JPH01309981A - Etching device - Google Patents

Abstract

PURPOSE:To improve the accuracy of etching by spraying an etching soln. while vibrating soln. feeding pipes arranged in prescribed directions so as to prevent asymmetric etching in the flowing direction ot the etching soln. due to a pool of the soln. CONSTITUTION:This etching device is composed essentially of a longsized, plate shaped etching member (mask material) 10 with a resist film having a prescribed pattern formed on the surface and a spray device. This device is composed of a first spray part 9a including soln. feeding pipes 30 arranged so as to make the axes of the pipes 30 parallel to the transfer direction 11 of the member 10 and a second spray part 9b including soln. feeding pipes 30 arranged so as to make the axes of the pipes 30 perpendicular to the direction 11. An etching soln. is sprayed on the surface of the member 10 from spray nozzles while vibrating the pipes 30.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an etching apparatus, and particularly to an etching apparatus suitable for etching a shadow mask for a color cathode ray tube.

(Prior art) A color cathode ray tube has a panel (1
) Fluorescent screen consisting of three color phosphor layers formed on the inner surface (2)
A shadow mask (3) is attached to the inner side of the mask. This shadow mask (3) is a funnel (
The purpose is to select the three electron beams emitted from the electron gun (6) disposed in the neck (5) of 4) and make them strike the three-color phosphor layer correctly, and the phosphor screen ( A large number of electron beam passage holes are formed in the main body portion (7) facing the electron beam 2).

With the spread of large-sized televisions, the color cathode ray tubes are required to have larger shadow masks attached inside them, and to have high dimensional accuracy.

Conventionally, the above-mentioned S-X7 mask has been manufactured by a photo-processing method. The formation process is (a)
A photoresist film forming process in which a photosensitive liquid is applied to both sides of a plate-shaped mask material such as aluminum quilt low carbon steel or amber to form a film. an exposure step in which a pattern corresponding to the hole is printed; (c) a development step in which the exposed photoresist film is developed to form a resist film having a pattern corresponding to the electron beam passage hole; and (d) a step in which the resist film is formed. The main process is an etching process in which the mask material is etched to form electron beam passage holes, and if necessary, burning of the resist film is performed after development (before etching).

Moreover, in manufacturing shadow masks that require mass production, the mask material is used as a long length without being cut into pieces, and etching is performed using a plurality of etching chambers arranged in rows, as shown in FIG. This is done in (9a) and (9b). The etching device includes a drive device (not shown) that moves the long mask material (10) on which the resist film is formed in the longitudinal direction as shown by the arrow (11) with its plate surface horizontal. , and a plurality of support rollers (12
), and in particular, a spray device shown in FIG. 8 is installed inside each etching chamber (9a), (9b). This spray device faces the plate surface of the mask material (9) and sprays the mask material (9)
A plurality of liquid supply pipes (13) are arranged in parallel with the moving direction of the liquid supply pipes (12) being in the pipe axis direction, and a plurality of spray nozzles (14) are installed along the pipe axis direction of each of the liquid supply pipes (12). Then, each liquid supply pipe (13) is moved at a predetermined angle in the width direction orthogonal to the moving direction of the mask material (10) as shown by the arrow (15) (see FIG. 8(B)) by a swinging mechanism (not shown). It has a MA structure that allows it to swing at an angle of ±20° (for example).

In this etching apparatus, the etching liquid sprayed from each spray nozzle (14) onto the surface of the mask material (10) is distributed at the center of the surface of the mask material (10) as shown by arrows (17a) and (17b) in FIG. It flows towards both edges in the width direction and falls from the side edges. Note that the etching liquid remaining on the plate surface is removed by a wiping roller (18) arranged in parallel with the support roller (12).

Thus, holes (electron beam passage holes) penetrating both surfaces are etched corresponding to the pattern of the resist film formed on the plate surface while passing through a plurality of etching chambers (9).

By the way, the flow toward the side edge in the width direction is closely related to the swinging of the liquid supply pipe (13), as shown in FIG. 9(A).
As shown in the figure, when the spray nozzle (14) is inclined toward one side edge (20a) of the mask material (10), the flow flows in the direction of the arrow (17a), and the flow is directed toward the one side edge (20a) of the mask material (10). It is strong on the 20a) side and weak on the other side edge (20b). Further, as shown in the same figure (B), when the spray nozzle (14) is inclined toward the other side edge (20b), the flow flows in the direction of the arrow (17b), and the flow is directed toward the other side edge (20b). It is strong on the (20b) side and weak on one side edge (20a) side. As a result, when the liquid supply pipe (13) is repeatedly rocked,
The etching liquid flows toward both widthwise edges of the mask material (10) with the center as a boundary.

Therefore, as shown in FIG. 10, for example, the long sleeve of the rectangular electron beam passage hole (21) is set in the direction of movement of the mask material (10) (direction of arrow (11)), and the shadow mask (3)
), the results are shown in Figures 11 (A) to (C).
) As shown in the figure, as etching progresses in one side line part, an etching liquid pool (21) is formed on the side wall of the concave hole near one side edge, and as a result, the etching speed decreases. , the aperture (22) becomes asymmetrical. This phenomenon also occurs at the other side edge. In addition, in these cases, since this occurs on the long side of the recessed hole (22), the asymmetry becomes noticeable. In addition, as shown in FIG. 12, the long axis of the rectangular electron beam passing hole (21) is aligned with the mask material (1
Shadow mask (
3), the same phenomenon occurs as shown in Figures 13(8) to 13(C), resulting in asymmetrical openings (2).
2) I can do it. In addition, in FIGS. 11 and 13, (?3) is a film that is applied to the regimen 1 formed on both sides of the mask material (10).

(Problems to be Solved by the Invention) As described above, the conventional etching device for shadow masks for color cathode ray tubes uses a spray device that sprays etching solution onto a mask material supported with the plate surface horizontal. The tubes are arranged in parallel with the direction in which the mask material moves as the longitudinal direction, and the etching liquid is sprayed while the liquid supply tubes are swung in a direction perpendicular to the direction in which the mask material moves. Therefore, the etching liquid sprayed on the plate surface of the mask material flows from the center of the mask material toward the widthwise side edge perpendicular to the direction of movement, and due to the liquid pool created by this flow, the etching solution spreads across the width. There is a problem in that the openings near the side edges become asymmetrical, making it impossible to form the shape and dimensions of the electron beam passing holes in the shadow mask with a predetermined precision.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to configure an etching device that accurately etches a long plate-shaped etching member having a predetermined pattern formed on the plate surface. .

[Structure of the Invention] (Means for Solving the Problems) In an etching apparatus that etches a long plate-shaped etching member on which a resist film of a predetermined pattern is formed on the plate surface while moving the plate surface horizontally, a spray The device has a structure in which a plurality of spray nozzles are attached along the axial direction of the liquid supply pipe, and the etching liquid is sprayed from the spray nozzles while swinging the liquid supply pipe, and the liquid supply pipe is used to move the etching member. The spray part is composed of a first spray part arranged with its longitudinal direction as the longitudinal direction, and a second spray part arranged with its longitudinal direction perpendicular to the moving direction of the etching member.

(Function) As described above, the spray device is arranged such that the swinging liquid supply pipe is arranged with the first spray part arranged with the longitudinal direction in the direction of movement of the etching member and the longitudinal direction in the direction orthogonal to the direction of movement of the etching member. If the structure is combined with the second spray part, the flow of the etching liquid is prevented from occurring on the plate surface of the etching member due to the swinging of the liquid supply pipe, and the first spray part directs the flow of the etching liquid in a direction perpendicular to the direction of movement of the etching member. In addition, the second spray section can be moved in the same direction as the etching member, and as a result, the asymmetry of etching caused by pooling of the etching solution in the flow direction can be eliminated. .

(Example) Hereinafter, the present invention will be described based on an example with reference to the drawings.

FIGS. 1 and 2 show the main structure of a shadow mask etching apparatus for a color cathode ray tube, which is an embodiment of the present invention. This etching device uses a long plate-shaped mask material (10) (etching member) on both sides of which a resist film with a pattern corresponding to the electron beam passage hole is formed.
A drive device (not shown) that moves the mask material (
It has a moving mechanism including a support roller (12) that horizontally supports the plate surface of 10). In addition, the above mask material (1
A plurality, preferably an even number, of etching chambers (9a), (9b), . This etching chamber (9a),
(9b) ... is the mask material (
10), and each etching chiton bar (9a), (9b),
Inside, a plurality of long liquid supply pipes (30) are arranged in parallel, facing both sides of the mask material (10). A plurality of spray nozzles (14) are attached to each liquid supply pipe (30) at a predetermined pitch along the pipe axis. Each liquid supply pipe (30) is configured to swing, for example, about its pipe axis by a swing mechanism (not shown).

Moreover, the etching apparatus of this example has the above-mentioned liquid supply pipe (30
) are arranged in parallel in the first etching chamber (9a) with the moving direction of the mask material (10) being the tube axis direction, and the second etching chamber (9a) adjacent to this first etching chamber (9a) is 9b), they are arranged in parallel with the direction perpendicular to the moving direction of the mask tube (10) being the tube axis direction. In other words, the liquid supply pipe (30) is -
a plurality of etching chambers arranged in rows [9a);
(9b) are arranged alternately in the moving direction of the mask material (10) and in the direction orthogonal thereto.

In FIG. 2, a pair of upper and lower rollers (18) arranged in parallel with the support roller (12) are wiping rollers for wiping off the etching solution on the plate surface.

By the way, if the liquid supply pipe (30) is arranged as described above,
In the first etching chamber (9a) in which the liquid supply pipes (30) are arranged in parallel in the direction of movement of the mask material (10), the etching liquid sprayed onto the plate surface of the mask element IJ (10) is As shown by arrows (17a) and (17b) in FIG. 2, as in the conventional etching device, the flow flows in the width direction perpendicular to the moving direction with the center of the plate surface as the boundary.

In addition, in the second etching chamber (9b), the liquid supply pipes (30) are arranged in parallel with the longitudinal direction perpendicular to the moving direction of the mask material (10), so the arrow (31a) in FIG. , as shown in (31b), causes a flow in the moving direction of the mask material (10). As a result, the asymmetry of the opening caused by the liquid pooling in the flow direction of the etching solution due to the flow in directions orthogonal to each other is alleviated, and the inner surface of the opening is uniformly etched to form a predetermined shape with good symmetry. It is possible to form an electron beam passage hole of the same size as the electron beam. In particular, if the number of etching chambers is an even number and the arrangement of the liquid supply pipes (30) is alternately arranged as described above, the overall etching balance can be maintained. It is possible to form an electron beam passage hole of any shape and size.

As an example of a shadow mask for a 32-inch color cathode ray tube, an aluminum-quilted low-carbon steel plate with a thickness of 0.25 mm and a width of 610 mm is used, and a photoresist film containing Kabin as the main component is formed on both sides of the plate. A pair of original plates with negative patterns of the following dimensions are brought into close contact with this photoresist film, exposed to light using an ultra-high-pressure mercury lamp, developed, dried, and then burned to create patterns corresponding to the negative patterns of the pair of original plates on both sides of the mask material. A resist film was formed. after that,
The mask material on which the Regime 1 film was formed was etched using the following etching apparatus with each plate surface horizontal.

Table 1 shows the negative pattern dimensions of the pair of original plates based on the pattern (33) of the original plate shown in FIG. 3.

The etching device shown in Table 1 below has four etching chambers each 6 m long arranged in a row, and the first and third etching chambers have liquid supply pipes arranged in parallel in the direction of movement of the mask material. The spray device placed also
The etching chamber is equipped with spray devices arranged in parallel in a direction perpendicular to the direction of movement of the mask material.

In this etching device, each liquid supply pipe is swung at a speed of ±20° for about 3 seconds per reciprocation, and about 2.9
Etching was carried out by spraying an etching solution (dichlorochloride solution) at a rate of 1/2 min.

As a result, it was possible to form apertures, that is, electron beam passage holes, having a predetermined shape and size with good symmetry over the entire surface of the shadow mask. Table 2 shows the aperture shape and dimensions based on the electron beam passage hole (21) shown in FIG. 4.

In the above embodiment, a shadow mask etching device for a color cathode ray tube was described.
It can be used for etching other than shadow masks.

[Effects of the Invention] A plurality of spray devices are installed along the longitudinal direction of an etching device that sprays an etching solution while keeping the plate surface of a long plate-shaped etching member on which a resist film of a predetermined pattern is formed on the plate surface horizontal. A first spray section has a structure in which the etching liquid is sprayed while swinging a liquid supply pipe to which a spray nozzle is attached, and the liquid supply pipe is arranged with the moving direction of the etching member in the tube axis direction, and When configured in combination with a second spray section arranged with the direction orthogonal to the direction perpendicular to the tube axis direction, the flow of etching liquid can be directed to the first spray without being generated on the plate surface of the etching member due to the swinging of the liquid supply tube. The spraying section can be sprayed perpendicularly to the direction of movement of the etching member, and the second spraying section can be sprayed in the same direction as the direction of movement of the etching member. It is possible to eliminate the asymmetry of etching that occurs due to this, and to perform predetermined etching with high precision.

[Brief explanation of the drawing]

1 to 4 are explanatory diagrams of one embodiment of the present invention, in which FIG. 1 is a plan view showing the configuration of an etching device for a shadow mask for a color cathode ray tube, and FIG. 2 is a perspective view showing the configuration of its main parts. , FIG. 3 is a diagram showing the shape and dimensions of the mask hole, FIG. 5 is a diagram showing the configuration of a color cathode ray tube, FIG. 6 is a plan view showing the configuration of a conventional shadow mask etching device for a color cathode ray tube, and FIG. Figure 7 is a perspective view showing the configuration of the main parts, Figures 8 (^) and (8) are a plan view showing the arrangement of the liquid supply pipes, and a sectional view taken along the line B-B in Figure (A), and Figure 9. Figures (A) and (B) are diagrams for explaining the relationship between the swing of the liquid supply pipe, the flow a3 of the etching liquid on the mask material plate surface, and the hole shape, respectively. Figures 11 (A) and 4φ (C) are diagrams showing the arrangement relationship with the beam passage holes, respectively. Figure 10 (C) shows the theory of asymmetrical apertures that occur corresponding to the front row of Figure 10, respectively.
FIG. 6 is an explanatory diagram of the asymmetry of the openings that occurs corresponding to the front row of the illustration. 9a...first etching chamber 9b...second etching chamber
Etching chamber 10...Mask material 12...Support roller 30...Liquid supply pipe agent Patent attorney Nobuhito Ogo 4 Figure rt Industry 6 Figure 7 Figure/3/4 Figure 4-/j Figure 9 Figure 10 Oki 11 Figure 12 Figure 13

Claims (1)

[Scope of Claims] A moving mechanism that moves a long plate-shaped etching member on which a resist film of a predetermined pattern is formed on the plate surface with the plate surface horizontal, and a liquid supply pipe that swings the liquid supply pipe. and a spray device that sprays an etching solution onto the plate surface of the etching member on which the resist film is formed from a plurality of spray nozzles installed along the axial direction of the tube, the spray device comprising: The liquid pipe is composed of a first spray part arranged with the moving direction of the etching member as the pipe axis direction, and a second spray part arranged with the pipe axis direction in the direction perpendicular to the moving direction of the etching member. An etching device characterized by: