JPH0132362Y2 - - Google Patents
Info
- Publication number
- JPH0132362Y2 JPH0132362Y2 JP10793083U JP10793083U JPH0132362Y2 JP H0132362 Y2 JPH0132362 Y2 JP H0132362Y2 JP 10793083 U JP10793083 U JP 10793083U JP 10793083 U JP10793083 U JP 10793083U JP H0132362 Y2 JPH0132362 Y2 JP H0132362Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat exchange
- processing liquid
- plate
- heat exchanger
- semiconductor processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 10
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 10
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000004519 grease Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10793083U JPS6016536U (ja) | 1983-07-12 | 1983-07-12 | 半導体処理液の熱交換器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10793083U JPS6016536U (ja) | 1983-07-12 | 1983-07-12 | 半導体処理液の熱交換器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6016536U JPS6016536U (ja) | 1985-02-04 |
| JPH0132362Y2 true JPH0132362Y2 (enrdf_load_stackoverflow) | 1989-10-03 |
Family
ID=30252001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10793083U Granted JPS6016536U (ja) | 1983-07-12 | 1983-07-12 | 半導体処理液の熱交換器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6016536U (enrdf_load_stackoverflow) |
-
1983
- 1983-07-12 JP JP10793083U patent/JPS6016536U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6016536U (ja) | 1985-02-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI443883B (zh) | 具有高熱電轉換效能之熱電轉換組件 | |
| JP2015173301A (ja) | 両面冷却式電力用被覆層付き電力モジュール | |
| CN104303325B (zh) | 热电模块、热交换器、排气系统和内燃机 | |
| JPH04200B2 (enrdf_load_stackoverflow) | ||
| JP2010041041A (ja) | 基板ホルダ | |
| JP2006245479A (ja) | 電子部品冷却装置 | |
| KR20200055632A (ko) | 웨이퍼 스테이지, 반도체 제조 장치, 웨이퍼 스테이지의 제조 방법 | |
| KR100329489B1 (ko) | 반도체 처리액용 냉각가열장치 | |
| JP2004003817A (ja) | 流体温度調節装置 | |
| JPH1168173A (ja) | 熱電モジュールを用いた熱交換器 | |
| JPH0132362Y2 (enrdf_load_stackoverflow) | ||
| KR20240018621A (ko) | 열전 모듈 | |
| JP4530896B2 (ja) | 真空加熱炉用プレート型遠赤外線ヒータ | |
| JP2008519429A (ja) | 温度制御システム及び方法 | |
| JPH0132361Y2 (enrdf_load_stackoverflow) | ||
| JP2013211471A (ja) | 熱電発電装置 | |
| JP3664794B2 (ja) | 半導体処理液用冷却加熱装置 | |
| JP2001144167A (ja) | 半導体保持装置 | |
| RU2450221C1 (ru) | Термоэлектрическое охлаждающее устройство | |
| CN115235142A (zh) | 加热基座及pcr温控组件 | |
| CN114902395A (zh) | 用来加热以及冷却对象物的工作台 | |
| WO2010150860A1 (ja) | 耐火物炉壁の冷却装置及び冷却方法 | |
| JPH09313926A (ja) | 半導体処理液の熱交換器 | |
| JP3022296B2 (ja) | 耐薬品性熱交換器 | |
| TWM636984U (zh) | 使用石墨複層基材的發電構造 |