JPH0134758B2 - - Google Patents
Info
- Publication number
- JPH0134758B2 JPH0134758B2 JP55134403A JP13440380A JPH0134758B2 JP H0134758 B2 JPH0134758 B2 JP H0134758B2 JP 55134403 A JP55134403 A JP 55134403A JP 13440380 A JP13440380 A JP 13440380A JP H0134758 B2 JPH0134758 B2 JP H0134758B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- workpiece
- feed rate
- cut
- feed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Drying Of Semiconductors (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13440380A JPS5759706A (en) | 1980-09-29 | 1980-09-29 | Method of cutting hard and brittle member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13440380A JPS5759706A (en) | 1980-09-29 | 1980-09-29 | Method of cutting hard and brittle member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5759706A JPS5759706A (en) | 1982-04-10 |
| JPH0134758B2 true JPH0134758B2 (enExample) | 1989-07-20 |
Family
ID=15127566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13440380A Granted JPS5759706A (en) | 1980-09-29 | 1980-09-29 | Method of cutting hard and brittle member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5759706A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03221410A (ja) * | 1990-01-29 | 1991-09-30 | Tokyo Seimitsu Co Ltd | 柱状体材料の切断方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5129793A (ja) * | 1974-09-06 | 1976-03-13 | Iwashita Kk | Marunokosetsudankiniokeru setsudankaeriboshisochi |
| JPS52143577A (en) * | 1976-05-26 | 1977-11-30 | Hitachi Ltd | Method for slicing rod-like members |
-
1980
- 1980-09-29 JP JP13440380A patent/JPS5759706A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5759706A (en) | 1982-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4344260A (en) | Method for precision shaping of wafer materials | |
| US5351446A (en) | Method and apparatus for the rotary sawing of brittle and hard materials | |
| US4896459A (en) | Apparatus for manufacturing thin wafers of hard, non-metallic material such as for use as semiconductor substrates | |
| JPH1044017A (ja) | 平面研削装置 | |
| US4881518A (en) | Apparatus for manufacturing and handling thin wafers | |
| US11735411B2 (en) | Method and apparatus for manufacturing semiconductor device | |
| JPH0134758B2 (enExample) | ||
| US4712535A (en) | Method and apparatus for severing wafers | |
| JPH0212729B2 (enExample) | ||
| JPS6377647A (ja) | 板状体の研削方法及びその装置 | |
| JP2007281210A (ja) | 基板切断方法および基板切断装置 | |
| CN222473005U (zh) | 一种用于大尺寸石英锭切割的旋转切割装置 | |
| JPS61182760A (ja) | ワイヤによる切断方法 | |
| JP7658729B2 (ja) | 原始ウエーハの加工方法 | |
| JP2613081B2 (ja) | ウエハ外周部の鏡面研磨方法 | |
| JPH0471687B2 (enExample) | ||
| JPH05318294A (ja) | Siウエハの研削方法 | |
| JPS6229177B2 (enExample) | ||
| JPS6348664B2 (enExample) | ||
| JPS58212138A (ja) | スライシング装置 | |
| JPH09136249A (ja) | ウェーハ加工装置 | |
| JPH0433582B2 (enExample) | ||
| JP2958905B2 (ja) | 半導体ウエハの揺動スライシング方法 | |
| JPH0471688B2 (enExample) | ||
| JP2025004970A (ja) | 加工装置 |