JPS6185894U - - Google Patents

Info

Publication number
JPS6185894U
JPS6185894U JP1984171489U JP17148984U JPS6185894U JP S6185894 U JPS6185894 U JP S6185894U JP 1984171489 U JP1984171489 U JP 1984171489U JP 17148984 U JP17148984 U JP 17148984U JP S6185894 U JPS6185894 U JP S6185894U
Authority
JP
Japan
Prior art keywords
light
emitting
utility
carrying members
bendable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984171489U
Other languages
Japanese (ja)
Other versions
JPH0132066Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984171489U priority Critical patent/JPH0132066Y2/ja
Publication of JPS6185894U publication Critical patent/JPS6185894U/ja
Application granted granted Critical
Publication of JPH0132066Y2 publication Critical patent/JPH0132066Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の第一の実施例における要部の
斜視図、第２図は第二の実施例を示す要部の斜視
図、第３図は第二の実施例における芯材の斜視図
、第４図イ及びロは発光体素子として使用される
固体ランプの一例を示す縦断面、第５図は本考案
の更に他例を示す要部の斜視図、第６図は発光体
素子を含む発光部の縦断面構造図である。 （符号の説明）、Ａは本考案の発光表示体、１
は可撓性素材で形成された芯材、２，３は偏平な
導電部材で形成された通電部材、４，４′はそれ
ぞれ発光体素子を構成する半導体チツプ、固体ラ
ンプ、５は可撓性合成樹脂被包体である。 Fig. 1 is a perspective view of the main parts in the first embodiment of the present invention, Fig. 2 is a perspective view of the main parts showing the second embodiment, and Fig. 3 is a perspective view of the core material in the second embodiment. Figures 4A and 4B are longitudinal cross-sections showing an example of a solid-state lamp used as a light-emitting element, Figure 5 is a perspective view of a main part showing still another example of the present invention, and Figure 6 is a light-emitting element. FIG. (Explanation of symbols), A is the light emitting display of the present invention, 1
2 and 3 are current-carrying members made of a flat conductive material; 4 and 4' are semiconductor chips and solid lamps constituting light-emitting elements, respectively; and 5 is a flexible material. It is a synthetic resin encapsulant.

Claims (1)

【実用新案登録請求の範囲】 (1) 可撓性絶縁素材によつて形成された芯材の
外周に、複数の連続した偏平な通電部材をスパイ
ラル状に巻付けるとともに、これらの通電部材間
に発光体素子を接続し、さらにその全体を発光体
素子の発光面側を少なくとも透光性素材で形成し
た可撓性合成樹脂で封入して成る折曲可能な発光
表示体。 (2) 上記発光体素子が、半導体チツプにより構
成されたものである実用新案登録請求の範囲第１
項記載の折曲可能な発光表示体。 (3) 上記発光体素子が、半導体チツプを予め透
光性の熱硬化性樹脂内に封入して形成された固体
ランプにより構成されたものである実用新案登録
請求の範囲第１項記載の折曲可能な発光表示体。[Claims for Utility Model Registration] (1) A plurality of continuous flat current-carrying members are spirally wound around the outer periphery of a core material formed of a flexible insulating material, and a plurality of continuous flat current-carrying members are wound between these current-carrying members. A bendable light-emitting display body comprising light-emitting elements connected to each other and the entire body being encapsulated with a flexible synthetic resin made of a translucent material at least on the light-emitting surface side of the light-emitting elements. (2) Utility model registration claim 1, in which the light emitting element is constituted by a semiconductor chip
The bendable light-emitting display described in Section 1. (3) The utility model according to claim 1, wherein the light-emitting element is constituted by a solid-state lamp formed by encapsulating a semiconductor chip in a translucent thermosetting resin in advance. A bendable light-emitting display.
JP1984171489U 1984-11-12 1984-11-12 Expired JPH0132066Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984171489U JPH0132066Y2 (en) 1984-11-12 1984-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984171489U JPH0132066Y2 (en) 1984-11-12 1984-11-12

Publications (2)

Publication Number Publication Date
JPS6185894U true JPS6185894U (en) 1986-06-05
JPH0132066Y2 JPH0132066Y2 (en) 1989-10-02

Family

ID=30729173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984171489U Expired JPH0132066Y2 (en) 1984-11-12 1984-11-12

Country Status (1)

Country Link
JP (1) JPH0132066Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121808A (en) * 1997-10-15 1999-04-30 Idec Izumi Corp Device for led display

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121808A (en) * 1997-10-15 1999-04-30 Idec Izumi Corp Device for led display

Also Published As

Publication number Publication date
JPH0132066Y2 (en) 1989-10-02

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