グが終了した複数個のデバイス分だけリードフレ
ーム１及びボンデイングヘツド１３をリードフレ
ームの送り方向に送ることによつて行える。 Furthermore, in the embodiment described above, the detector 19 is disposed in front of the tool 14 in the feed direction of the lead frame 1, but it may be disposed in front of the lead frame 1 in the feed direction. In this case, bonding head 1
3 in the opposite direction to the feeding direction of the lead frame 1, detecting the devices, and simultaneously bonding the detected devices for a plurality of devices, and then moving the lead frame 1 for the number of devices for which wire bonding has been completed. This can be done by feeding the bonding head 13 in the direction in which the lead frame is fed.
以上の説明から明らかな如く、本発明になるワ
イヤボンデイングの方法によれば、ワイヤボンデ
イングと一定のピツチ離れたデバイスの位置検出
とを同時に行うことにより位置検出時間が短縮さ
れ、一度に複数のデバイス分だけ検出とワイヤボ
ンデイングを同時に行つた後に前記複数デバイス
分だけリードフレームを送るので、送り時間の短
縮が図れる。またリードフレームのリード及びペ
レツトが検出された状態でワイヤボンデイングを
行うので、リードフレームの位置ずれがなく精度
的にも向上が図れる。 As is clear from the above description, according to the wire bonding method of the present invention, the position detection time is shortened by simultaneously performing wire bonding and position detection of devices separated by a certain pitch, and multiple devices can be detected at the same time. Since the lead frames for the plurality of devices are sent after simultaneously performing the detection and wire bonding for the number of devices, the sending time can be shortened. Furthermore, since wire bonding is performed after the leads and pellets of the lead frame are detected, there is no positional shift of the lead frame, and accuracy can be improved.
第１図は本発明になるワイヤボンデイング方法
の一実施例を示す平面図、第２図は第１図の正面
図、第３図はデバイスの拡大平面図、第４図は検
出及びボンデイング工程の説明図、第５図は１点
検出補正時のタイミング図、第６図は２点検出補
正時のタイミング図である。
１……リードフレーム、２……ペレツト、３，
４……リード、５……ワイヤ、１０……ガイドレ
ール、１３……ボンデイングヘツド、１４……工
具、１５……ボンデイングアーム、１６……XY
駆動装置、１７……Ｘモータ、１８……Ｙモー
タ、１９……検出器。
Fig. 1 is a plan view showing an embodiment of the wire bonding method according to the present invention, Fig. 2 is a front view of Fig. 1, Fig. 3 is an enlarged plan view of the device, and Fig. 4 shows the detection and bonding process. The explanatory diagram, FIG. 5 is a timing diagram for one point detection correction, and FIG. 6 is a timing diagram for two point detection correction. 1...Lead frame, 2...Pellet, 3,
4... Lead, 5... Wire, 10... Guide rail, 13... Bonding head, 14... Tool, 15... Bonding arm, 16... XY
Drive device, 17...X motor, 18...Y motor, 19...detector.
Claims (1)
ス毎に貼付けられ、前記リードフレームのリード
と前記ペレツトとにワイヤが挿通された工具を導
いてワイヤボンデイングするワイヤボンデイング
方法において、検出器をペレツトのピツチまたは
整数倍のピツチを離れて前記工具と共にリードフ
レームの上方を移動可能に前記工具を保持するボ
ンデイングヘツドに配設し、前記ボンデイングヘ
ツドを一定方向に送りながら複数個のデバイス分
を順次前記検出器で少なくとも１点を検出し、予
めコンピユータに記憶された各ボンデイング点を
前記検出に基いて補正し、この検出と同時に検出
済のデバイスを前記補正されたデータに基いて前
記工具でワイヤボンデイングを行い、その後ワイ
ヤボンデイングが終了した複数個のデバイス分だ
け前記リードフレームを送り、また前記ボンデイ
ングヘツドをスタート位置に送ることを特徴とす
るワイヤボンデイング方法。1. In a wire bonding method in which pellets are attached to each device of a lead frame at equal intervals, and a tool with wires inserted through the leads of the lead frame and the pellets is guided for wire bonding, a detector is attached to the pitch of the pellets or an integer. The tool is disposed in a bonding head that holds the tool so as to be movable above the lead frame together with the tool after leaving the double pitch, and while the bonding head is being fed in a fixed direction, a plurality of devices are sequentially detected using at least one of the detectors. One point is detected, each bonding point stored in a computer in advance is corrected based on the detection, and at the same time as this detection, the detected device is wire bonded with the tool based on the corrected data, and then A wire bonding method characterized in that the lead frame is fed by the number of devices for which wire bonding has been completed, and the bonding head is fed to a starting position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57104351A JPS58220435A (en) | 1982-06-17 | 1982-06-17 | Wire bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57104351A JPS58220435A (en) | 1982-06-17 | 1982-06-17 | Wire bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58220435A JPS58220435A (en) | 1983-12-22 |
| JPH0141026B2 true JPH0141026B2 (en) | 1989-09-01 |
Family
ID=14378455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57104351A Granted JPS58220435A (en) | 1982-06-17 | 1982-06-17 | Wire bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58220435A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100616497B1 (en) * | 1999-12-30 | 2006-08-28 | 주식회사 하이닉스반도체 | Apparatus for wire bonding and method for bonding using the same |
-
1982
- 1982-06-17 JP JP57104351A patent/JPS58220435A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58220435A (en) | 1983-12-22 |
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