JPH0132066Y2 - - Google Patents
Info
- Publication number
- JPH0132066Y2 JPH0132066Y2 JP1984171489U JP17148984U JPH0132066Y2 JP H0132066 Y2 JPH0132066 Y2 JP H0132066Y2 JP 1984171489 U JP1984171489 U JP 1984171489U JP 17148984 U JP17148984 U JP 17148984U JP H0132066 Y2 JPH0132066 Y2 JP H0132066Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting
- current
- emitting display
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000011162 core material Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 229920003002 synthetic resin Polymers 0.000 claims description 9
- 239000000057 synthetic resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 15
- 230000008901 benefit Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000004804 winding Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004397 blinking Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は、本出願人が先に実願昭59−57550号
において提案した折曲可能な発光表示体の改良に
関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to an improvement of a foldable light-emitting display body previously proposed by the present applicant in Utility Model Application No. 59-57550.
従来の技術
本出願人が、実願昭59−57550号において提案
した発光表示体は、列状に配置された発光ダイオ
ードなどの発光体素子を、発光面側を透光性素材
で形成した可撓性合成樹脂被包体内に封入して成
るもので、任意の長さ、任意の形状の発光表示体
が得られ、しかも所謂デイスプレイの装飾灯やネ
オンサインなどに使用するのに取付工数が少な
く、消費電力も少なく寿命も長く、トータルコス
トも安いなどの利点を有したものであつた。しか
し、このような発光表示体においては、可撓性合
成樹脂被包体内に封入された発光体素子を通電す
るために使用されるリードワイヤが被包体内で上
下、あるいは水平のいずれかの方向に配列され貫
通して封入されているために、配列されたリード
ワイヤの曲率に差異を生じるような状態で発光表
示体を折曲したり、捩じつたりした時には通電部
材を折損しやすくするばかりでなく、可撓性合成
樹脂被包体の折曲点に歪を生じたりして被包体の
寿命を縮めてしまうなどの問題があり、この点で
改善の余地があつた。Prior Art A light-emitting display proposed by the present applicant in Utility Application No. 59-57550 is a light-emitting display in which light-emitting elements such as light-emitting diodes arranged in a row are formed with the light-emitting surface side made of a translucent material. It is encapsulated in a flexible synthetic resin encapsulant, allowing a light-emitting display of any length and shape to be obtained, and requires less man-hours for installation when used for so-called decorative lights for displays, neon signs, etc. It had the advantages of low power consumption, long life, and low total cost. However, in such a light-emitting display, the lead wire used to supply electricity to the light-emitting element enclosed within the flexible synthetic resin encapsulation is either vertically or horizontally inside the encapsulation. Since the lead wires are arranged in the lead wires and are sealed through the lead wires, the current-carrying member is likely to break if the light-emitting display is bent or twisted in a manner that causes a difference in the curvature of the arranged lead wires. In addition, there is a problem that distortion occurs at the bending point of the flexible synthetic resin enveloping body, which shortens the life of the enveloping body, and there is room for improvement in this respect.
考案が解決しようとする問題点
本考案は叙上の問題点を解決するために開発さ
れたもので、折曲に対して特に丈夫で、しかもあ
らゆる方向の折曲に対して通電部材間のピツチの
変化が少ない上に取付けた発光体素子にもストレ
スを与えにくい構造の発光表示体を提供すること
を目的とする。Problems to be Solved by the Invention The present invention was developed to solve the problems mentioned above. It is an object of the present invention to provide a light-emitting display body having a structure in which there is little change in the light-emitting element and which does not easily apply stress to the attached light-emitting element.
問題点を解決するための手段
上記問題を解決するために提供される本考案の
折曲可能な発光表示体は、可撓性絶縁素材によつ
て形成された芯材の外周に、複数の連続した偏平
な通電部材をスパイラル状に巻付けるとともに、
これらの通電部材間に発光体素子を接続し、さら
にその全体を発光体素子の発光面側を少なくとも
透光性素材で形成した可撓性合成樹脂で封入して
成ることを要旨とするものである。Means for Solving the Problems The bendable light-emitting display of the present invention, which is provided to solve the above problems, has a core made of a flexible insulating material, and a plurality of continuous In addition to winding the flat current-carrying member in a spiral shape,
The gist is that a light-emitting element is connected between these current-carrying members, and the entire structure is enclosed in a flexible synthetic resin made of at least a light-transmitting material on the light-emitting surface side of the light-emitting element. be.
考案の作用及び効果
本考案の発光表示体は、可撓性樹脂素材によつ
て形成された芯材の外周に、複数の連続した偏平
な導電部材をスパイラル状に巻付けるとともに、
これらの通電部材間に発光体素子を接続し、さら
にその全体を発光体素子の発光面側を少なくとも
透光性素材で形成した可撓性合成樹脂で封入して
構成された構造なので、その構造上の特徴から次
のような作用、効果が奏される。Functions and Effects of the Invention The light emitting display of the invention includes a plurality of continuous flat conductive members wound in a spiral shape around the outer periphery of a core material made of a flexible resin material.
A light emitting element is connected between these current-carrying members, and the entire structure is encapsulated with a flexible synthetic resin made of a translucent material at least on the light emitting surface side of the light emitting element. The above features produce the following actions and effects.
(1) 折曲や捩じりに対して特に強い構造となり、
また通電部材は芯材の外周面に確実かつ容易に
取付けられ、しかも取付時の密着性が良い。(1) The structure is particularly strong against bending and twisting.
Further, the current-carrying member can be reliably and easily attached to the outer circumferential surface of the core material, and has good adhesion during attachment.
(2) 通電部材は折曲や捩じり時にも、折損しにに
く、また折曲や捩じり時にも通電部材間のピツ
チに変化を生じにくいものにするので、通電部
材間が接触して無用な接触事故を起こす虞が少
ない。(2) The current-carrying members are made to be resistant to breakage when bent or twisted, and the pitch between the current-carrying members does not easily change even when bent or twisted, so that the current-carrying members are in contact with each other. There is less risk of unnecessary contact accidents.
(3) 折曲や捩じり時に、発光体素子に無用なスト
レスを与えにくく、したがつて発光体素子の破
壊の虞が少ない。(3) When bending or twisting, unnecessary stress is less likely to be applied to the light emitting element, and therefore there is less risk of destruction of the light emitting element.
(4) 通電部材の厚みを薄くできるので、小型に形
成でき、しかも折曲や捩じり時の曲率を大きく
できるので、発光表示体の折曲性をより一層向
上させることができる。(4) Since the thickness of the current-carrying member can be reduced, it can be formed compactly, and the curvature when bent or twisted can be increased, so that the bendability of the light-emitting display can be further improved.
考案の実施例
以下に、添付図とともに、本考案の実施例を説
明する。Embodiments of the invention Examples of the invention will be described below with reference to the accompanying drawings.
第１図は、発光表示体Ａの第一の実施例を示し
ており、発光体素子のアノード側とカソード側の
両方の通電部材を連続した偏平な裸導体で構成し
たものである。 FIG. 1 shows a first embodiment of the light-emitting display A, in which the current-carrying members on both the anode side and the cathode side of the light-emitting element are constructed of continuous flat bare conductors.
芯材１はシリコンゴムなどの可撓性絶縁素材で
形成されており、その外周には連続した偏平な裸
導体２，３を適当な間隙を保つてスパイラル状に
巻付け、芯材１に接着せしめている。実施例で
は、芯材１の外周に２条の偏平な裸導体２，３を
相互に交叉しないように巻付け、これら２条の裸
導体２，３の一方の導体２を発光体素子４のカソ
ード側の通電部材とし、他方の裸導体３を発光体
素子４のアノード側の通電部材としている。そし
て、カソード側の裸導体２の上に発光体素子を構
成するpn半導体接合チツプ４を銀ペースト（不
図示）などを用いて固着するとともに、この半導
体チツプ４の上部をボンデイングワイヤ５により
アノード側の裸導体３に接続している。このよう
にして形成された構造体は透光性の可撓性樹脂を
被覆して形成された被包体６内に封入されて折曲
可能な発光表示体Ａが構成されている。 The core material 1 is made of a flexible insulating material such as silicone rubber, and continuous flat bare conductors 2 and 3 are wound around its outer circumference in a spiral shape with an appropriate gap, and then glued to the core material 1. It's forcing me. In the embodiment, two flat bare conductors 2 and 3 are wound around the outer periphery of the core material 1 so as not to cross each other, and one conductor 2 of these two bare conductors 2 and 3 is wrapped around the outer periphery of the light emitting element 4. The other bare conductor 3 is used as the current-carrying member on the cathode side, and the other bare conductor 3 is used as the current-carrying member on the anode side of the light-emitting element 4. Then, a pn semiconductor junction chip 4 constituting a light emitting element is fixed onto the bare conductor 2 on the cathode side using silver paste (not shown), and the upper part of this semiconductor chip 4 is connected to the anode side using a bonding wire 5. It is connected to the bare conductor 3 of The structure thus formed is enclosed within an envelope 6 formed by covering it with a transparent flexible resin, thereby forming a bendable light-emitting display A.
なお、７は発光体素子を構成する半導体チツプ
４の封止膜であり、被包体６を形成する前に、半
導体チツプ４とボンデイングワイヤ５を含む発光
部を保護するために透光性の熱硬化性樹脂をそれ
らの上面に被覆して形成してある。 Note that 7 is a sealing film for the semiconductor chip 4 constituting the light-emitting element, and before forming the envelope 6, a transparent film is used to protect the light-emitting part including the semiconductor chip 4 and bonding wires 5. They are formed by coating their upper surfaces with thermosetting resin.
このような封止膜７を形成する場合には、発光
表示体Ａの折曲や捩じり時において、発光体素子
４を含む発光部の破損を生じにくい構造にでき
る。 When such a sealing film 7 is formed, it is possible to create a structure in which the light-emitting portion including the light-emitting element 4 is less likely to be damaged when the light-emitting display body A is bent or twisted.
以上の実施例では、被包体６はその全体を透光
性樹脂にて形成してあるが、本考案の発光表示体
Ａはこのようなものに限られず、少なくとも発光
体素子４の発光面側を透光性素材で形成してあれ
ばよい。しかして、このような構造であれば、半
導体チツプ４を偏平な裸導体の上に固着すること
になるので、その取付が容易になる（線状導体の
場合に比べて、取付位置の選択の幅が大きくな
り、また絶縁層を被覆した通電部材に比べて、取
付け時に逐一絶縁層を剥奪させる手間を要しない
ので、取付手間も簡単になり、その導体幅の範囲
内で取付位置や取付ピツチの選択を任意にでき
る）という利点がある。また、偏平な導体である
から、芯材１の外周に巻付けた時の密着性が良
く、しかも通電部材の厚みを薄くできるので、発
光表示体Ａ自体の外径を小さくして小型に形成で
きるととともに、スパイラル状に巻付けられてい
ることともあいまつて折曲、捩じり個所における
曲率を大きくできるという利点がある。 In the above embodiments, the envelope 6 is entirely made of a translucent resin, but the light-emitting display A of the present invention is not limited to such a structure, and at least the light-emitting surface of the light-emitting element 4 is It is sufficient if the sides are made of a translucent material. However, with this structure, the semiconductor chip 4 is fixed onto a flat bare conductor, making it easier to mount it (compared to the case of a linear conductor, there is less choice in the mounting position). The width is larger, and compared to current-carrying members coated with an insulating layer, there is no need to remove the insulating layer each time during installation, making the installation process easier. The advantage is that the selection can be made arbitrarily. In addition, since it is a flat conductor, it has good adhesion when wrapped around the outer periphery of the core material 1, and the thickness of the current-carrying member can be reduced, so the outer diameter of the light-emitting display A itself can be reduced to make it compact. This also has the advantage that the curvature at the bending or twisting portion can be increased due to the fact that it is spirally wound.
また、上述の実施例では、２条の裸導体２，３
で通電部材を構成した例を示したにすぎないが、
裸導体以外に絶縁層を被覆した導体を使用しても
よく、さらに２条以外にも３条以上の通電部材を
用いて構成してもよく、その場合に通電部材に対
する給電状態を制御回路により種々変更させて発
光体素子４の点灯パターンを任意に変更できるこ
とはいうまでもない。 In addition, in the above embodiment, the two strips of bare conductors 2 and 3
This is just an example of configuring a current-carrying member.
A conductor coated with an insulating layer may be used in addition to the bare conductor, and three or more current-carrying members may be used instead of two, and in that case, the power supply state to the current-carrying member may be controlled by a control circuit. It goes without saying that the lighting pattern of the light emitting elements 4 can be arbitrarily changed by making various changes.
第２図、第３図は、本考案の第二の実施例を示
したもので、芯材１の外周面に予め凸部１ａをス
パイラル状に形成したものを示しており、第一の
実施例と対応する部分には同一符号を付してあ
る。 2 and 3 show a second embodiment of the present invention, in which a convex portion 1a is formed in advance in a spiral shape on the outer circumferential surface of the core material 1. Parts corresponding to those in the example are given the same reference numerals.
このような実施例の場合は、芯材１の外周面に
設けた凸部１ａが偏平な通電部材２，３を巻付け
る際に、ガイド溝として作用するのでその巻付け
作業が極めて容易となり、しかもこのような凸部
１ａはスパイラル状に巻付けた通電部材２，３同
士が接触するのを阻止する絶縁スペーサとしての
作用もあるので、発光表示体Ａの折曲時に通電部
材２，３同士が互いに接触するのを確実に防止で
き、発光表示体Ａの導電部材同士が接触事故を生
じるのを防止して信頼性の高いものにできる。な
お、このような凸部１ａは、偏平な通電部材を複
数設けた場合において、発光体素子４のアノード
側の通電部材を互いに絶縁分離する場合に有効で
あり、このような場合に使用すれば、発光表示体
Ａを折曲げたり、捩じつたりした時に通電部材同
士が不用意に接触して発光表示体Ａを誤動作（誤
点灯）させたり、無用な接触事故を発生すること
を未然に防止できる利点がある。 In the case of such an embodiment, the convex portion 1a provided on the outer circumferential surface of the core material 1 acts as a guide groove when winding the flat current-carrying members 2 and 3, so that the winding operation becomes extremely easy. Furthermore, such a convex portion 1a also acts as an insulating spacer to prevent the spirally wound current-carrying members 2 and 3 from coming into contact with each other, so that when the light-emitting display body A is bent, the current-carrying members 2 and 3 do not come into contact with each other. It is possible to reliably prevent the conductive members of the light-emitting display A from coming into contact with each other, and it is possible to prevent the conductive members of the light-emitting display A from coming into contact with each other, thereby making it highly reliable. Note that such a convex portion 1a is effective in insulating and separating the current-carrying members on the anode side of the light-emitting element 4 from each other when a plurality of flat current-carrying members are provided, and if used in such a case, , to prevent unnecessary contact accidents such as malfunction (erroneous lighting) of the light-emitting display A due to inadvertent contact between current-carrying members when the light-emitting display A is bent or twisted. It has the advantage of being preventable.
以上に示した実施例では、いずれも発光体素子
に半導体チツプを用いたものについて説明した
が、本考案はこのようなものに限定されず、発光
体素子としては第４図イ，ロに示したような半導
体チツプ４を予め透光性の熱硬化性樹脂４０′内
に封入して形成された固体ランプ４′を使用して
構成してもよい。このような固体ランプ４′を半
導体チツプ４の代わりに用いて発光表示体Ａを構
成した場合には、半導体チツプ４のようにその
上、下部をボンデイングワイヤや銀ペーストを用
いて通電部材に逐一接続する必要がなく、第５図
に示したように、固体ランプ４′の両側より導出
した接続リード４１′，４２′をそれぞれに対応し
た側の通電部材に蝋付け接続して構成すればよ
い。 In the embodiments shown above, a semiconductor chip is used as the light-emitting element, but the present invention is not limited to such a device, and the light-emitting element is shown in FIGS. A solid state lamp 4' may be used, which is formed by encapsulating a semiconductor chip 4 such as the one described above in a translucent thermosetting resin 40'. When such a solid-state lamp 4' is used in place of the semiconductor chip 4 to constitute the light-emitting display A, the upper and lower parts of the solid-state lamp 4', like the semiconductor chip 4, are connected to current-carrying members one by one using bonding wires or silver paste. There is no need for any connection, and as shown in FIG. 5, the connection leads 41' and 42' led out from both sides of the solid-state lamp 4' can be connected to the corresponding current-carrying members by brazing. .
また、このような固体ランプ４′を用いて構成
する時は、半導体チツプ４が透光性の熱硬化性樹
脂内に予め封入され、強化されているので、半導
体チツプを取り扱う時のようにデリケートな取扱
を要せず、製造が容易になる利点もある。 Furthermore, when constructing a structure using such a solid-state lamp 4', the semiconductor chip 4 is pre-encapsulated in a translucent thermosetting resin and reinforced, so it cannot be handled delicately, such as when handling a semiconductor chip. It also has the advantage that it does not require heavy handling and is easy to manufacture.
しかして、上記のような構造の本考案の発光表
示体Ａは所定の長さを有した棒体や連続した棒体
などに形成され、特に後者のように形成した場合
には電線コードのように不図示のドラムなどに巻
回され、使用時には任意の長さに切断され、任意
の形状に折曲あるいは捩じられて使用される。 Therefore, the light-emitting display A of the present invention having the above-mentioned structure is formed into a rod having a predetermined length or a continuous rod, and especially when formed in the latter manner, it can be formed into a shape such as an electric wire cord. It is wound around a drum (not shown), and when used, it is cut to an arbitrary length and bent or twisted into an arbitrary shape.
以上の構造の本考案によれば、作用及び効果の
欄において述べたような特有の作用、効果が奏さ
れるものであり、しかも列状に配置された発光ダ
イオードなの発光体素子を、発光面側を透光性素
材で形成した可撓性合成樹脂被包体内に封入して
成る基本的構造を有していることから、実願昭59
−57550号と同様な次の如き効果も同時に奏され
るものである。 According to the present invention having the above structure, the unique functions and effects described in the section of functions and effects are achieved, and moreover, the light-emitting elements such as light-emitting diodes arranged in a row are arranged on the light-emitting surface. Since it has a basic structure of being enclosed in a flexible synthetic resin envelope whose sides are made of a translucent material,
The following effects similar to No. -57550 are also produced at the same time.
すなわち、
(1) 折曲したり、湾曲したりするだけで任意の形
状の発光表示体が得られる。 That is, (1) a light-emitting display of any shape can be obtained simply by bending or curving.
(2) 接着材やビス等を用いれば簡単に取付けでき
るので、各々の発光体素子を半田付けなどによ
り逐一実装する面倒さはなく、取付が極めて便
利である。(2) Since it can be easily attached using adhesives, screws, etc., there is no need to mount each light emitting element one by one by soldering, etc., and the attachment is extremely convenient.
(3) 発光表示体の点灯、点滅動作に必要な通電部
材はすべて被包体内に封入されているので、そ
の配線手間は不要である。(3) All the current-carrying members necessary for the lighting and blinking operations of the light-emitting display are enclosed within the envelope, so there is no need for wiring.
(4) 発光体素子の各々は、合成樹脂で水密封止さ
れているので屋外に使用するには好都合であ
る。このような利点のため、ネオンサインの代
用としての広告用の文字灯やデイスプレイの装
飾灯、トラツク等の巻き込み事故防止ガイドな
どに取付けて好適に使用できる。(4) Each of the light-emitting elements is water-tightly sealed with synthetic resin, making it convenient for outdoor use. Because of these advantages, it can be suitably used by being attached to advertising letter lights as a substitute for neon signs, decorative lights for displays, and accident prevention guides for trucks and the like.
(5) 発光体素子として発光ダイオードを用いた場
合には、その材料に特有な純度の高い単色光に
近い美しい光を放射するのでデイスプレイ用の
装飾灯として使用するには特に好適であるうえ
に、球切れがなく、消費電力も少ないので、寿
命が長く、トータルコストが安いなどの利点も
ある。(5) When a light-emitting diode is used as a light-emitting element, it emits beautiful light close to monochromatic light with a high degree of purity peculiar to the material, so it is particularly suitable for use as a decorative light for a display. , there are no bulb burnouts, low power consumption, long life, and low total cost.
第１図は本考案の第一の実施例における要部の
斜視図、第２図は第二の実施例を示す要部の斜視
図、第３図は第二の実施例における芯材の斜視
図、第４図イ及びロは発光体素子として使用され
る固体ランプの一例を示す縦断面、第５図は本考
案の更に他例を示す要部の斜視図、第６図は発光
体素子を含む発光部の縦断面構造図である。
符号の説明、Ａは本考案の発光表示体、１は可
撓性素材で形成された芯材、２，３は偏平な導電
部材で形成された通電部材、４，４′はそれぞれ
発光体素子を構成する半導体チツプ、固体ラン
プ、５は可撓性合成樹脂被包体である。
Fig. 1 is a perspective view of the main parts in the first embodiment of the present invention, Fig. 2 is a perspective view of the main parts showing the second embodiment, and Fig. 3 is a perspective view of the core material in the second embodiment. Figures 4A and 4B are longitudinal cross-sections showing an example of a solid-state lamp used as a light-emitting element, Figure 5 is a perspective view of a main part showing still another example of the present invention, and Figure 6 is a light-emitting element. FIG. Explanation of the symbols: A is the light-emitting display of the present invention, 1 is a core material made of a flexible material, 2 and 3 are current-carrying members made of a flat conductive member, and 4 and 4' are light-emitting elements, respectively. 5 is a flexible synthetic resin encasing.
Claims (1)
周に、複数の連続した偏平な通電部材をスパイ
ラル状に巻付けるとともに、これらの通電部材
間に発光体素子を接続し、さらにその全体を発
光体素子の発光面側を少なくとも透光性素材で
形成した可撓性合成樹脂で封入して成る折曲可
能な発光表示体。 (2) 上記発光体素子が、半導体チツプにより構成
されたものである実用新案登録請求の範囲第１
項記載の折曲可能な発光表示体。 (3) 上記発光体素子が、半導体チツプを予め透光
性の熱硬化性樹脂内に封入して形成された固体
ランプにより構成されたものである実用新案登
録請求の範囲第１項記載の折曲可能な発光表示
体。[Claims for Utility Model Registration] (1) A plurality of continuous flat current-carrying members are spirally wound around the outer periphery of a core material made of a flexible insulating material, and a plurality of continuous flat current-carrying members are wound between these current-carrying members. A bendable light-emitting display body comprising light-emitting elements connected to each other and the entire body being encapsulated with a flexible synthetic resin made of a light-transmitting material at least on the light-emitting surface side of the light-emitting elements. (2) Utility model registration claim 1, in which the light emitting element is constituted by a semiconductor chip
The bendable light-emitting display described in Section 1. (3) The folding device according to claim 1, wherein the light emitting element is constituted by a solid-state lamp formed by encapsulating a semiconductor chip in a translucent thermosetting resin in advance. A bendable light-emitting display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984171489U JPH0132066Y2 (en) | 1984-11-12 | 1984-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984171489U JPH0132066Y2 (en) | 1984-11-12 | 1984-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6185894U JPS6185894U (en) | 1986-06-05 |
| JPH0132066Y2 true JPH0132066Y2 (en) | 1989-10-02 |
Family
ID=30729173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984171489U Expired JPH0132066Y2 (en) | 1984-11-12 | 1984-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0132066Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121808A (en) * | 1997-10-15 | 1999-04-30 | Idec Izumi Corp | Device for led display |
-
1984
- 1984-11-12 JP JP1984171489U patent/JPH0132066Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6185894U (en) | 1986-06-05 |
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