JPH0134720B2 - - Google Patents
Info
- Publication number
- JPH0134720B2 JPH0134720B2 JP56012586A JP1258681A JPH0134720B2 JP H0134720 B2 JPH0134720 B2 JP H0134720B2 JP 56012586 A JP56012586 A JP 56012586A JP 1258681 A JP1258681 A JP 1258681A JP H0134720 B2 JPH0134720 B2 JP H0134720B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- melting point
- silver solder
- less
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002844 melting Methods 0.000 claims description 15
- 230000008018 melting Effects 0.000 claims description 15
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 30
- 229910052709 silver Inorganic materials 0.000 description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 239000004332 silver Substances 0.000 description 13
- 239000010949 copper Substances 0.000 description 12
- 238000005219 brazing Methods 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1258681A JPS57127595A (en) | 1981-01-30 | 1981-01-30 | Silver solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1258681A JPS57127595A (en) | 1981-01-30 | 1981-01-30 | Silver solder |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57127595A JPS57127595A (en) | 1982-08-07 |
JPH0134720B2 true JPH0134720B2 (de) | 1989-07-20 |
Family
ID=11809453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1258681A Granted JPS57127595A (en) | 1981-01-30 | 1981-01-30 | Silver solder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57127595A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106736021A (zh) * | 2016-12-15 | 2017-05-31 | 南京理工大学 | 一种低镉银钎料 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2496625C1 (ru) * | 2012-03-11 | 2013-10-27 | Федеральное Государственное Автономное Образовательное Учреждение Высшего Профессионального Образования "Сибирский Федеральный Университет" | Припой на основе серебра |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5216457A (en) * | 1975-07-31 | 1977-02-07 | Katsurou Uchiho | Machine for forming and cutting lead wire of capacitor |
JPS5476462A (en) * | 1977-11-30 | 1979-06-19 | Yaskawa Denki Seisakusho Kk | Silver solder |
-
1981
- 1981-01-30 JP JP1258681A patent/JPS57127595A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5216457A (en) * | 1975-07-31 | 1977-02-07 | Katsurou Uchiho | Machine for forming and cutting lead wire of capacitor |
JPS5476462A (en) * | 1977-11-30 | 1979-06-19 | Yaskawa Denki Seisakusho Kk | Silver solder |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106736021A (zh) * | 2016-12-15 | 2017-05-31 | 南京理工大学 | 一种低镉银钎料 |
CN106736021B (zh) * | 2016-12-15 | 2019-01-11 | 南京理工大学 | 一种低镉银钎料 |
Also Published As
Publication number | Publication date |
---|---|
JPS57127595A (en) | 1982-08-07 |
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