JPH01307234A - Soldering material supplying equipment - Google Patents
Soldering material supplying equipmentInfo
- Publication number
- JPH01307234A JPH01307234A JP13800888A JP13800888A JPH01307234A JP H01307234 A JPH01307234 A JP H01307234A JP 13800888 A JP13800888 A JP 13800888A JP 13800888 A JP13800888 A JP 13800888A JP H01307234 A JPH01307234 A JP H01307234A
- Authority
- JP
- Japan
- Prior art keywords
- soldering material
- cutter
- filler metal
- ribbon
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title abstract description 52
- 238000005476 soldering Methods 0.000 title abstract description 16
- 238000005259 measurement Methods 0.000 claims abstract description 9
- 238000005219 brazing Methods 0.000 claims description 67
- 239000002184 metal Substances 0.000 claims description 40
- 239000000945 filler Substances 0.000 claims description 35
- 230000002950 deficient Effects 0.000 claims description 10
- 230000000717 retained effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体チップ等をフレーム等に固着させる丸
めのろう材を、フレームに供給する際に使用されるろう
材供給装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a brazing material supply device used for supplying a rounded brazing material to a frame for fixing a semiconductor chip or the like to the frame. .
従来のこの１ろう材供給装置はリボン形状のろう材を使
用し、このろう材を機械的に一定量ずつ送る移送装置と
、この移送装置によって送られたリボン状ろう材を切断
するカッターと、このカッターで切断されたろう材片を
フレーム上の定位置へ移載させる移載装置とから構成さ
れている。これを図によって説明する。This conventional brazing material supply device uses a ribbon-shaped brazing material, and includes a transfer device that mechanically feeds the brazing material in a fixed amount at a time, and a cutter that cuts the ribbon-shaped brazing material fed by the transfer device. It consists of a transfer device that transfers the brazing filler metal pieces cut by this cutter to a fixed position on the frame. This will be explained using a diagram.
第２図は従来のろう材供給装置を示す斜視図で、同図に
おいて１はろう材で、ろう材用リール２に巻き付けられ
ている。３は前記ろう材１を移送するためのリボン送り
ローラで、駆動装置（図示せず）に連結され、ろう材１
を一定量ずつ移送するよう構成されている。４はろう材
１を切断するためのカッターで、このカッター４はろう
材１が挿入される凹部４ａを有するリボン受は部４ｂと
、とのリボン受は部４ｂに当接される切断用上切刃４Ｃ
と、これらリボン受は部４ｂおよび切断用上切刃４ｃに
沿って平行移動しろう材１を切断する切断用下切刃４ｄ
とを備えている。５は前記カッター４で切断されたろう
材片１ａをフレーム６の所定位置に移載するための移載
装置としての吸着ニードルで、一端部にはろう材片１ａ
を吸着する真空吸着ノズル５ａが設けられておシ、駆動
装置（図示せず）に連結され、カッター４とフレーム６
との間を往復動自在に設けられている。また、この吸着
二５−ドル５は、ろう材片１ａを吸着した状態で、真空
吸着ノズル５ａとろう材片１ａ との間から流入される
空気量を検出するセンナ（図示せず）を備え、圧力差を
検出することによってろう材片１ａが吸着されているか
否かが確認されていた。FIG. 2 is a perspective view showing a conventional brazing material supply device, in which reference numeral 1 denotes a brazing material, which is wound around a brazing material reel 2. As shown in FIG. Reference numeral 3 denotes a ribbon feed roller for transporting the brazing material 1, which is connected to a driving device (not shown) and is used to transport the brazing material 1.
It is configured to transfer a fixed amount of 4 is a cutter for cutting the brazing material 1; the cutter 4 has a recess 4a into which the brazing material 1 is inserted; a ribbon holder has a section 4b; Cutting blade 4C
These ribbon receivers move in parallel along the portion 4b and the upper cutting edge 4c, and the lower cutting edge 4d cuts the brazing filler metal 1.
It is equipped with Reference numeral 5 designates a suction needle as a transfer device for transferring the brazing material piece 1a cut by the cutter 4 to a predetermined position on the frame 6, and the brazing material piece 1a is attached to one end thereof.
A vacuum suction nozzle 5a for suctioning the cutter 4 and the frame 6 is connected to a drive device (not shown).
It is provided so that it can freely move back and forth between the two. The suction unit 5 is also equipped with a sensor (not shown) that detects the amount of air flowing between the vacuum suction nozzle 5a and the soldering material piece 1a while the soldering material piece 1a is being adsorbed. It was confirmed whether or not the brazing filler metal piece 1a was adsorbed by detecting the pressure difference.
このように構成されたろう材供給装置によってフレーム
６にろう材片１ａを供給するには、先ずリボン送ジロー
２３を回転させることによりろう材１をカッター４に送
る。次いで、このカッター４でろう材１を切断させ、こ
のカッター４により切断され九ろう材片１ａに吸着ニー
ドル５を近接させる。そして、吸着ニードル５の真空吸
着ノズル５ａにろう材片１ａを吸着させ、吸着ニードル
５を移動させろう材片１ａをフレーム６に移載させる。In order to supply the brazing material piece 1a to the frame 6 using the brazing material supplying device configured as described above, first, the ribbon feeder 23 is rotated to feed the brazing material 1 to the cutter 4. Next, the cutter 4 is used to cut the brazing filler metal 1, and the suction needle 5 is brought close to the nine filler filler metal pieces 1a cut by the cutter 4. Then, the vacuum suction nozzle 5a of the suction needle 5 adsorbs the soldering material piece 1a, and the suction needle 5 is moved to transfer the soldering material piece 1a onto the frame 6.
このようにしてフレーム６にろう材片１ａが供給される
ことになる。In this way, the brazing material piece 1a is supplied to the frame 6.
しかるに、従来のろう材供給装置においては、フレーム
６に供給されるろう材片１ａの大きさはリボン送りロー
ラ３により送られるろう材１の送シ量によって決定され
、カッター４にろう材１が詰った夛、リボン送シローラ
３に空転等の不具合が生じた場合には、カッター４に所
定景のろう材１が送られず、ろう材片１ａをその大きさ
が均一に々るよう形成することができない。また、ろう
材片１３はその大きさが真空吸着ノズル５ａの内径よシ
大きければ、大きさに関係表くフレーム６に供給される
ことになシ、ろう材片１１Ｌが小さく形成された場合に
は、後工程で固着される半導体チップの特性劣化、動作
寿命の短縮という問題が生じ、ろう材片１ａが大きく形
成された場合には、余剰ろう材が流れ出すことによって
半導体チップが短終を起ζすという問題があった。However, in the conventional brazing material supply device, the size of the brazing material piece 1a supplied to the frame 6 is determined by the amount of brazing material 1 fed by the ribbon feeding roller 3, and the brazing material 1 is fed to the cutter 4. If a problem occurs such as clogging or idling of the ribbon feed roller 3, a predetermined amount of the brazing material 1 will not be fed to the cutter 4, and the brazing material pieces 1a will be formed so that they are uniform in size. I can't. Furthermore, if the size of the brazing filler metal piece 13 is larger than the inner diameter of the vacuum suction nozzle 5a, it will not be supplied to the frame 6 regardless of the size. This causes problems such as deterioration of the characteristics of the semiconductor chip that is fixed in the subsequent process and shortening of the operating life.If the solder metal piece 1a is formed to a large size, the semiconductor chip may shorten due to the excess solder metal flowing out. There was a problem with ζ.
本発明に係るろう材供給装置は、リボン状ろう材が移送
装置によって供給されるカッターと、このカッターによ
って切断されたろう材片をろう材片の切断量を測定する
測定装置に移載させる第一の移載装置と、前記切断量測
定装置の測定結果に応じてろう材片を被供給部材と不良
品受けに選択的に分類し移載させる第二の移載装置とを
備えたものである。The brazing filler metal supply device according to the present invention includes a cutter to which ribbon-shaped brazing filler metal is fed by a transfer device, and a first cutter that transfers the cut brazing filler metal pieces by the cutter to a measuring device that measures the cutting amount of the brazing filler metal pieces. and a second transfer device that selectively sorts and transfers the brazing filler metal pieces to a supplied member and a defective product receiver according to the measurement results of the cutting amount measuring device. .
□切断量が許容範囲外のろう材片は除外され、−定量を
有するろう材片のみを供給することができる。□ Pieces of brazing filler metal whose cut amount is outside the allowable range are excluded, and only pieces of brazing filler metal with a -quantity can be supplied.
以下、その構成等を図に示す実施例によシ詳細に説明す
る。Hereinafter, the configuration and the like will be explained in detail with reference to the embodiment shown in the drawings.
第１図は本発明に係るろう材供給装置を示す斜視図で、
同図において第２図で説明したものと同一もしくは同等
部材については同一符号を付し、ここにおいて詳細な説
明は省略する。同図において、１１はカッター４によっ
て切断されたろう材片を後述する測定装置へ移載させる
ための第一の移載装置としての第−吸着ニードルで、こ
の第−吸着ニードル１１は駆動装置（図示せず）Ｋ連結
されカッター４と後述する受は台との間に往復動自在に
設けられておシ１、先端部にはろう材片１ａを吸着する
真空吸着ノズル１１ｍが設けられている。１２拡ろう材
片１ａの外形寸法を測定するための測定装置で、この測
定装置１２は、ろう材片１ｍが載置される受は台１２ａ
と、受は台１２鳳上に載置されたろう材片１ａを撮影す
るためのカメラ１２ｂ とを備え、とのカメラ１２ｂ
によりろう材片１ｍを光学的に写し、画像処理するこ
とによってろう材片１ａの寸法を測定するものである。FIG. 1 is a perspective view showing a brazing material supply device according to the present invention.
In the same figure, the same or equivalent members as those explained in FIG. 2 are given the same reference numerals, and detailed explanations are omitted here. In the figure, reference numeral 11 denotes a first suction needle serving as a first transfer device for transferring the brazing filler metal piece cut by the cutter 4 to a measuring device to be described later. A cutter 4 (not shown) is connected to the cutter 4 and a receiver (to be described later) is provided so as to be reciprocally movable between the cutter 4 and the stand. 12 A measuring device for measuring the external dimensions of the expanding filler metal piece 1a.
and a camera 12b for photographing the brazing material piece 1a placed on the stand 12;
The size of the soldering material piece 1a is measured by optically copying 1 m of the soldering material piece and performing image processing.
１３は寸法測定終了後のろう材片１ａを、測定装置１２
の測定結果に応じてフレーム６と不良品受は皿１４に選
択的に分類し移載させるための第二の移載装置としての
第二吸着ニードルで、この第二吸着ニードル１３は駆動
装置（図示せず）に連結され前記受は台１２ａと、フレ
ーム６および不良品受は皿１４との間に往復動自在に設
けられ、先端にはろう材片１ａを吸着するための真空吸
着ノズル１３ａが設けられている。また、この第二吸着
ニードル１３の駆動装置は前記測定装置１２と接続され
ており、測定結果に応じて不良品は不良品受は皿１４へ
移載させ、良品はフレーム６へ移載させるよう構成され
ている。Reference numeral 13 refers to the brazing filler metal piece 1a after the dimension measurement is completed by the measuring device 12.
A second suction needle serves as a second transfer device for selectively sorting and transferring the frame 6 and the defective product receiver to the tray 14 according to the measurement results of the second suction needle 13. (not shown), and the receiver is provided reciprocably between the stand 12a, the frame 6, and the tray 14, and a vacuum suction nozzle 13a for suctioning the brazing material piece 1a is provided at the tip. is provided. Further, the driving device of the second suction needle 13 is connected to the measuring device 12, and depending on the measurement results, defective products are transferred to the defective product tray 14, and non-defective products are transferred to the frame 6. It is configured.
このように構成されたろう材供給装置によってろう材片
１ａをフレーム６に供給するには、先ずリボン状ろう材
１をリボン送りロー２３によってカッター４に移送させ
る。次に、カッター４のリボン受は部４ｂと切断用上切
刃４Ｃとによって保持されたろう材１を、切断用下切刃
４ｄを上方へ移動させることによって切断させ、このカ
ッター４によって切断されたろう材片１ａを第−吸着ニ
ードル１１で測定装置１２の受は台１２ａへ移載させる
。そして、このろう材片１１ａ をカメラ１２ｂで撮影
し、画像処理後第二吸着ニードル１３で吸着させ、良品
の場合にはフレーム６へ、また不良品の場合には不良品
受は皿１４へ移載させる。このようにしてフレーム６へ
ろう材片１ａが供給されることになる。In order to supply the brazing filler metal piece 1a to the frame 6 using the brazing filler metal supplying device configured as described above, the ribbon-shaped brazing filler metal 1 is first transferred to the cutter 4 by the ribbon feeding row 23. Next, the ribbon receiver of the cutter 4 cuts the brazing filler metal 1 held by the portion 4b and the upper cutting edge 4C by moving the lower cutting edge 4d upward. The piece 1a is transferred to the stand 12a of the measuring device 12 using the first suction needle 11. Then, this brazing material piece 11a is photographed with a camera 12b, and after image processing, it is adsorbed with a second suction needle 13, and if it is a good product, it is transferred to the frame 6, and if it is a defective product, the defective product receiver is transferred to the tray 14. I'll put it on. In this way, the brazing material piece 1a is supplied to the frame 6.
したがって、切断量が許容範囲外のろう材片は除外され
ることになシ、フレーム６には一定量を有するろう材片
のみが供給されることになる。Therefore, pieces of brazing filler metal whose cut amount is outside the allowable range are not excluded, and only pieces of brazing filler metal having a certain amount are supplied to the frame 6.
なお、本実施例ではカメラ１２ｂを使用して画像処理に
よってろう材片１ａの大きさを測定した例を示したが、
本発明はこのような限定にとられれることなく、例えば
ろう材片１亀の重量を測定する測定装置を使用し、ろう
材片１ａ切断量を重量によって評価する構成としてもよ
い。In addition, in this example, an example was shown in which the size of the brazing material piece 1a was measured by image processing using the camera 12b.
The present invention is not limited to such limitations, and may be configured to use, for example, a measuring device that measures the weight of one piece of brazing material and evaluate the amount of cutting of the piece of brazing material 1a based on the weight.
また、第二吸着ニードル１３にろう材片１ａが吸着され
たか否かの確認を、測定装置１２上にろう材片１ａが残
存しているか否かを測定装置１２によって確認させれば
、空気圧の差を利用する方法よりも確実に吸着の有無を
確認することができる。In addition, if the measurement device 12 is used to check whether or not the solder metal piece 1a is adsorbed by the second suction needle 13, it is possible to check whether or not the solder metal piece 1a remains on the measurement device 12. The presence or absence of adsorption can be confirmed more reliably than with methods that utilize differences.
以上説明したように本発明によれば、リボン状ろう材が
移送装置によって供給されるカッターと、このカッター
によって切断されたろう材片を、ろう材の切断量を測定
する測定装置に移載させる第一の移載装置と、前記切断
量測定装置の測定結果に応じてろう材片を被供給部材と
不良品受けに選択的に分類し移載させる第二の移載装置
とを備えたため、切断量が許容範囲外のろう材片は除外
され、一定食を有するろう材片のみを供給することがで
きる。したがって、ろう材の量が少なくなることによっ
て半導体チップの特性が劣化したり、動作寿命が短縮さ
れることを防ぐことができ、またろう材の量が余剰とな
シ半導体素子が短絡を起こすようなこともないから、高
品質な半導体装置を製造することができる。As explained above, according to the present invention, there is a cutter to which ribbon-shaped brazing filler metal is supplied by a transfer device, and a cutter that transfers the pieces of brazing filler metal cut by the cutter to a measuring device that measures the amount of cutting of the filler filler metal. The first transfer device and the second transfer device selectively classify and transfer the brazing filler metal pieces to the supplied member and the defective product receiver according to the measurement results of the cutting amount measuring device, Pieces of solder metal whose quantity is outside the permissible range are excluded, and only pieces of solder metal with a fixed amount can be supplied. Therefore, it is possible to prevent the characteristics of the semiconductor chip from deteriorating or the operating life to be shortened due to a decrease in the amount of brazing filler metal, and it is possible to prevent the semiconductor element from shorting due to an excess amount of brazing filler metal. Therefore, high quality semiconductor devices can be manufactured.
【図面の簡単な説明】
第１図は本発明に係るろう材供給装置を示す斜視図、第
２図は従来のろう材供給装置を示す斜視図である。
１拳・φ・ろう材、１ａ ・・・・ろう材片、３・・・
・リボン送りローラ、４・・・・カッター、６・・・・
フレーム、１１・・・・第−吸着ニードル、１２・・・
・測定装置、１３・・・・第二吸着ニードル、１４・・
・・不良品受は皿。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a brazing material supply device according to the present invention, and FIG. 2 is a perspective view showing a conventional brazing material supply device. 1 fist, φ, brazing metal, 1a ... piece of brazing material, 3...
・Ribbon feed roller, 4...Cutter, 6...
Frame, 11...th suction needle, 12...
・Measuring device, 13...Second suction needle, 14...
...The defective product tray is a plate.
Claims (1)
ーと、このカッターによって切断されたろう材片を、ろ
う材片の切断量を測定する測定装置に移載させる第一の
移載装置と、前記切断量測定装置の測定結果に応じてろ
う材片を被供給部材と不良品受けに選択的に分類し移載
させる第二の移載装置とを備えたことを特徴とするろう
材供給装置。a cutter to which ribbon-shaped brazing filler metal is supplied by a transfer device; a first transfer device for transferring the brazing filler metal pieces cut by the cutter to a measuring device for measuring the cutting amount of the brazing filler metal pieces; and the cutting amount. A brazing filler metal supplying device comprising a second transfer device that selectively sorts and transfers brazing filler metal pieces to a supplied member and a defective product receiver according to the measurement results of the measuring device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13800888A JPH01307234A (en) | 1988-06-03 | 1988-06-03 | Soldering material supplying equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13800888A JPH01307234A (en) | 1988-06-03 | 1988-06-03 | Soldering material supplying equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01307234A true JPH01307234A (en) | 1989-12-12 |
Family
ID=15211906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13800888A Pending JPH01307234A (en) | 1988-06-03 | 1988-06-03 | Soldering material supplying equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01307234A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105598549A (en) * | 2016-03-16 | 2016-05-25 | 无锡奥特维科技股份有限公司 | Welding-strip feeding mechanism and method and string welding machine |
| KR102043024B1 (en) * | 2019-05-29 | 2019-11-12 | 주식회사 우원기술 | Splicing Device of Secondary Battery Electrode Film |
-
1988
- 1988-06-03 JP JP13800888A patent/JPH01307234A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105598549A (en) * | 2016-03-16 | 2016-05-25 | 无锡奥特维科技股份有限公司 | Welding-strip feeding mechanism and method and string welding machine |
| CN105598549B (en) * | 2016-03-16 | 2018-06-19 | 无锡奥特维科技股份有限公司 | A kind of welding feed mechanism, feeding method and string welding machine |
| KR102043024B1 (en) * | 2019-05-29 | 2019-11-12 | 주식회사 우원기술 | Splicing Device of Secondary Battery Electrode Film |
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