KR100864670B1 - Manufacturing method soldering iron tip for lread free - Google Patents

Manufacturing method soldering iron tip for lread free Download PDF

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KR100864670B1
KR100864670B1 KR1020070041809A KR20070041809A KR100864670B1 KR 100864670 B1 KR100864670 B1 KR 100864670B1 KR 1020070041809 A KR1020070041809 A KR 1020070041809A KR 20070041809 A KR20070041809 A KR 20070041809A KR 100864670 B1 KR100864670 B1 KR 100864670B1
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electrolyte
plating
preparation step
iron tip
barrel
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KR1020070041809A
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Korean (ko)
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박인덕
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박인덕
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A method for manufacturing a soldering iron tip for lead free is provided to protect environment using nickel instead of chrome, prevent toxic materials from being generated during a plating process, and enable soldering at high temperature. A method for manufacturing a soldering iron tip for lead free comprises the steps of: cleaning a base which is made of copper and which is formed with shapes of iron tips(100); preparing for an electrode plate which is made by a 1:1 ratio of a steel plate and a nickel plate(200); preparing for an electrolyte by putting FeCl2 and calcium chloride in a vessel to have PH4 and specific gravity of 4.5, using refining water as solvent(300); connecting a barrel to a cathode of a power supply device, dipping the cathode in the electrolyte, connecting the electrode plate with an anode, and dipping the anode in the electrolyte(400); plating for 28 to 32 hours by supplying power, stopping the supply of the power every 2 hours to rotate the barrel for 20 minutes, and supplying power again(500); and processing and heat-treating the base(600).

Description

무연납전용 인두팁의 제조방법{MANUFACTURING METHOD SOLDERING IRON TIP FOR LREAD FREE}Manufacturing method of lead-free solder tip {MANUFACTURING METHOD SOLDERING IRON TIP FOR LREAD FREE}

도 1은 본 발명의 바람직한 실시예로 형성된 무연납전용 인두팁의 제조방법의 개념도.1 is a conceptual diagram of a method for manufacturing a lead-free soldering iron tip formed by a preferred embodiment of the present invention.

도 2는 본 발명의 바람직한 실시예로 형성된 무연납전용 인두팁의 제조방법의 순서도.Figure 2 is a flow chart of a method of manufacturing a lead-free soldering iron tip formed in a preferred embodiment of the present invention.

**<도면의 주요부분에 대한 부호의 설명>**** <Description of the symbols for the main parts of the drawings> **

10 : 전원공급장치 20 : 용기10: power supply device 20: container

25 : 전해액 30 : 소지25: electrolyte 30: holding

40 : 바렐 50 : 전극판40: barrel 50: electrode plate

100 : 소지준비단계 200 : 전극준비단계100: preparation stage 200: electrode preparation stage

300 : 전해액준비단계 400 : 도금준비단계300: electrolyte preparation step 400: plating preparation step

500 : 도금단계 600 : 가공단계500: plating step 600: processing step

본 발명의 무연납전용 인두팁의 제조방법에 관한 것으로, 더욱 상세하게는 구리를 전기분해방식으로 도금하여 생산하는 일반적인 인두팁을 무연납을 녹일 수 있는 높은 온도에서도 성능이 제대로 발휘되도록 한 인두팁의 제조방법에 관한 것이다.The present invention relates to a method for manufacturing a lead-free soldering iron tip of the present invention, and more particularly, to a method for manufacturing a soldering iron tip that is properly exhibited at a high temperature capable of melting lead-free lead in a general iron tip produced by electroplating copper. It is about.

일반적으로 인두기는 납땜이 필요한 부위에 땜납을 녹여 납땜하는 기구인데, 땜납과 직접 접촉되는 인두기의 인두팁은 구리 또는 구리계열의 재료로 제조된다.In general, the soldering iron is a device for melting and soldering solder to a portion where soldering is required. The soldering iron tip of the soldering iron in direct contact with the solder is made of copper or copper-based material.

종래의 인두팁은 고온으로 가열될 때 인두팁이 땜납 내에서 용융되거나, 납 또는 공기에 의해 부식되기도 하며, 기계적인 압력이 가해질 때 팁의 모양이 변형되는 등의 문제점이 있었다. The conventional iron tip has a problem such that when the iron tip is heated to a high temperature, the iron tip is melted in the solder, corroded by lead or air, and the shape of the tip is deformed when mechanical pressure is applied.

특히, 최근에는 인체에 해로운 천연납을 사용하지 않고, 녹을 때 유해한 기체가 발생하지 않는 무연납(주석(Sn)+은(Ag)+구리(Cu))을 사용하는데, 상기 무연납을 사용하기 위해서는 인두팁의 온도가 300~400℃정도에 이르러야 하므로 이러한 온도에서 납땜이 잘되지 않거나 인두팁이 변형 혹은 부식되는 문제점이 있었다.In particular, recently, lead-free lead (tin (Sn) + silver (Ag) + copper (Cu)), which does not use natural lead that is harmful to the human body and does not generate harmful gas when dissolved, is used. In order to reach the temperature of the iron tip to 300 ~ 400 ℃ degree of soldering is not good at this temperature or there was a problem that the iron tip is deformed or corroded.

상기한 문제점을 해결하기 위해서, 철(Fe)이나 크롬(Cr)을 구리(Cu)로 형성된 인두팁을 도금하여 사용하게 된다. In order to solve the above problems, iron (Fe) or chromium (Cr) is used to plate the iron tip formed of copper (Cu).

그러나, 크롬은 세계적인 중금속사용 억제정책에 반하게 되고, 크롬도금 공정에서 인체에 치명적인 물질이 발생하는 등의 문제점이 있었다.However, chromium is contrary to the global heavy metal use suppression policy, there was a problem such as a fatal substance generated in the chromium plating process.

상기한 문제점을 해결하기 위해서, 본 발명은 다음과 같은 목적에서 개발되었다.In order to solve the above problems, the present invention was developed for the following purposes.

(1) 크롬을 사용하지 않고 니켈을 사용한 인두팁 제조방법을 제공한다.(1) Provides a method for producing a iron tip using nickel without using chromium.

(2) 도금공정에서 유해한 물질이 발생하지 않는 인두팁 제조방법을 제공한다.(2) Provides a method of manufacturing a iron tip that does not generate harmful substances in the plating process.

(3) 무연납을 사용할 수 있는 높은 온도에서도 납땜을 원활히 할 수 있는 인두팁 제조방법 제공한다.(3) Provides iron tip manufacturing method that can lead soldering smoothly even at high temperature where lead-free lead can be used.

상기한 목적을 달성하기 위해서 본 발명은 구리로 형성하고, 전기분해방식에 의해서 도금하는 방법으로 제조하는 일반적인 인두팁 제조방법에 있어서, In order to achieve the above object, the present invention is formed in a copper, in the general iron tip manufacturing method manufactured by the method of plating by electrolysis method,

구리로 인두팁의 형태로 형성한 소지를 깨긋하게 한 후에 바렐에 준비하는 소지준비단계와;A holding preparation step of preparing the barrel after removing the base formed in the form of a iron tip with copper;

철판과 니켈판을 1:1로 형성한 전극판을 준비하는 전극준비단계와;An electrode preparation step of preparing an electrode plate having a 1: 1 iron plate and a nickel plate;

용기(20)에 염화제1철과 염화칼슘을 3:1의 비율로 섞어서 정제수를 용제로 PH 4, 비중 4.5가 되도록 한 전해액을 준비하는 전해액준비단계와;An electrolyte preparation step of preparing an electrolyte solution in which the ferrous chloride and calcium chloride are mixed in a ratio of 3: 1 to the container 20 so that purified water is used as a solvent with a pH of 4 and a specific gravity of 4.5;

상기 소지준비단계에서 준비된 바렐에 전원공급장치의 음극을 연결하고 전해액준비단계에서 준비된 전해액에 담그고, 전극준비단계에서 준비된 전극판에 양극을 연결하여 전해액에 담그는 도금준비단계와;A plating preparation step of connecting the cathode of the power supply device to the barrel prepared in the preparation step and dipping in the electrolyte prepared in the electrolyte preparation step, and connecting the anode to the electrode plate prepared in the electrode preparation step to immerse in the electrolyte solution;

상기 전원공급장치로부터 전원을 공급하여 도금을 시작하되, 1시간 간격으로 PH와 비중을 맞추어주고, 2시간에 한번씩 전원공급부의 전원을 차단하고 바렐만 20분간 회전시킨 후 다시 전원을 공급하는 방법으로 28~32시간 도금하는 도금단계와;Plating is started by supplying power from the power supply device, and adjust the specific gravity to PH at 1 hour intervals, turn off the power supply unit every 2 hours, rotate the barrel only for 20 minutes, and then supply power again. A plating step of plating for 28 to 32 hours;

상기 도금단계에서 도금된 소지를 가공하고 열처리하는 가공단계로 구성되는 것을 특징으로 한다. Characterized in that it consists of a processing step of processing and heat-treated the plated body in the plating step.

이하, 본 발명을 바람직한 실시예와 첨부된 도면을 참조하여 상세하게 설명하면 다음과 같다.Hereinafter, described in detail with reference to the preferred embodiments and the accompanying drawings as follows.

도 1 과 도 2에 있어서, 본 발명은 인두팁을 구리로 형성하고, 전기분해방식에 의해서 도금하는 일반적인 도금방법에 있어서, 1 and 2, the present invention is a general plating method in which the iron tip is formed of copper and plated by electrolysis;

구리로 인두팁의 형태로 형성한 소지(30)를 깨긋하게 한 후에 바렐에 준비하는 소지준비단계(100)와; 철판(51)과 니켈판(52)을 1:1로 형성한 전극판(50)을 준비하는 전극준비단계(200)와; 용기(20)에 염화제1철과 염화칼슘을 3:1의 비율로 섞어서 정제수를 용제로 PH 4, 비중 4.5가 되도록 한 전해액(25)을 준비하는 전해액준비단계(300)와; 상기 소지준비단계(100)에서 준비된 바렐(40)에 전원공급장치(10)의 음극을 연결하고 전해액준비단계(300)에서 준비된 전해액(25)에 담그고, 전극준비단계(200)에서 준비된 전극판(50)에 양극을 연결하여 전해액(25)에 담그는 도금준비단계(400)와; 상기 전원공급장치(10)로부터 전원을 공급하여 도금을 시작하되, 1시간 간격으로 PH와 비중을 맞추어주고, 2시간에 한번씩 전원공급부의 전원을 차단하고 바렐(40)만 20분간 회전시킨 후 다시 전원을 공급하는 방법으로 28~32시간 도금하는 도금단계(500)와; 상기 도금단계(500)에서 도금된 소지(30)를 가공하고 열처리하는 가공단계(600)로 구성된다.A holding preparation step 100 for preparing the barrel after the base 30 formed in the form of a soldering iron with copper; An electrode preparation step 200 for preparing an electrode plate 50 in which the iron plate 51 and the nickel plate 52 are formed to be 1: 1; An electrolyte preparation step 300 of preparing an electrolyte solution 25 in which the ferrous chloride and calcium chloride are mixed in a ratio of 3: 1 to the vessel 20 by using a purified water as a solvent to pH 4 and specific gravity of 4.5; Connecting the cathode of the power supply device 10 to the barrel 40 prepared in the preparation step 100, immersed in the electrolyte 25 prepared in the electrolyte preparation step 300, the electrode plate prepared in the electrode preparation step 200 A plating preparation step 400 for connecting the anode to 50 to immerse it in the electrolyte 25; Start the plating by supplying power from the power supply device 10, adjust the specific gravity with PH at 1 hour intervals, cut off the power supply unit every 2 hours, rotate the barrel 40 for 20 minutes and then again A plating step 500 for plating 28 to 32 hours by a method of supplying power; It consists of a processing step 600 for processing and heat-treating the plated body 30 in the plating step 500.

상기 소지준비단계(100)의 소지(30)는 구리(Cu)로 형성된 봉이나 판을 작게 절단한 것으로 표면을 깨끗하게 정화한 후에 사용한다. The base 30 of the preparation step 100 is used to cut the rod or plate made of copper (Cu) small and clean the surface.

상기 전해액준비단계(300)에서는 염화제1철(FeCl2)와 염화칼슘(CaCl2)을 조성비가 3:1이 되도록 준비하고, 정제수(H2O)에 넣어서 PH가 4가 되도록 하고, 비중이 4.5가 되도록 형성한다. In the preparation of the electrolyte 300, the ferrous chloride (FeCl 2 ) and calcium chloride (CaCl 2 ) is prepared so that the composition ratio is 3: 1, and put into purified water (H 2 O) so that the pH is 4, the specific gravity is Form to be 4.5.

상기 전원공급장치는 교류전류를 직류전류로 변환하는 컨버터가 형성되거나, 직류전류를 인가할 수 있는 장치이다.The power supply device is a device for converting an AC current into a DC current or a device capable of applying a DC current.

상기 도금단계(500)는 전해액(25)의 온도가 80~95℃ 되도록 유지하고, 1시간 간격으로 염화제1철과 염화칼슘을 투입하면서 PH를 4로, 비중을 4.5로 맞춘다. The plating step 500 maintains the temperature of the electrolyte 25 to 80 ~ 95 ℃, while adjusting the pH to 4, specific gravity to 4.5 while adding ferrous chloride and calcium chloride at intervals of 1 hour.

상기 도금단계(500)에서 전원공급을 중단하고 바렐(40)만 회전시키는 것은 반응이 고르고 빠르게 일어나도록 하기 위한 것이다. The power supply is stopped in the plating step 500 and only the barrel 40 is rotated so that the reaction occurs evenly and quickly.

상기 도금단계(500)에서 도금하는 시간은 28~32시간이 적당하고, 바람직하게는 30시간 정도 도금하는 것이 적당하다.The plating time in the plating step 500 is suitable for 28 to 32 hours, preferably about 30 hours plating.

상기 가공단계(600)에서는 원하는 형상으로 가공하고, 열처리하게 된다.In the processing step 600 is processed into a desired shape, and heat treatment.

본 발명은 첨부된 도면을 참조하여 바람직한 실시예를 중심으로 기술되었지만 당업자라면 이러한 기재로부터 후술하는 특허청구범위에 의해 포괄되는 본 발명의 범주를 벗어남이 없이 다양한 변형이 가능하다는 것은 명백하다.Although the present invention has been described with reference to the accompanying drawings, it will be apparent to those skilled in the art that various modifications may be made therein without departing from the scope of the invention, which is covered by the following claims.

상기한 것과 같이 본 발명에 의하면 다음과 같은 효과가 발생한다.As described above, according to the present invention, the following effects occur.

(1) 크롬을 사용하지 않고 니켈을 사용하여 환경오염을 방지한다.(1) Nickel is used instead of chromium to prevent environmental pollution.

(2) 도금공정에서 유해한 물질이 발생하지 않는다.(2) No harmful substances are generated in the plating process.

(3) 무연납을 사용할 수 있는 높은 온도에서도 납땜을 원활히 할 수 있다.(3) Soldering can be performed smoothly even at high temperature where lead-free lead can be used.

Claims (3)

삭제delete 인두팁을 구리로 형성하고, 전기분해방식에 의해서 도금하는 일반적인 도금방법에 있어서, In the general plating method in which the iron tip is formed of copper and plated by electrolysis, 구리로 인두팁의 형태로 형성한 소지(30)를 깨긋하게 한 후에 바렐에 준비하는 소지준비단계(100)와;A holding preparation step 100 for preparing the barrel after the base 30 formed in the form of a soldering iron with copper; 철판(51)과 니켈판(52)을 1:1로 형성한 전극판(50)을 준비하는 전극준비단계(200)와;An electrode preparation step 200 for preparing an electrode plate 50 in which the iron plate 51 and the nickel plate 52 are formed to be 1: 1; 용기(20)에 염화제1철과 염화칼슘을 섞어서 정제수를 용제로 PH 4, 비중 4.5가 되도록 한 전해액(25)을 준비하는 전해액준비단계(300)와;An electrolyte preparation step 300 of preparing an electrolyte solution 25 in which the ferrous chloride and calcium chloride are mixed with the vessel 20 so as to have a pH 4 and a specific gravity of 4.5 using purified water as a solvent; 상기 소지준비단계(100)에서 준비된 바렐(40)에 전원공급장치(10)의 음극을 연결하고 전해액준비단계(300)에서 준비된 전해액(25)에 담그고, 전극준비단계(200)에서 준비된 전극판(50)에 양극을 연결하여 전해액(25)에 담그는 도금준비단계(400)와; Connecting the cathode of the power supply device 10 to the barrel 40 prepared in the preparation step 100, immersed in the electrolyte 25 prepared in the electrolyte preparation step 300, the electrode plate prepared in the electrode preparation step 200 A plating preparation step 400 for connecting the anode to 50 to immerse it in the electrolyte 25; 상기 전원공급장치(10)로부터 전원을 공급하여 도금을 시작하되, 1시간 간격으로 PH와 비중을 맞추어주고, 2시간에 한번씩 전원공급부의 전원을 차단하고 바렐(40)만 20분간 회전시킨 후 다시 전원을 공급하는 방법으로 28~32시간 도금하는 도금단계(500)와;Start the plating by supplying power from the power supply device 10, adjust the specific gravity with PH at 1 hour intervals, cut off the power supply unit every 2 hours, rotate the barrel 40 for 20 minutes and then again A plating step 500 for plating 28 to 32 hours by a method of supplying power; 상기 도금단계(500)에서 도금된 소지(30)를 가공하고 열처리하는 가공단계(600)로 구성되되, Consists of a processing step 600 for processing and heat-treating the plated body 30 in the plating step 500, 상기 전해액준비단계(300)에서 염화제1철과 염화칼슘은 3:1의 조성비로 형성되는 것을 특징으로 하는 무연납전용 인두팁의 제조방법.Ferrous chloride and calcium chloride in the electrolyte preparation step 300 is a method for producing a lead-free soldering iron tip, characterized in that formed in a ratio of 3: 1. 삭제delete
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101103386B1 (en) * 2011-07-11 2012-01-13 주식회사 광운 A manufacturing method soldering iron tip for lread free
RU2790853C2 (en) * 2020-07-28 2023-02-28 Общество с ограниченной ответственностью "Электролитная сварка" (ООО "ЭЛЕКС") Method for electrolyte-plasma welding of products of aluminum or its alloys with steel

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01321074A (en) * 1988-06-23 1989-12-27 Taiyo Denki Sangyo Kk Production of tip for soldering
KR19990036716A (en) * 1997-10-01 1999-05-25 이데이 노부유끼 Heating tip and method of manufacturing the same
US6386423B1 (en) * 1997-02-10 2002-05-14 Delaware Capital Formation, Inc. Soldering iron tips
JP2004300454A (en) 2003-03-28 2004-10-28 Matsushita Electric Ind Co Ltd Method for plating electronic component
JP2005125349A (en) 2003-10-22 2005-05-19 Fuji Electric Holdings Co Ltd Soldering iron

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01321074A (en) * 1988-06-23 1989-12-27 Taiyo Denki Sangyo Kk Production of tip for soldering
US6386423B1 (en) * 1997-02-10 2002-05-14 Delaware Capital Formation, Inc. Soldering iron tips
KR19990036716A (en) * 1997-10-01 1999-05-25 이데이 노부유끼 Heating tip and method of manufacturing the same
JP2004300454A (en) 2003-03-28 2004-10-28 Matsushita Electric Ind Co Ltd Method for plating electronic component
JP2005125349A (en) 2003-10-22 2005-05-19 Fuji Electric Holdings Co Ltd Soldering iron

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101103386B1 (en) * 2011-07-11 2012-01-13 주식회사 광운 A manufacturing method soldering iron tip for lread free
RU2790853C2 (en) * 2020-07-28 2023-02-28 Общество с ограниченной ответственностью "Электролитная сварка" (ООО "ЭЛЕКС") Method for electrolyte-plasma welding of products of aluminum or its alloys with steel

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