JPH0132066Y2 - - Google Patents

Info

Publication number
JPH0132066Y2
JPH0132066Y2 JP1984171489U JP17148984U JPH0132066Y2 JP H0132066 Y2 JPH0132066 Y2 JP H0132066Y2 JP 1984171489 U JP1984171489 U JP 1984171489U JP 17148984 U JP17148984 U JP 17148984U JP H0132066 Y2 JPH0132066 Y2 JP H0132066Y2
Authority
JP
Japan
Prior art keywords
light
emitting
current
emitting display
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984171489U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6185894U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984171489U priority Critical patent/JPH0132066Y2/ja
Publication of JPS6185894U publication Critical patent/JPS6185894U/ja
Application granted granted Critical
Publication of JPH0132066Y2 publication Critical patent/JPH0132066Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
JP1984171489U 1984-11-12 1984-11-12 Expired JPH0132066Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984171489U JPH0132066Y2 (enrdf_load_stackoverflow) 1984-11-12 1984-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984171489U JPH0132066Y2 (enrdf_load_stackoverflow) 1984-11-12 1984-11-12

Publications (2)

Publication Number Publication Date
JPS6185894U JPS6185894U (enrdf_load_stackoverflow) 1986-06-05
JPH0132066Y2 true JPH0132066Y2 (enrdf_load_stackoverflow) 1989-10-02

Family

ID=30729173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984171489U Expired JPH0132066Y2 (enrdf_load_stackoverflow) 1984-11-12 1984-11-12

Country Status (1)

Country Link
JP (1) JPH0132066Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121808A (ja) * 1997-10-15 1999-04-30 Idec Izumi Corp Ｌｅｄ表示用デバイス

Also Published As

Publication number Publication date
JPS6185894U (enrdf_load_stackoverflow) 1986-06-05

Similar Documents

Publication Publication Date Title
US10920941B1 (en) LED meshwork lamp and production method thereof
EP3812647B1 (en) Filament structure and bulb having the filament structure
CN103574379B (zh) 用于制造灯条的方法和灯条
CN105927883A (zh) 一种贴片式led柔性灯带
JP2010157678A (ja) 発光ダイオードライトバーおよびその製造方法
EP0107480A3 (en) Light emission diode lamp and method of producing it
US4241387A (en) Lamp lead to wire attachment for integral string sets
JPH0132066Y2 (enrdf_load_stackoverflow)
US11473739B2 (en) Light string and decorative illumination assembly
JPH036938Y2 (enrdf_load_stackoverflow)
JPH032940Y2 (enrdf_load_stackoverflow)
JPH0337192B2 (enrdf_load_stackoverflow)
JPH032939Y2 (enrdf_load_stackoverflow)
JPH0355990Y2 (enrdf_load_stackoverflow)
CN216813874U (zh) 一种可任意方向折弯或扭曲的灯具
JPH0328469Y2 (enrdf_load_stackoverflow)
JPH0132067Y2 (enrdf_load_stackoverflow)
JPH036939Y2 (enrdf_load_stackoverflow)
CN210778652U (zh) 线灯封装结构
CN110690336B (zh) 一种节能型led照明装置及其制造方法
JP2000243553A (ja) 発光チューブ
CN114508709A (zh) 一种可任意方向折弯或扭曲的灯具及其制作方法
JPH0328474Y2 (enrdf_load_stackoverflow)
CN223105903U (zh) 一种可任意折弯扭曲的led灯具
JPH0721807A (ja) ガイドライトおよびその製造方法