JP2006144074A - Etching device and method for producing shadow mask using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an etching device which prevents local variation in etching occurring in an etching step of applying etching to the material to be etched by spray etching, and thereby provides improved yield in the production of a multi-faced shadow mask, and to provide a method for producing a shadow mask. <P>SOLUTION: The etching device is composed of: etching fluid feed pipes 21; spray nozzles 31 arranged at each etching fluid feed pipe 21 at prescribed intervals; a conveyer 42 for conveying the material 11 to be etched; an etching chamber 41; and an etching control net 51 arranged between each spray nozzle 31 and the material 11 to be etched, and the etching quantity for the material 11 to be etched is locally controlled by adjusting the meshes of the etching control net 51. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an etching apparatus for manufacturing a shadow mask for a color picture tube and a method for manufacturing a shadow mask, and more particularly to an etching apparatus with an improved etching method in an etching process in the shadow mask manufacturing process and a shadow using the etching apparatus. The present invention relates to a mask manufacturing method.

In general, a shadow mask type color picture tube has a shadow mask in which a large number of electron beam apertures are arranged at a predetermined pitch and are arranged in close proximity to and facing a phosphor screen.
This shadow mask was concentrated so that three electron beams corresponding to red, blue and green emitted from the electron gun were concentrated in the vicinity of one electron beam aperture, and corresponding to red, blue and green. This is one of the important members having a so-called color selection function that reproduces a color image by correspondingly colliding with a fluorescent screen.

Therefore, if the distortion of the electron beam aperture shape of the shadow mask, the distortion of the arrangement of the electron beam aperture and the corresponding phosphor, and the distortion of a certain distance between the shadow mask and the phosphor screen exceed the allowable range, However, this will cause serious troubles in characteristics such as deterioration of color purity.
Such an electron beam aperture of the shadow mask generally has a cross-sectional shape as shown in FIG. 6 in order to ensure a certain amount of passage even for an obliquely incident electron beam.

  That is, the opening 12 (hereinafter referred to as a large hole) on the phosphor screen side of the shadow mask made of the material to be etched 11 has a larger area than the opening 13 (hereinafter referred to as a small hole) on the electron gun side. The area of the large hole 12 reaches about three times the area of the small hole 13. The electron beam aperture of such a shadow mask is manufactured through the following processes.

Hereinafter, a method for manufacturing a shadow mask by a photoetching method will be described.
FIGS. 7A to 7C show an example of a processing shape in the shadow mask manufacturing main process, and FIGS. 8A to 8G show the shadow mask manufacturing main process.
A general method for manufacturing a shadow mask is to first perform an acceptance inspection of a material to be etched 11 made of a long metal strip such as an invar material made of an iron alloy, and the curl amount, material width, plate thickness, appearance, etc. It is inspected whether it is within the specified value (see FIG. 8A).
Next, a surface-treating process is performed on the material to be etched 11 made of a long strip-shaped metal thin plate, and a photoresist is applied to both surfaces and dried to form a resist film (see FIG. 8B).

  Next, with a continuous winding printer, pattern exposure is performed on the resist film with a predetermined exposure amount using an exposure mask having a predetermined pattern (in many cases, two masks on the front and back sides), and a predetermined chemical solution is used. Development, hardening, etc. are performed to form a resist pattern 15a for large holes on one surface of the material to be etched 11 and a resist pattern 15b for small holes on the other surface (FIG. 8C and FIG. 7). a)).

Next, the resist patterns 15a and 15b are used as a mask, and etching is performed by spray etching from both surfaces of the metal thin plate 11 with an etchant such as ferric chloride (see FIGS. 8D and 7B).
Next, the resist patterns 15a and 15b are peeled off with an alkali (NaOH) solution to form large holes 12 and small holes 13 on both surfaces of the material to be etched 11 (see FIGS. 8E and 7C). .
Further, the sheet is cut into a sheet (see FIG. 8 (f)), and inspections such as transmittance and appearance inspection are performed before shipment (see FIG. 8 (g)).

  As an etching method and an etching apparatus for producing a shadow mask having the large holes 12 and the small holes 13, as shown in FIGS. 5A and 5B, a plurality of corrosions are performed in parallel with the traveling direction of the material 11 to be etched. A method of continuously etching the material to be etched 11 by disposing a liquid supply pipe 21 and disposing spray nozzles at regular intervals in the corrosive liquid supply pipe 21 and spraying an etching solution from both sides of the material 11 to be etched. An apparatus has been proposed (see, for example, Patent Document 1).

The shadow mask etching apparatus is composed of a plurality of etching chambers. As shown in FIG. 5A, the etching chamber has a plurality of corrosive liquid supply pipes 21 in parallel with the traveling direction of the material to be etched 11. A spray nozzle 31 is disposed at each of the corrosive liquid supply pipes 21 at a predetermined interval, and an etching liquid is sprayed from the spray nozzle 31 to etch the material to be etched 11 from both sides. A large hole 12 and a small hole 13 having a predetermined size are formed in the substrate.
In order to make the hole shape of the material to be etched 11 uniform, the interval between the corrosive liquid supply pipes 21, the pitch of the spray nozzle 31, the spray pressure, the number of oscillations, etc. are adjusted to the optimum conditions. There is a problem that local variations in the etching shape occur in the width direction, and the adjustment of the setting conditions cannot be handled.

Recently, the material 11 to be etched is widened, the shadow mask is multifaceted, and the shadow mask is highly refined. The local variation in the etching shape causes the shadow mask to have poor transmittance, and the shadow mask. Reduce the production yield.
In particular, excessive etching or insufficient etching occurs locally in the vertical direction of the etching line, and is detected as uneven stripes in the shadow mask inspection process.
JP-A-7-34266

  The present invention has been made in view of the above-mentioned problems, and is an etching apparatus that prevents local etching variations that occur in an etching process that etches a material to be etched by spray etching, and that improves the production yield of a multifaceted shadow mask. And it aims at providing the manufacturing method of a shadow mask.

In order to achieve the above object in the present invention, first, in claim 1, at least a plurality of corrosive liquid supply pipes, spray nozzles arranged at predetermined intervals in the corrosive liquid supply pipes, and a material to be etched are conveyed. In a double-sided spray etching apparatus consisting of a conveyor and an etching chamber,
The etching apparatus is characterized in that a corrosion control net for locally controlling the etching amount of the etching target material is disposed between the spray nozzle and the etching target material.

  Further, in claim 2, a resist pattern forming step of forming a resist pattern by applying a photoresist on both surfaces of an etching target material comprising at least a long strip-shaped metal thin plate, pattern exposure and development, and The shadow mask manufacturing method includes an etching process of spray-etching a material to be etched on which a resist pattern is formed using the etching apparatus described above, and a resist pattern peeling process of peeling the resist pattern.

  The shadow mask according to claim 2, wherein in the etching step, the etching amount of the material to be etched is locally adjusted by the roughness of the mesh of the corrosion control net. This is a manufacturing method.

In the etching apparatus of the present invention, since the corrosion control net for locally controlling the etching amount of the etching target material is disposed between the spray nozzle and the etching target material, the etching amount of the etching target material is locally determined. Can be controlled.
Since the shadow mask manufacturing method of the present invention uses the above-described etching apparatus, the amount of local etching in the spray etching process can be controlled, and as a result, non-uniform stripe defects can be reduced and the manufacturing yield of multi-faceted shadow masks can be reduced. Can be improved.

Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a schematic sectional view showing an embodiment of an etching apparatus according to the present invention.
The etching apparatus of the present invention includes a corrosive liquid supply pipe 21, a spray nozzle 31 disposed in the corrosive liquid supply pipe 21 at a predetermined interval, a conveyor 42 that conveys the material to be etched 11, an etching chamber 41, and a spray nozzle. 31 and a corrosion control net 51 disposed between the material to be etched 11.
The corrosion control net 51 is provided in order to locally control the etching amount of the material 11 to be etched. For example, the corrosion control net 51 is formed by weaving a corrosion-resistant wire such as titanium, tungsten, or synthetic fiber in a mesh shape. Is done.
As the linear shape of the corrosion-resistant line such as titanium, tungsten, and synthetic fiber, 100 to 1000 μm and a mesh interval of 0.2 to 10 mm are applied.

2A to 2E are schematic cross-sectional views of processed shapes showing the manufacturing process of the shadow mask in the order of steps.
A shadow mask manufacturing method using the etching apparatus of the present invention will be described below.
First, an acceptance inspection of the material to be etched 11 made of a long thin metal plate such as an invar material made of an iron alloy is performed to inspect whether the curl amount, material width, plate thickness, appearance, etc. are within the specified values ( (See FIG. 2 (a)).
Next, the surface of the material to be etched 11 is adjusted, a PVA solution or a casein solution is applied, and the film is dried to form resist films 15 on both surfaces of the material to be etched 11 (see FIG. 2B).

  Next, with a continuous winding printer, pattern exposure is performed on the resist film with a predetermined exposure amount using an exposure mask having a predetermined pattern (in many cases, two masks on the front and back sides), and a predetermined chemical solution is used. Development, hardening, etc. are performed to form a resist pattern 15a for large holes on one surface of the material 11 to be etched and a resist pattern 15b for small holes on the other surface (see FIG. 2C).

Next, using the above etching apparatus in which the corrosion control net 51b is disposed between the spray nozzle 31 disposed in the etching liquid feed pipe 2121b in the etching chamber 41 and the material 11 to be etched, the second chloride is obtained. Spray etching is performed with an iron solution to form a hole having a predetermined shape in the material to be etched 11 (see FIG. 2D).
As an example of the etching conditions, a ferric chloride solution having a specific gravity of 1.48 to 1.54 heated to 60 to 85 ° C. is used.

In the above etching apparatus, an optimal corrosion control net 51b is set in advance. Here, a method for setting the mesh of the corrosion control net 51b will be described.
FIG. 3 (a) shows a corrosion control net 51a showing an embodiment of the corrosion control net, and FIG. 3 (b) shows a multi-sided shadow mask produced by arranging the corrosion control net 51a in an etching apparatus. Each transmittance state is shown.
First, a standard corrosion control net 51a shown in FIG. 3A is disposed between the spray nozzle 31 of the etching apparatus and the material 11 to be etched, and a multi-faceted shadow mask is produced by spray etching. As shown in FIG. 3B, the shadow masks 61b and 61e have a region where the transmittance is lower than the specified value, and the shadow masks 61c and 61f have a region where the transmittance is higher than the specified value. Suppose it was made.

Next, based on the transmittance measurement results, the mesh of the corrosion control net is designed, and the mesh of the corrosion control net in the position corresponding to the low transmittance region as shown in FIG. The corrosion control net 51b is made by making the mesh of the corrosion control net at a position corresponding to a high area.
Since the corrosion control nets 51a and 51b vary depending on the type of material to be etched, the plate thickness, the size of the shadow mask, the type, etc., it is necessary to stack test etchings in order to produce an optimal corrosion control net. However, when the etching data and the transmittance data are accumulated, it is possible to set the meshes of the corrosion control nets 51a and 51b with considerable accuracy even in the design simulation.

Finally, the resist pattern 15a and 15b on the material to be etched 11 is stripped with a heated alkaline aqueous solution in a film removing apparatus, and the large hole 12 and the small hole are formed in the material to be etched 11 formed of a long strip metal base material. A multi-faceted shadow mask in which the holes 13 are formed is obtained (see FIG. 2E).
As an example of the peeling treatment condition, a NaOH solution having a concentration of 10 to 40% heated to 50 to 90 ° C. is used.

  As described above, the local etching amount of the material to be etched can be controlled by spray etching the material to be etched using the etching apparatus in which the corrosion control net is disposed between the spray nozzle and the material to be etched. As a result, it is possible to reduce defective stripes and improve the production yield of a multifaceted shadow mask.

It is a schematic structure sectional view showing one example of an etching device of the present invention. (A)-(e) is typical partial structure sectional drawing of the process shape which shows the manufacturing process of a shadow mask in order of a process. (A) is a schematic block diagram of the corrosion control net | network 51a which shows one Example of a corrosion control net | network. (B) is explanatory drawing which shows an example of the multi-faced shadow mask produced by spray etching using the corrosion control net | network 51a. It is a schematic block diagram of the corrosion control net | network 51b which shows one Example of a corrosion control net | network. (A) is a schematic top view which shows an example of a spray etching apparatus. (B) is a schematic cross-sectional view of a spray etching apparatus in which (a) is cut along line A-A ′. It is explanatory drawing which shows the example of a hole shape of a shadow mask. (A)-(c) is typical partial structure sectional drawing of the process shape which shows the manufacture main process of a shadow mask. It is explanatory drawing which shows the manufacture main process of a shadow mask.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Material to be etched 12 ... Large hole 13 ... Small hole 15 ... Resist film 15a, 15b ... Resist pattern 21 ... Corrosion solution supply pipe 31 ... Spray nozzle 41 ... Etch chamber 42 ... Conveyor 51a , 51b ... Corrosion control nets 61a, 61b, 61c, 61d, 61e, 61f ... Shadow mask

Claims (3)

In a double-sided spray etching apparatus comprising at least a plurality of corrosive liquid supply pipes, spray nozzles arranged at predetermined intervals in the corrosive liquid supply pipe, a conveyor for conveying the material to be etched, and an etching chamber,
An etching apparatus comprising a corrosion control net for locally controlling an etching amount of the etching target material between the spray nozzle and the etching target material.   A resist pattern forming step of forming a resist pattern by applying a photoresist on both surfaces of a material to be etched made of at least a long band-shaped metal thin plate, pattern exposure, and development; and a resist using the etching apparatus according to claim 1 A method for manufacturing a shadow mask, comprising: an etching process for spray-etching a material to be etched on which a pattern is formed; and a resist pattern peeling process for peeling a resist pattern.   3. The method of manufacturing a shadow mask according to claim 2, wherein in the etching step, the etching amount of the material to be etched is locally adjusted by the roughness of the mesh of the corrosion control net.

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