JPH01321074A - Production of tip for soldering - Google Patents

Abstract

PURPOSE:To improve the quality and mass productivity of products by forming an iron plating layer on a base body made of copper formed to a tip shape, then subjecting this iron plating layer to swaging. CONSTITUTION:The tip base body 1 is previously formed from a round bar member made of copper by machining, forging, etc. After the base body 1 is subjected to a cleaning treatment, a thin iron plating layer 2 is formed on the surface thereof to obtain the tip base material 3. Further, the build-up part of the iron plating layer 2 is smoothed by swaging of the base material 3 in the die in the final stage. The thin iron plating layer 2 is formed on the surface of the base body 1 and is then subjected to swaging; therefore, the quality such as corrosion resistance and thermal conductivity of the product tip 4 are improved. Since only the plating layer 2 is subjected to swaging and the mass productivity of the product is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing solder tips such as tips for electric soldering irons, solder tips for automatic machines, and nozzles for solder suckers.

[Prior Art] Generally, in an electric soldering iron, copper metal, which has good thermal conductivity and excellent solder wettability, is usually used as the soldering iron material.

Incidentally, in recent years, continuous soldering work using a belt conveyor system has been adopted. When using the above-mentioned copper tip for continuous soldering work, the soldering iron tip wears off at a very rapid rate due to the corrosive action of the solder or flux. Iron plating with a thickness of ~500 microns is applied to prevent wear.

Conventionally, when manufacturing a solder chip with corrosion resistance, a copper base is formed into the desired chip shape, and then an iron plating layer is formed on the surface of the base. There is.

[Problems to be Solved by the Invention] By the way, iron plating as described above is usually carried out by electrolytic treatment, so the current density is high at the edges or corners of the substrate, and the iron plating layer is only formed in these areas. I get excited. The plating on this raised part needs to be removed because the material is hard and brittle. Therefore, after applying iron plating, it is cut and polished using a lathe, milling machine, or grinder to smooth the surface of the iron plating layer. ing.

However, such finishing processing requires skill and is inefficient, and also has problems such as variations in the product and the inability to obtain stable corrosion resistance and thermal conductivity.

[Means for Solving the Problems] The present invention has been made to solve the above problems, and includes forming an iron plating layer on the surface of a copper base formed into a desired chip shape to obtain a chip base material. Then, the iron plating layer is formed by swaging.

[Function] According to the method of manufacturing a soldering chip of the present invention, since the iron plating layer on the surface of the substrate, which has been previously formed into a desired chip shape, is formed by swaging processing, the unevenness that occurs on the surface of the iron plating layer is reduced. This makes it easy to mass-produce solder chips with uniform corrosion resistance and thermal conductivity.

[Example] Hereinafter, an example of manufacturing a solder chip based on the method of the present invention will be described with reference to FIGS. 1 to 3.

First, one end of a round rod-shaped member made of copper is sharpened by machining or various forging processes to obtain the base 1 shown in FIG.

Next, the substrate 1 is chemically cleaned and washed with water, and then, as shown in FIG. 2, a soft iron plating of 2008 V or less is applied to the surface to a thickness of 50 to 500 microns by electrolytic treatment to form an iron plating layer. 2 and chip base material 3
get. Since this layer formation is performed by electrolytic treatment as described above, the current density is high at the ends and corners of the chip base material 3, and the iron plating layer 2 is thickened only at these parts.

Next, the chip base material 3 is swaged using a mold capable of shaping the final shape and dimensions, thereby crushing and removing the raised portions of the iron plating layer 2 and smoothing its surface.

That is, this swaging process is performed only on the iron plating layer 2. In order to avoid deformation of the substrate 1 during this swaging process, the surface of the substrate 1 is preferably hardened in advance.

Through the above steps, the solder chip 4 shown in FIG. 3 is obtained.

According to the above method, the surface of the iron plating layer 2 can be easily smoothed without requiring any skill, and since only the iron plating layer 2 is swaged, the load on the swaging machine is reduced. Because it is small, it is possible to mass-produce high-quality products.

Further, since the thickness of the iron plating layer 2 can be made approximately uniform, the obtained solder chip 4 has uniform corrosion resistance and thermal conductivity.

In the method of the above embodiment, the chip base material 3 may be annealed after being heated to approximately 740° C., which is the transformation point of iron molecules, and then subjected to swaging processing. According to this, the heat treatment improves the arrangement structure of iron molecules, and the metal structure becomes dense, making it possible to obtain a solder chip with better corrosion resistance.

[Effects of the Invention] As explained above, according to the method for manufacturing a solder chip of the present invention, an iron plating layer is formed on the surface of a copper base formed into a desired chip shape to obtain a chip base material, and then a chip base material is obtained. , characterized in that the iron plating layer is formed by swaging processing, and since the surface of the iron plating layer can be easily smoothed, a solder chip with uniform corrosion resistance and thermal conductivity can be obtained. Moreover, since only the iron plating layer is swaged, the load on the processing machine is reduced, and therefore high-quality solder chips can be mass-produced.

[Brief explanation of the drawing]

1 to 3 are sectional views sequentially showing solder chips according to the present invention according to the manufacturing procedure. 1...Base body, 2...Iron plating layer, 3...Chip base material, 4...Solder chip.

Claims (1)

[Claims] For soldering, the chip base material is obtained by forming an iron plating layer on the surface of a copper base molded into a desired chip shape, and then the iron plating layer of the chip base material is shaped by swaging processing. Chip manufacturing method.