JPH01315175A - Trimming of temperature sensor ic wafer - Google Patents

Abstract

PURPOSE:To obtain an inexpensive temperature sensor IC chip with high precision by comparing with a standard wafer to trim a first temperature sensor IC chip, calibrating it on temperature to detect an offset, making a reference of the quantity in which the offset is subtracted from the standard wafer and trimming other temperature sensor IC chips. CONSTITUTION:An end is connected to a first temperature sensor IC chip 31 at the approximately center position and a connector 4 electrically connected to a wiring pattern 311 by the use of a temperature sensor IC wafer 3 in which the wiring pattern 311 arranged on the periphery of a wafer 3 is provided is attached to the other end. It is compared with the standard wafer 1 to trim a first temperature sensor IC chip. The first temperature sensor IC chip is calibrated with respect to temperature, with the temperature sensor IC wafer 3 intact, to detect an offset, and trimming of the other temperature sensor IC chips of the temperature sensor IC wafer 3 is performed by making a reference of the quantity in which the offset is subtracted from a standard reference wafer 1. Thereby an inexpensive temperature sensor IC chip with high precision can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for trimming a temperature sensor IC (temperature sensor integrated circuit) wafer.

More specifically, the present invention provides a highly accurate temperature sensor IC.
This invention relates to a wafer trimming method.

<Prior Art> FIG. 4 is a process explanatory diagram of a conventional example commonly used, and FIG. 5 is a conceptual diagram of the process of FIG. 4.

In FIG. 4, (A) is the first trimming step.

In the trimming step (A), as shown in FIG. 5 (A3), the vertical and horizontal portions 21 of the temperature sensor IC wafer 2 to be trimmed are trimmed using the reference wafer 1 as a reference TREF.

FIG. 4(B) shows the first dicing step. Figure 5 (B
), the ten-piece portion 21 is diced from the temperature sensor IC wafer 2.

FIG. 4(C) shows the first packaging step.

As shown in FIG. 9(C), the ten-piece portion 21 is packaged for each individual temperature sensor IC chip 211.

FIG. 4(D) shows the temperature calibration process. As shown in FIG. 5(D), the reference wafer 1 is placed in a constant temperature bath D1, temperature is calibrated using, for example, a digital voltmeter, and the offset ToFS of the reference wafer 1 is detected.

FIG. 4(E) shows the second trimming step. Figure 5 (E
), the parts of the temperature sensor IC wafer 2 other than the jubunji part 21 of the temperature sensor IC wafer 2, 22, 2
3,24.25 (Figure 5 (B)) For each part,
Reference TRE F-offset T by reference wafer 1. Each temperature sensor IC chip is trimmed based on the FS.

FIG. 4(F) shows the second guishing process. Figure 5 (F
), the temperature sensor IC part 2, 2
2.23, 24.25 portions are each diced into each temperature sensor IC chip.

FIG. 4(G) shows the second packaging step. Figure 5 (G
), each individual temperature sensor IC chip is packaged.

<Problems to be Solved by the Invention> However, in such a method, a dicing process (B) and a bulkaging process (C) are performed in order to detect the offset, resulting in a long lead time.

Further, the temperature sensor TC chip that detects the offset is a separate chip, and the trimming wafers 22, 23, 2 to be trimmed are trimmed by taking the offset into account.
4.25 is in a wafer state, so trimming with higher precision cannot be performed.

The present invention solves this problem.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for trimming a temperature sensor IC wafer with which a highly accurate and inexpensive temperature sensor IC chip can be obtained.

<Means for Solving the Problems> In order to achieve this object, the present invention provides a method for trimming a temperature sensor IC wafer on which a plurality of temperature sensor IC chips are formed. A temperature sensor IC wafer is provided with a wiring pattern, one end of which is connected to a predetermined first temperature sensor IC chip, and the other end of which is disposed around the periphery of the temperature sensor IC wafer, and is electrically connected to the wiring pattern. attaching a connector, trimming the first temperature sensor IC chip by comparing it with a standard reference wafer, calibrating the temperature of the first temperature sensor IC chip while the temperature sensor IC wafer is in place, and detecting an offset;
A method for trimming a temperature sensor IC wafer, characterized in that other temperature sensor IC chips of the temperature sensor IC wafer are trimmed using an amount obtained by subtracting the offset from the standard reference wafer as a reference. It is.

In the above method, the first temperature sensor IC chip is trimmed by comparing it with the reference reference wafer, the temperature of the first temperature sensor IC chip is calibrated to detect the offset while the temperature sensor IC wafer remains, and the offset is detected. Since the amount obtained by subtracting the offset from the wafer is used as a reference to trim other temperature sensor IC chips on the temperature sensor IC wafer, the first dicing process and the first There is no need to perform a packaging process.

In addition, in the conventional example, the temperature sensor IC chip that detects the offset is a separate chip, and since the trimming wafer to be trimmed is in a wafer state, taking the offset into account, trimming can be performed with higher precision. Although it cannot be carried out, in the present invention, the offset of the first temperature sensor IC chip is detected and the same wafer is trimmed, so there is little error.

Hereinafter, a detailed explanation will be given based on examples.

<Example> FIG. 1 is a process explanatory diagram of an embodiment of the present invention.

In FIG. 1, (A) is the first trimming step.

In this case, the temperature sensor IC wafer to be trimmed is
As shown in FIG. 2, a wiring pattern 311 has one end connected to a predetermined first temperature sensor IC chip 31 located approximately in the center of the temperature sensor IC wafer 3, and the other end arranged at the periphery of the temperature sensor IC wafer. Temperature sensor I equipped with
Using the C wafer 3, as shown in FIG. 3, a connector 4 that is electrically connected to the wiring pattern 311 is attached,
Thereafter, as in the conventional example, the first temperature sensor IC chip 31 is trimmed by comparing it with the standard reference wafer 1.

FIG. 1(B) shows a temperature calibration process. temperature sensor ic
With wafer 3 still in use, calibrate the temperature of the first temperature sensor IC chip and set the offset T. Detect FS.

FIG. 1(C) shows the second trimming step. In the second trimming process, an offset T is applied from the standard reference wafer 1. Using the amount obtained by subtracting FS as a reference, other temperature sensor IC chips on the temperature sensor IC wafer 3 are trimmed.

Thereafter, similarly to the conventional example, the temperature sensor IC wafer 3 is subjected to a dicing process (D) and a bulk gauge process (E).

In the above method, since the wiring pattern 311 is provided, the first temperature sensor IC chip 31 is trimmed by comparing it with the standard reference wafer 1, and the temperature of the first temperature sensor IC chip 31 is calibrated using the temperature sensor IC wafer 3. offset can be detected.

Also, using the amount obtained by subtracting the offset from the standard reference wafer 1 as a reference, the temperature sensor IC wafer 3
Since the other temperature sensor IC chips in the same wafer are trimmed, there is no need to perform the first guising process and the first bagging process for detecting an offset as in the conventional example.

Further, in the conventional example, the temperature sensor IC chip 211 for detecting the offset is a separate chip,
On the other hand, since the trimming wafers 22, 23° and 24.25 to be trimmed are in a wafer state by taking the offset into account, it is not possible to perform trimming with higher precision. tC chip 31
Since the offset of the wafer is detected and trimming is performed on the same wafer, there are few errors.

Therefore, a method for trimming a temperature sensor IC wafer is obtained that provides a highly accurate and inexpensive temperature sensor IC chip.

<Effects of the Invention> As explained above, the present invention provides a plurality of temperature sensor ICs.
In a method for trimming a temperature sensor IC wafer on which a chip has been formed, one end is connected to a predetermined first temperature sensor IC chip located approximately at the center of the temperature sensor IC wafer, and the other end is arranged at the periphery of the temperature sensor IC wafer. A connector electrically connected to the wiring pattern is attached to a temperature sensor IC wafer provided with a wiring pattern, and the first temperature sensor IC chip is trimmed by comparing it with a standard reference wafer. calibrating the temperature of the first temperature sensor IC chip as an IC wafer and detecting the offset;
A method for trimming a temperature sensor IC wafer, characterized in that other temperature sensor IC chips of the temperature sensor IC wafer are trimmed using an amount obtained by subtracting the offset from the standard reference wafer as a reference. It is.

As a result, (1) Since the wiring pattern was provided, the first temperature sensor IC chip was trimmed by comparing it with the standard reference wafer, and the temperature of the first temperature sensor IC chip was calibrated using the temperature sensor IC wafer to detect the offset. I can do it.

In addition, other temperature sensor IC chips in the same wafer of the temperature sensor IC wafer are trimmed using the amount obtained by subtracting the offset from the standard reference wafer as a reference, so that the amount obtained by subtracting the offset from the standard reference wafer is used as a reference. , it is not necessary to perform the first dicing process and the first part gauging process.

(2) In the conventional example, the temperature sensor IC chip that detects the offset is a separate chip;
Since the trimming wafer to be trimmed is in a wafer state, it is not possible to perform trimming with higher precision by taking the offset into account in calculation, but in the present invention, the offset of the first temperature sensor IC chip is detected, Since trimming is performed on the same wafer, there are few errors.

Therefore, according to the present invention, a highly accurate and inexpensive temperature sensor I
A method for trimming a temperature sensor IC wafer that yields C chips can be realized.

[Brief explanation of the drawing]

FIG. 1 is a process explanatory diagram of an embodiment of the present invention, FIGS. 2 and 3 are explanatory diagrams of FIG. 1, and FIG. 4 is a process explanatory diagram of a conventional example commonly used. Figure 5 is a conceptual diagram of one culm in Figure 4. 1... Reference wafer, 3... Temperature sensor IC
Wafer, 31...first temperature sensor IC1311...
Wiring pattern, 4...connector.

Claims (1)

[Claims] In a method for trimming a temperature sensor IC wafer on which a plurality of temperature sensor IC chips are formed,
A temperature sensor IC wafer is provided with a wiring pattern, one end of which is connected to a predetermined first temperature sensor IC chip located approximately at the center of the wafer, and the other end of which is disposed at the periphery of the temperature sensor IC wafer. trim the first temperature sensor IC chip by comparing it with a standard reference wafer, calibrate the temperature of the first temperature sensor IC chip while using the temperature sensor IC wafer, and offset the temperature of the first temperature sensor IC chip. A method for trimming a temperature sensor IC wafer, characterized in that the other temperature sensor IC chips of the temperature sensor IC wafer are trimmed using the amount obtained by subtracting the offset from the standard reference wafer as a reference. .