JP3980566B2 - Bonding method and bonding apparatus - Google Patents

Description

  The present invention relates to a pad (electrode) on a chip to be bonded in an assembling process of a semiconductor device, an external lead formed on a substrate to be bonded to which the chip is bonded, a lead frame, and the like. The present invention relates to a bonding method and a bonding apparatus for connecting a wire with a bonding wire or the like.

Conventionally, for parts to be bonded with a chip consisting of multiple LEDs, transistors, etc. on a lead frame or substrate, the amount of deviation of all the chips in the bonding area is detected first, and after the amount of deviation is detected, it is batched. Bond the pad and lead.

  However, since the detection of the chip displacement amount in the bonding process and the bonding between the pad and the lead are performed sequentially, the ratio of the detection time of the displacement amount in the bonding step increases, and the productivity of the bonding product is low. .

  For this reason, a bonding method is disclosed in which the detected device is wire-bonded based on the corrected data simultaneously with the detection of the shift amount (see, for example, Patent Document 1).

A conventional bonding method will be described with reference to the part to be bonded shown in FIG. FIG. 10A is a diagram showing the configuration of a part to be bonded composed of the chips 20 adhered to the substrate 30 in a matrix, and FIG. 10B is a detection of the deviation amount of the part to be bonded shown in FIG. It is a figure which shows a bonding process. In the conventional bonding method, when wire bonding is performed, it is performed according to the bonding position coordinates of the pads and leads set in advance by self-teach or the like. The detection of the chip shift amount is a sequence for detecting the nth chip after the chip to be bonded. For this reason, the detected chip displacement data corresponds to the chip n chips ahead of the currently bonded chip. Further, the order of detecting the chip deviation amount is the same as the order of bonding the chips.

  When the distance (CTD shown in FIG. 1) between the capillary 4a (shown in FIG. 1) and the camera 3 (shown in FIG. 1) is set at an interval of one chip in the X direction, the capillary 4a is shown in FIG. The camera 3 is positioned on the chip number c5. The bonding of the parts to be bonded shown in FIG. 10 (a) is mounted on the XY table 6 (shown in FIG. 1) because the chip detection order and the chip bonding order are the same as shown in FIG. 10 (b). The camera 3 and the capillary 4a as a bonding tool are moved from the chip number c4 to the chip number c5 indicated by the dotted line in FIG. 10A in the sequence 4 to 5, the sequence 8 to 9, and the sequence 12 to 13, and the chip number. It is necessary to perform the movements from c8 to chip number c9 and from chip number c12 to chip number c13. That is, since the substrate 30 moves from the lower end to the upper end and again moves from the upper end to the lower end, the movement is overlapped. As a result, the movement time of the XY table 6 becomes long, and there is a problem that the time required for the bonding process increases and the production number of parts to be bonded decreases.

  For this reason, Patent Document 2 discloses a wire bonding method that eliminates a loss time due to a return of a bonding head that occurs when a chip arranged in a plurality of rows is recognized by a recognition camera and wire bonded.

  In Patent Document 2, the first recognition camera and the second recognition camera are attached to the moving direction of the wire bonding head portion having the bonding tool, that is, the front and rear sides of the moving direction of the bonding tool, apart from the bonding tool. It has been.

  Of the first and second recognition cameras 1 on the right and left of the bonding tool, the first recognition camera on the right side simultaneously recognizes the semiconductor pellet (chip) and wire bonding in the first row direction (right direction). That is, when wire bonding of semiconductor pellets in the first row is performed by a bonding tool and an electric torch, the bonding position of the semiconductor pellets advanced from that is recognized by the first recognition camera. The data is stored in the memory of the apparatus, and wire bonding of the semiconductor pellet is performed using this data.

  Intermittently moves to the right while recognizing and wire-bonding the first row, and moves to the next row after being positioned at the right end. This time, the semiconductor pellet recognition and bonding tool and electric torch by the second recognition camera on the left side The next semiconductor pellet by wire bonding is intermittently moved to the left while simultaneously performing the wire bonding of the next semiconductor pellet, moved to the next third row after being positioned at the left end, the third row is processed in the same manner as the first first row, Repeat multiple rows as described above. As a result, bonding and position detection are simultaneously performed by a plurality of devices, and the bonding head moves by the shortest distance, thereby eliminating the loss time due to return and increasing the index.

JP 58-220435 A (page 6, FIG. 4) Japanese Patent Laid-Open No. 10-12656 (6th page, FIG. 5)

The conventional bonding method is intended for components to be bonded in which chips are bonded to a substrate or a lead frame at a predetermined pitch. Moreover, the chip | tips stuck are required to be the same thing. In Patent Document 2, the first recognition camera and the second recognition camera are mounted on the bonding head, and the recognition camera to be used is switched every time the row or column of the chip array changes during bonding. As a result, the return operation of the bonding head is eliminated, and loss of travel time can be eliminated. However, since it is necessary to mount two cameras on the bonding head, the camera switching control becomes complicated, and the weight of the bonding head increases, and vibration may occur when stopped, resulting in poor controllability. is there. Furthermore, the cost increases. Further, when the chip arrangement is not a predetermined pitch or when the chips are not the same, bonding cannot be performed.

  Therefore, the present invention controls the XY table, the bonding head, and the camera based on the sequence control table set in advance using one camera so that the capillaries of the camera and the bonding head move in a single stroke. An object of the present invention is to provide a bonding method and a bonding apparatus capable of bonding even when the chip arrangement is not a predetermined pitch or when the chips are not the same, and capable of improving the number of parts to be bonded. .

The bonding method according to the present invention includes a bonding unit that bonds to a component to be bonded, a positioning unit that moves the bonding unit relative to the component to be bonded two-dimensionally, and a positioning unit. A positioning method comprising: an imaging unit that images the mounted component to be bonded; and a detection unit that detects a deviation amount of a fixed point of the bonded component from image data from an imaging signal of the imaging unit, the positioning method A displacement control of a bonding component in order of movement of the bonding component to the bonding component, and a sequence control table that stores a bonding sequence. Based on data read from the sequence control table, the positioning device, the bonding device, The imaging means and Controls the serial detection means, and performing in parallel bonding simultaneously by displacement amount detection and the bonding means different the bonding parts are arranged at a predetermined pitch.

  Further, the bonding method according to the present invention is characterized in that the positioning means is controlled so that the imaging means and the bonding means move in a single stroke on the part to be bonded at the time of bonding amount detection and bonding. To do.

The bonding apparatus according to the present invention includes a bonding unit that performs bonding on a component to be bonded, a positioning unit that moves the bonding unit relative to the component to be bonded two-dimensionally, and a positioning unit. A bonding apparatus comprising: an imaging unit that images the mounted component to be bonded; and a detection unit that detects a deviation amount of a fixed point of the bonded component from image data from an imaging signal of the imaging unit, the positioning apparatus A displacement control of a bonding component in order of movement of the bonding component to the bonding component, and a sequence control table that stores a bonding sequence. Based on data read from the sequence control table, the positioning device, the bonding device, The imaging means and Controls the serial detection means, and performing in parallel bonding simultaneously by displacement amount detection and the bonding means different the bonding parts are arranged at a predetermined pitch.
Further, the bonding apparatus according to the present invention is characterized in that the positioning means is controlled so that the imaging means and the bonding means move in a single stroke on the part to be bonded at the time of bonding amount detection and bonding. And

  According to the bonding method and the bonding apparatus of the present invention, the camera and capillary are moved in a single stroke based on the sequence control table, thereby eliminating the unnecessary movement of the XY table and improving the number of parts to be bonded. Is possible.

Further, since the chips attached to the substrate and the lead frame do not have to be the same, bonding can be performed even if different chips are mixed.

Embodiments of a bonding method and a bonding apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing a configuration of a bonding apparatus according to the present invention, FIG. 2 is a diagram showing an example of a configuration of a chip adhered in a matrix on a substrate as a component to be bonded, and FIG. The figure which shows the bonding coordinate table and detection table of the board | substrate which consists of the chip | tip formed in the matrix form shown, FIG. 4 is a figure explaining the data preparation of a detection table, FIG. 5 was formed in the matrix form shown in FIG. It is a figure which shows the sequence control table of the board | substrate which consists of a chip | tip.

  As shown in FIG. 1, a bonding apparatus 1 includes a camera 3 as an imaging means, a bonding arm 4 with a capillary 4a attached to the tip, a bonding head 5 that drives the bonding arm 4 up and down, a bonding arm 4 and An XY table 6 as a positioning means for mounting and positioning a bonding means and an imaging means comprising a bonding head 5 in a two-dimensional manner in the X and Y directions, and a bonding stage 8 on which a bonding operation is performed by the bonding head 5. The bonding stage 8 includes a heater (not shown) that heats a substrate, a lead frame, and the like on which a plurality of chips are arranged and bonded in the longitudinal direction.

  As shown in FIG. 1, the bonding apparatus 1 includes an image detection apparatus 10 serving as a detection unit that receives an imaging signal from the camera 3 and detects a fixed point deviation amount of a part to be bonded from image data, and an image detection apparatus. A monitor 11 that receives a video output from 10, a control device 12 having a microprocessor 12 a and a memory 12 b, a manipulator 15 that outputs a signal for manually moving the XY table 6 to the control device 12, and a control device A driving device 13 is provided that issues a driving signal to the bonding head 5 and the XY table 6 in response to a command signal from 12. A memory (not shown) built in the image detection apparatus 10 stores a reference pattern used for detecting a deviation amount. The image detection apparatus 10 performs matching between the image data from the camera 3 and the reference pattern. Thus, the position that most closely matches the reference pattern on the image data is detected, and the amount of deviation from the fixed point is detected. The memory 12b of the control device 12 stores a program for the microprocessor 12a for controlling the bonding device 1, a sequence control table, a detection table, and a position coordinate table which will be described later.

  As shown in FIG. 1, the camera 3 mounted on the bonding head 5 is attached at a position away from the capillary 4a. The distance from the center of the optical axis of the optical system of the camera 3 to the axis of the bonding tool 4a is referred to as camera tool offset (hereinafter referred to as CTD). Usually, the CTD is set to be an integral multiple of the chip interval on the lead frame in the same direction as the transport direction of the transport device 7 or in the direction perpendicular to the transport direction of the transport device 7. Note that the CTD in this embodiment is set so that the camera 3 and the bonding tool 4a have a pitch of one chip interval in the X direction.

Next, a description will be given of a position coordinate table, a detection table, and a sequence control table that store control information and data necessary for bonding the parts to be bonded. Each data of the position coordinate table, the detection table, the sequence control table, etc. is set and stored in the memory 12b of the control device 12 before bonding. In the following, description will be made by using as an example a component to be bonded which is composed of chips attached in a matrix to the substrate shown in FIG. FIG. 2 shows a substrate 30 composed of chips 20 attached in a matrix of 4 rows and 4 columns. As shown in FIG. 2, the chips 20 attached to the substrate 30 are assigned chip numbers (No) c1, c2, c3, and c4 from the upper right chip 20 in order downward, and the lower end of the next row. The chip numbers are c5, c6, c7, and c8 upward from the chip 20 of FIG. The chip number at the upper left is c16. In the first row, the third row, the second row, and the fourth row on the right side of the chip arrangement shown in FIG. 2, the same chip is attached , and the substrate is formed of two types of chips 20. The chip number indicates the bonding order of the chip 20 and is used as a pointer for reading out necessary data by the microprocessor 12a of the control device 12 when detecting the amount of bonding and chip 20 deviation.

  FIG. 3A shows a position coordinate table in which the first bonding position coordinates and the second bonding position coordinates are stored in the bonding order. As shown in FIG. 3A, the position coordinate table includes data of first bonding position coordinates and second bonding position coordinates corresponding to the bonding order. The position coordinates (X, Y) of the chip number c1 are stored as the first bonding position coordinates of the bonding order 1, and the position coordinates (X, Y) of the lead connected to the chip number c1 are stored as the second bonding position coordinates. It is remembered. Similarly, data of the first bonding position coordinates and the second bonding position coordinates up to the bonding order 16 are stored. The position coordinate table is used to determine the bonding order, and is created so that the XY table as the positioning means moves in a single stroke during the detection of the deviation amount and the bonding. That is, in the substrate 30 shown in FIG. 2, it moves from the chip number c1 to c2, c3, c4 in the direction of the arrow shown in FIG. 2, and moves from c4 to c5, thereby eliminating the overlapping movement, Move to the next column with the shortest distance.

  The position coordinate table is created by converting the bonding position calculated from the design data of the substrate 30 and the chip 20 into coordinate data and storing it in the memory 12b with an input device or the like, or the manipulator 15 and the monitor 11 of the bonding apparatus 1. The bonding position may be input by teaching.

  FIG. 3B shows a detection table in which the chip number (No) and the reference pattern number (No) used for detecting the deviation amount are stored. The detection table shows the order of detection of the shift amount of the chip 20 for performing bonding in the bonding order of the position coordinate table shown in FIG. The chip No. and the reference pattern No. shown in FIG. 3B are arranged in the order of detecting the shift amount. The detection table is created by sequentially storing the chip numbers displayed on the camera 3 when the capillary 4a is positioned on the chip in the bonding order. Note that the chip 20 displayed on the camera 3 when the capillary 4a is positioned on the chip 20 is obtained from the bonding position coordinates closest to the addition result value by adding CDT to the bonding position coordinates of the chip 20.

  In the part to be bonded shown in FIG. 2, since the chip c8 is displayed on the camera 3 when the capillary is positioned on the chip c1, the order of detecting the deviation amount from the chip c1 to the chip c4 is undetermined. For this reason, as shown in FIG. 4, assuming the virtual chip rows c0 to c-3, the chip 20 displayed on the camera 3 when the capillary 4a is first positioned on the virtual chip c-3 is determined. . At this time, the chip 20 projected on the camera 3 is c4. Hereinafter, the chip that moves in the direction indicated by the dotted arrow shown in FIG. 4 and detects the amount of deviation when the capillary 4a is positioned at c-2, c-1, and c0 is determined. Note that the chips for detecting the shift amount when the capillary 4a is positioned at c-2, c-1, and c0 are c3, c2, and c1, respectively.

Further, in the detection table shown in FIG. 3B, the reference pattern No. used at the time of deviation detection is stored corresponding to the chip number. The reference pattern is moved forward by moving the camera 3 onto the chip 20 by the manipulator 15 during teaching so that the fixed point of the chip 20 is located at the intersection of the cross lines 11a (shown in FIG. 1) on the monitor 11. A predetermined area of the camera image is stored as a reference pattern. When a plurality of different chips 20 are stuck on the substrate 30, a reference pattern is set for each type of chip 20. Since two types of chips are stuck on the substrate 30 shown in FIG. 2, 1 and 2 are assigned to the reference pattern No.

Next, a sequence control table storing control information and various data used during bonding will be described with reference to FIG. FIG. 5 is a diagram showing a sequence control table storing control data for bonding the substrate 30 composed of the chips 20 attached in the matrix form shown in FIG. As shown in FIG. 5, the sequence control table includes, for each sequence number, presence / absence of deviation amount detection operation (ON-OFF), presence / absence of bonding (ON-OFF), chip number that is a deviation amount detection target, and bonding target. Is a chip number or lead stored. The sequence number in the sequence control table indicates the order of the displacement detection and bonding operation sequence in the order of movement of the XY table 6 to the part to be bonded, and the microprocessor 12a calls each data in the order of the sequence number to control the bonding apparatus 1. To do. The presence / absence of the deviation amount detection operation (ON-OFF) is used when the deviation amount is detected. ON is specified. The presence / absence of bonding (ON-OFF) is performed when ON. The column of the deviation amount detection target indicates a chip number for detecting the deviation amount when the deviation amount detection operation is ON. The column for bonding shows the chip number or lead to be bonded when bonding is ON. For example, in sequence 1, only chip shift amount detection is performed, and the shift amount detection chip at this time is c4. In sequence 5, chip displacement detection and bonding are performed. At this time, the displacement detection chip is c8, and the chip to be bonded is c1. The shift amount detection and bonding operations are performed in the order of sequence numbers.

  When the shift amount detection operation of the sequence control table is ON, the reference pattern used when detecting the shift amount of the chip 20 is searched from the detection table using the chip number as an index, and from the matching chip number from the column of the reference pattern No. The reference pattern No is read out. Furthermore, when only the deviation amount is detected by the sequence number, that is, when bonding is not performed, in order to move the XY table onto the target chip, the bonding coordinate table is searched using the chip number as an index, and the bonding position is determined from the matching chip number. The coordinate data is read out. When bonding is performed, the bonding position coordinate data is read from the matching chip number or lead by searching the bonding coordinate table using the chip number or chip lead in the bonding target column as an index.

  Next, the deviation amount detection operation and the bonding sequence control will be described with reference to the flowcharts shown in FIGS. The shift amount detection operation and the bonding sequence control are performed by the microprocessor 12a built in the control device 12 executing a program stored in the memory 12b. As shown in FIG. 6, first, the sequence counter A for specifying the sequence number of the sequence control table is initialized (step S1). For initialization of the sequence counter, 1 is written to the address A of the memory. The sequence number of the sequence control table is designated by the sequence counter A (step S2). The sequence number of the sequence control table that matches the numerical data stored in the sequence counter A is searched. The sequence number deviation amount detection operation coincident with the sequence counter A and the bonding ON-OFF data are read (step S3), and the following determination is performed. In the determination, first, it is checked whether the deviation detection operation is “ON” and the bonding is “OFF” (step S4). When the deviation amount detection operation is “ON” and the bonding is “OFF”, the process proceeds to step S10 shown in FIG. If the check result is No, it is checked whether the deviation detection operation is “ON” and bonding is “ON” (step S5). When the deviation amount detection operation is “ON” and the bonding is “ON”, the process proceeds to step S20 shown in FIG. If the check result is No, it is checked whether the deviation detection operation is “OFF” and bonding is “ON” (step S6). When the deviation amount detection operation is “OFF” and the bonding is “ON”, the process proceeds to step S30 shown in FIG. When the check result is No, since the deviation amount detection operation is “OFF and bonding is“ OFF ”(step S7), the reading of the sequence control table is completed, and the sequence shifts to the end operation.

  Next, the operation when the shift amount detection operation shown in step S10 and subsequent steps is “ON” and bonding is “OFF” will be described with reference to FIG. When the shift amount detection operation of the sequence control table is “ON” and the bonding is “OFF”, the bonding apparatus only detects the shift amount and does not perform bonding (step S10). First, the reference pattern No corresponding to the chip number is read from the detection table shown in FIG. 3B (step S11). By reading the reference pattern No., the reference pattern to be used when detecting the deviation amount is determined.

  Next, the bonding position coordinate data corresponding to the chip number is read from the bonding coordinate table shown in FIG. 3A (step S12), and the XY table is moved to the bonding position (step S13). After the XY table is moved, the camera is positioned on the chip set in the sequence control table. A chip image is acquired by the camera, and matching with a reference pattern specified in step S11 is performed to detect a chip shift amount (step S14). The detected deviation amount is stored at a predetermined address in the memory corresponding to the chip number (step S15). After storing the deviation amount, the process proceeds to step S8 shown in FIG. In step S8, the data of the sequence counter is incremented, and the process returns to step S2 to read the data of the next sequential number.

  Next, the operation when the deviation detection operation shown in step S20 and subsequent steps is “ON” and bonding is “ON” will be described. When the deviation amount detection operation of the sequence control table is “ON” and the bonding is “ON”, the bonding apparatus 1 performs the deviation amount detection operation and the bonding simultaneously (step S20).

  First, the reference pattern No corresponding to the chip number is read from the detection table shown in FIG. 3B (step S21). By reading the reference pattern No., the reference pattern to be used when detecting the deviation amount is determined.

  Next, the bonding position coordinate data corresponding to the bonding target is read from the bonding coordinate table shown in FIG. 3A (step S22), and the XY table is moved to the bonding position (step S23). After the XY table is moved, bonding is performed (step S24). The camera is positioned on the chip for detecting the amount of deviation set in the sequence control table. The chip image is acquired by the camera and matched with the reference pattern specified in step S21 to determine the amount of chip deviation. Detect (step S25). The detected shift amount is stored at a predetermined address in the memory corresponding to the chip number (step S26). After storing the deviation amount, the process proceeds to step S8 shown in FIG.

  Next, the operation when the deviation detection operation shown in step S30 and subsequent steps is “OFF” and bonding is “ON” will be described. When the shift amount detection operation of the sequence control table is “OFF” and bonding is “ON”, the bonding apparatus 1 performs only bonding (step S30). The bonding position coordinate data corresponding to the bonding target is read from the bonding coordinate table shown in FIG. 3A (step S31), and the XY table is moved to the bonding position (step S32). After the XY table is moved, bonding is performed (step S33). After the bonding is completed, the process proceeds to step S8 shown in FIG.

As described above, the bonding apparatus can perform the operation based on the ON / OFF data indicating the deviation amount detection operation and the presence / absence of bonding by sequentially specifying the sequence numbers in the sequence control table. Conventionally, only one chip stuck on a substrate or a lead frame was able to detect the amount of deviation and bonding, but the bonding apparatus of the present invention is not limited to the same chip, Even with chips having different patterns, chips of different types, or a mixture thereof, deviation amount detection and bonding can be performed.

8, shift amount detection substrate was stuck to the chip shown in FIG. 2 in a matrix form, showing the bonding order of the sequence numbers. As shown in FIG. 8, in sequence 1 to 4, the amount of deviation is detected in the order of chip numbers c4, c3, c2, and c1, and in sequence 5, the amount of deviation of chip number c8 is detected during bonding of chip number c1. Thereafter, the chip displacement amount detection and bonding are performed simultaneously up to the sequence 28, and the remaining chip numbers c13, c14, c15, c16 and the respective leads are bonded from the sequence 29. As a result, the XY table 6 can be moved in a single stroke as indicated by the arrow line shown in FIG. 2, so that the time required for the bonding process can be shortened and the number of parts to be bonded can be increased. it can.

In the above-described bonding method and bonding apparatus, the case where the distance (CTD) between the capillary and the camera is set at an interval of one chip in the X direction has been described. However, the chip attached to the lead frame, the substrate, or the like. The present invention can also be applied when the CTD is set to an integral multiple of the interval.

  Further, in the bonding method and bonding apparatus according to the present invention, applicable chips are not limited to LEDs and transistors, but may be ICs having a small chip size, for example.

Next, bonding in a group composed of a plurality of parts to be bonded that are attached to a substrate or the like and arranged at a predetermined pitch, and bonding in a plurality of groups arranged at a predetermined pitch will be described. FIG. 9 is a diagram showing an example of a substrate composed of a group composed of a plurality of parts to be bonded arranged at a predetermined pitch and a plurality of groups arranged at a predetermined pitch.

As shown in FIG. 9, chips arranged at a predetermined pitch are attached within a region surrounded by a dotted line. The substrate shown in FIG. 9 has three groups (G1, G2, G3). Each group is adhered on the substrate at a predetermined pitch Pg shown in FIG.

  In order to bond the substrate shown in FIG. 9, the distance (CTD) between the camera 3 of the bonding imaging means and the capillary 4a of the bonding means is set to be the pitch (Pg) between groups.

  Bonding is performed by first detecting the shift amount of the group G1, and after detecting the shift amount of the group G1, the bonding of the group G1 and the shift amount of the group G2 are simultaneously detected, and then the bonding of the group G2 and the shift of the group G3. The amount detection is performed simultaneously, and finally the bonding of the group G3 is performed.

As described above, in the conventional bonding apparatus, the chips as the parts to be bonded are required to be adhered to the substrate or the like at a predetermined pitch, but the bonding method and bonding according to the present invention By using the apparatus, it is possible to bond even to a part to be bonded composed of a plurality of groups arranged at a predetermined pitch.

It is a block diagram which shows the structure of a bonding apparatus. It is a figure which shows the structure of the chip | tip stuck on the board | substrate as a to-be-bonded component in the matrix form. (A) is a figure which shows the bonding coordinate table of the board | substrate which consists of a chip | tip formed in the matrix form shown in FIG. 2, (b) is a figure which shows a detection table. It is a figure explaining the data creation of a detection table. It is a figure which shows the sequence control table of the board | substrate which consists of the chip | tip formed in the matrix form shown in FIG. It is a flowchart which shows sequence control of deviation | shift amount detection operation and bonding. It is a flowchart which shows sequence control of deviation | shift amount detection operation and bonding. It is the figure which showed the deviation | shift amount detection operation | movement of the board | substrate which stuck the chip | tip shown in FIG. It is a figure which shows an example of the board | substrate which consists of the group which consists of several to-be-bonded parts arranged with a predetermined pitch, and the several group arranged with the predetermined pitch. (A) is a block diagram of the component to be bonded which consists of the chip | tip stuck on the board | substrate on the board | substrate, (b) is a figure which shows the deviation | shift amount detection and bonding process of the component to be bonded shown to (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Bonding apparatus 3 Camera 4 Bonding arm 4a Capillary 5 Bonding head 6 XY table 7 Conveyance apparatus 8 Bonding stage 10 Image detection apparatus 11 Monitor 11a Cross line 11b Window 12 Control apparatus 12a Microprocessor 12b Memory 13 Drive apparatus 15 Manipulator 20 Chip 30 Lead frame (substrate)

Claims (4)

Bonding means for bonding to a part to be bonded, positioning means for positioning by bonding the bonding means relative to the part to be bonded two-dimensionally, and the part to be bonded mounted on the positioning means A bonding method comprising: an image pickup means for picking up an image; and a detection means for detecting a shift amount of a fixed point of the part to be bonded from image data from an image pickup signal of the image pickup means,
It has a sequence control table in which a displacement amount detection of bonding parts and a bonding sequence are stored in order of movement of the positioning means to the bonding parts, and based on data read from the sequence control table, the positioning means and the bonding A bonding method characterized in that, by controlling the image pickup means and the detection means, the displacement amount detection of different parts to be bonded arranged at a predetermined pitch and the bonding by the bonding means are simultaneously performed in parallel. 2. The bonding method according to claim 1, wherein the imaging means and the bonding means control the positioning means so as to move in a single stroke on the part to be bonded at the time of bonding amount detection and bonding. . Bonding means for bonding to a part to be bonded, positioning means for positioning by bonding the bonding means relative to the part to be bonded two-dimensionally, and the part to be bonded mounted on the positioning means A bonding apparatus comprising: an image pickup means for picking up images; and a detection means for detecting a fixed point deviation amount of the part to be bonded from image data from an image pickup signal of the image pickup means,
It has a sequence control table in which a displacement amount detection of bonding parts and a bonding sequence are stored in order of movement of the positioning means to the bonding parts, and based on data read from the sequence control table, the positioning means and the bonding A bonding apparatus characterized in that, by controlling the image pickup means and the detection means, the deviation amounts of different parts to be bonded arranged at a predetermined pitch and the bonding by the bonding means are simultaneously performed in parallel. 4. The bonding apparatus according to claim 3 , wherein the imaging means and the bonding means control the positioning means so as to move in a single stroke on the part to be bonded at the time of bonding amount detection and bonding. .

Images