JPH0135490B2 - - Google Patents
Info
- Publication number
- JPH0135490B2 JPH0135490B2 JP11728982A JP11728982A JPH0135490B2 JP H0135490 B2 JPH0135490 B2 JP H0135490B2 JP 11728982 A JP11728982 A JP 11728982A JP 11728982 A JP11728982 A JP 11728982A JP H0135490 B2 JPH0135490 B2 JP H0135490B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- laminate
- manufacturing
- glass frit
- multilayer ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- 239000003985 ceramic capacitor Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 4
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 239000011230 binding agent Substances 0.000 description 4
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- WEUCVIBPSSMHJG-UHFFFAOYSA-N calcium titanate Chemical compound [O-2].[O-2].[O-2].[Ca+2].[Ti+4] WEUCVIBPSSMHJG-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
本発明はガラスフリツトを積層体表面に付着し
熱処理することによりガラス層を形成させ、さら
にガラス成分の全部を積層体内部に拡散させたこ
とを特徴とする積層セラミツクコンデンサの製造
方法に関する。
従来より小型大容量化を目的としてセラミツク
薄膜誘電体の並列配線構造を有する積層セラミツ
クコンデンサはよく知られている。この積層セラ
ミツクコンデンサの製造方法は一般的には次の通
りである。まず、チタン酸バリウム、チタン酸カ
ルシウム、チタン酸マグネシウムなどの酸化物に
数種の添加物を加え、混合した後、有機バインダ
を加えて粘性の高いスラリーとし、これをドクタ
ーブレード法、パイプドクター法などの一般的な
シート成型方法により、30〜100μｍのシートを
作製する。この後、シート上にパラジウムまたは
銀とパラジウムの合金粉末を有機バインダ中に分
散させたペーストをスクリーン印刷法により印刷
し、その上にシートを積み重ねて印刷をする。こ
れをくり返しながら２〜40層の積層体を作製す
る。この積層体を適当な大きさに切断し、電気炉
にて1200〜1400℃で焼成すると焼結体のチツプが
得られる。このチツプの端面に端子電極として、
銀とパラジウム合金または銀の粉末よりなるペー
ストを付着し、700〜900℃で焼付けることによ
り、積層セラミツクコンデンサが得られる。
このような積層セラミツクコンデンサは、プリ
ント配線基板に直に半田付けされて用いられるこ
とがほとんどである。プリント配線基板はエポキ
シ樹脂からなり、使用中にたわみを生じることが
どうしても起りがちであるため、半田付けされた
積層セラミツクコンデンサの端子には10Kg以上の
引張り応力が作用することがしばしばあり、この
応力に耐えきれず、端子電極がはずれたり、素体
自身にクラツクを生じ、特性上に支障をきたすこ
とがあつた。
本発明は上記のような事実にかんがみ、実験を
重ねた結果、端子電極の接着強度及び素子強度の
改善を同時にはかり得たものである。以下、実施
例に基づき詳細に本発明の内容を説明する。
（実施例）
チタン酸バリウム（BaTiO3）100重量部に対
し、チタン酸カルシウム（CaTiO3）、酸化ニオ
ブ（Nb2O5）を共に３重量部、さらに二酸化マン
ガン（MnO2）を0.2重量部添加して十分に混合す
る。この後、有機バインダーにてスラリー化し、
ブレード工法により80μｍの厚みのシートを作製
する。このシートにパラジウムペーストをスクリ
ーン印刷し、その上にシートを重ねて印刷をくり
返し、積層する。この積層体を切断し、1300〜
1350℃にて焼成した。この焼結体チツプの形状
は、1.5mm（幅）×3.0mm（長さ）×0.55mm（厚さ）
である。
このような焼結体チツプの表面に酸化ホウ素２
重量部、酸化ケイ素５重量部、酸化鉛１重量部よ
りなるガラスフリツトを有機バインダーに分散さ
せ、焼結体チツプの重量の0.1〜１重量部％とな
るように付着させた。このものを白金線で作製し
た〓の上にのせ、800〜850℃で熱処理した。
このようにして得られたチツプの端子に銀電極
を設けた。ただし、銀電極用銀ペースト中に上記
ガラスフリツトを２〜３％混合したものを用い
た。
図は本発明の製造方法により得られた積層セラ
ミツクコンデンサを示す図であり、１はセラミツ
ク誘電体、２はパラジウム電極、３はガラス層、
４は銀端子電極である。また、下記の表は従来の
製造方法、すなわちガラスフリツトを焼結体チツ
プの表面に付着、拡散させない方法で作製した場
合と本発明の製造方法に基づく場合の積層セラミ
ツクコンデンサの端子電極引張り強度及び抗折強
度及び電気特性の比較を示したものである。
The present invention relates to a method for manufacturing a laminated ceramic capacitor, characterized in that a glass layer is formed by adhering glass frit to the surface of a laminate and heat-treating it, and furthermore, all of the glass components are diffused into the laminate. 2. Description of the Related Art Multilayer ceramic capacitors having a parallel wiring structure of ceramic thin film dielectrics have been well known for the purpose of achieving smaller size and larger capacity. The method for manufacturing this multilayer ceramic capacitor is generally as follows. First, several additives are added to oxides such as barium titanate, calcium titanate, and magnesium titanate, and after mixing, an organic binder is added to form a highly viscous slurry, which is processed using the doctor blade method and pipe doctor method. A sheet of 30 to 100 μm is produced using a general sheet molding method such as. Thereafter, a paste in which palladium or silver/palladium alloy powder is dispersed in an organic binder is printed on the sheet by screen printing, and the sheets are stacked on top of the paste for printing. By repeating this process, a laminate of 2 to 40 layers is produced. This laminate is cut into a suitable size and fired in an electric furnace at 1200 to 1400°C to obtain sintered chips. As a terminal electrode on the end face of this chip,
A laminated ceramic capacitor is obtained by attaching a paste made of silver and palladium alloy or silver powder and baking at 700 to 900°C. In most cases, such multilayer ceramic capacitors are used by being directly soldered to a printed wiring board. Printed wiring boards are made of epoxy resin and tend to bend during use, so tensile stress of 10 kg or more is often applied to the terminals of soldered multilayer ceramic capacitors, and this stress The terminal electrodes could come off and the element itself could crack, causing problems with its characteristics. In view of the above-mentioned facts, the present invention has been made through repeated experiments, and as a result, it has been possible to simultaneously improve the adhesive strength of terminal electrodes and the element strength. Hereinafter, the content of the present invention will be explained in detail based on Examples. (Example) For 100 parts by weight of barium titanate (BaTiO 3 ), 3 parts by weight of both calcium titanate (CaTiO 3 ) and niobium oxide (Nb 2 O 5 ), and 0.2 parts by weight of manganese dioxide (MnO 2 ). Add and mix thoroughly. After this, it is slurried with an organic binder,
A sheet with a thickness of 80 μm is produced using the blade method. Palladium paste is screen-printed on this sheet, and the sheet is stacked on top of it and the printing is repeated to laminate the sheets. Cut this laminate, 1300 ~
It was fired at 1350℃. The shape of this sintered chip is 1.5mm (width) x 3.0mm (length) x 0.55mm (thickness)
It is. Boron oxide 2 is deposited on the surface of such a sintered chip.
A glass frit consisting of 1 part by weight, 5 parts by weight of silicon oxide, and 1 part by weight of lead oxide was dispersed in an organic binder and attached to the sintered chip in an amount of 0.1 to 1 part by weight based on the weight of the sintered chips. This product was placed on a plate made of platinum wire and heat-treated at 800 to 850°C. Silver electrodes were provided on the terminals of the chip thus obtained. However, a mixture of 2 to 3% of the above glass frit in a silver paste for silver electrodes was used. The figure shows a multilayer ceramic capacitor obtained by the manufacturing method of the present invention, in which 1 is a ceramic dielectric, 2 is a palladium electrode, 3 is a glass layer,
4 is a silver terminal electrode. The table below also shows the tensile strength and resistance of terminal electrodes of multilayer ceramic capacitors manufactured using the conventional manufacturing method, that is, a method in which glass frit is not attached or diffused on the surface of the sintered chip, and when manufactured using the manufacturing method of the present invention. This figure shows a comparison of bending strength and electrical properties.
【表】
〓 ＊ 下限値〓
〓 〓
〓＊＊ 平均値〓
この表から明らかなように本発明の製造方法に
より得られる積層セラミツクコンデンサの強度が
著しく向上することが認められる。尚、コンデン
サの電気的特性については静電容量が若干小さい
こと以外は何ら異常は認められなかつた。そし
て、このような効果が得られるのはセラミツク特
有の気孔をガラスで満たすからであると考えられ
る。
以上述べたように、本発明の製造方法にかかる
積層セラミツクコンデンサの機械的強度は極めて
優れており、プリント基板に直に半田付けされて
も基板のたわみに対して端子電極がはずれたり、
素子にクラツクが入ることを防止する上で極めて
有効であり、その意義は大きい。
尚、実施例ではガラスフリツトとしてホウ素、
ケイ素、鉛の酸化物を用いたが、これにさらに亜
鉛やアルミニウムの酸化物またはフツ化物を含む
ものでもよく、またホウ素、ケイ素及びビスマス
を主体とするガラスフリツトを用いることも可能
である。さらに、実施例ではチタン酸バリウム、
チタン酸カルシウム、酸化ニオブ、二酸化マンガ
ンよりなるセラミツク誘電体を用いたが、セラミ
ツク誘電体であるならばいかなる組成にも適用し
うることは言うまでもない。
また、実施例では端子電極として銀を用いた
が、銀とパラジウムの合金でもよい。[Table] 〓 * Lower limit value〓
〓 〓
〓＊＊ Average value〓
As is clear from this table, it is recognized that the strength of the multilayer ceramic capacitor obtained by the manufacturing method of the present invention is significantly improved. Regarding the electrical characteristics of the capacitor, no abnormality was observed except that the capacitance was slightly small. It is believed that this effect is achieved because the pores unique to ceramic are filled with glass. As described above, the mechanical strength of the multilayer ceramic capacitor according to the manufacturing method of the present invention is extremely excellent, and even when soldered directly to a printed circuit board, the terminal electrodes will not come off due to the deflection of the board.
It is extremely effective in preventing cracks from entering the device, and its significance is great. In addition, in the examples, boron,
Although oxides of silicon and lead are used, oxides or fluorides of zinc and aluminum may also be included, and a glass frit mainly containing boron, silicon, and bismuth can also be used. Furthermore, in the examples, barium titanate,
Although a ceramic dielectric consisting of calcium titanate, niobium oxide, and manganese dioxide was used, it goes without saying that any composition of ceramic dielectric can be applied. Further, although silver was used as the terminal electrode in the embodiment, an alloy of silver and palladium may be used.
図は本発明の製造方法に基づく積層セラミツク
コンデンサを示す図である。
１……セラミツク誘電体、２……パラジウム電
極、３……ガラス層、４……銀端子電極。
The figure shows a multilayer ceramic capacitor based on the manufacturing method of the present invention. 1... Ceramic dielectric, 2... Palladium electrode, 3... Glass layer, 4... Silver terminal electrode.
Claims (1)
積層されてなる積層体の表面全体にガラスフリツ
トを付着させて後、熱処理することにより、上記
積層体内部に上記ガラス成分の全部を熱拡散させ
た後、積層体の端部に、ガラスフリツトを含む銀
または銀とパラジウムの合金からなるペーストを
付着し、焼付けして端子電極を形成することを特
徴とする積層セラミツクコンデンサの製造方法。1. After adhering glass frit to the entire surface of a laminate in which ceramic dielectric layers and metal electrode layers are alternately laminated, all of the glass components are thermally diffused into the interior of the laminate by heat treatment. 1. A method for manufacturing a multilayer ceramic capacitor, which comprises: adhering a paste made of silver or an alloy of silver and palladium containing glass frit to the end of the multilayer body and baking it to form a terminal electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11728982A JPS598323A (en) | 1982-07-05 | 1982-07-05 | Method of producing laminated ceramic condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11728982A JPS598323A (en) | 1982-07-05 | 1982-07-05 | Method of producing laminated ceramic condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS598323A JPS598323A (en) | 1984-01-17 |
| JPH0135490B2 true JPH0135490B2 (en) | 1989-07-25 |
Family
ID=14708057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11728982A Granted JPS598323A (en) | 1982-07-05 | 1982-07-05 | Method of producing laminated ceramic condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS598323A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04267320A (en) * | 1991-02-21 | 1992-09-22 | Tokin Corp | Layered ceramic capacitor production method |
| JPH1167574A (en) * | 1997-08-26 | 1999-03-09 | Taiyo Yuden Co Ltd | Ceramic electronic component and its manufacturing |
| JP3636075B2 (en) | 2001-01-18 | 2005-04-06 | 株式会社村田製作所 | Multilayer PTC thermistor |
-
1982
- 1982-07-05 JP JP11728982A patent/JPS598323A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS598323A (en) | 1984-01-17 |
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