JPH01303701A - 電子部品及びその製造方法 - Google Patents
電子部品及びその製造方法Info
- Publication number
- JPH01303701A JPH01303701A JP63134135A JP13413588A JPH01303701A JP H01303701 A JPH01303701 A JP H01303701A JP 63134135 A JP63134135 A JP 63134135A JP 13413588 A JP13413588 A JP 13413588A JP H01303701 A JPH01303701 A JP H01303701A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- flexible substrate
- housing
- pattern
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000000758 substrate Substances 0.000 claims description 163
- 229920005989 resin Polymers 0.000 claims description 102
- 239000011347 resin Substances 0.000 claims description 102
- 229910052751 metal Inorganic materials 0.000 claims description 90
- 239000002184 metal Substances 0.000 claims description 90
- 239000000463 material Substances 0.000 claims description 55
- 229920003002 synthetic resin Polymers 0.000 claims description 53
- 239000000057 synthetic resin Substances 0.000 claims description 53
- 239000004020 conductor Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 20
- 238000005530 etching Methods 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000012212 insulator Substances 0.000 description 35
- 238000010586 diagram Methods 0.000 description 19
- 238000010438 heat treatment Methods 0.000 description 12
- 210000000078 claw Anatomy 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 229920001169 thermoplastic Polymers 0.000 description 5
- 239000004416 thermosoftening plastic Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000012943 hotmelt Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Contacts (AREA)
- Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63134135A JPH01303701A (ja) | 1988-05-31 | 1988-05-31 | 電子部品及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63134135A JPH01303701A (ja) | 1988-05-31 | 1988-05-31 | 電子部品及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01303701A true JPH01303701A (ja) | 1989-12-07 |
| JPH0570286B2 JPH0570286B2 (enrdf_load_stackoverflow) | 1993-10-04 |
Family
ID=15121288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63134135A Granted JPH01303701A (ja) | 1988-05-31 | 1988-05-31 | 電子部品及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01303701A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015015537A1 (ja) * | 2013-08-02 | 2015-02-05 | 東京コスモス電機株式会社 | 摺動型電気部品 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60217601A (ja) * | 1984-04-12 | 1985-10-31 | アルプス電気株式会社 | 可変抵抗器 |
| JPS62190703A (ja) * | 1986-02-18 | 1987-08-20 | 松下電器産業株式会社 | 可変抵抗器用抵抗基体の製造方法 |
-
1988
- 1988-05-31 JP JP63134135A patent/JPH01303701A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60217601A (ja) * | 1984-04-12 | 1985-10-31 | アルプス電気株式会社 | 可変抵抗器 |
| JPS62190703A (ja) * | 1986-02-18 | 1987-08-20 | 松下電器産業株式会社 | 可変抵抗器用抵抗基体の製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015015537A1 (ja) * | 2013-08-02 | 2015-02-05 | 東京コスモス電機株式会社 | 摺動型電気部品 |
| CN105452813A (zh) * | 2013-08-02 | 2016-03-30 | 东京Cosmos电机株式会社 | 滑动型电气部件 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0570286B2 (enrdf_load_stackoverflow) | 1993-10-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0304112B1 (en) | Molded resin casing of electronic part incorporating flexible board | |
| JPH0748330B2 (ja) | フレキシブル基板内蔵の電子部品樹脂モールドケース及びその製造方法 | |
| KR910001748B1 (ko) | 플랫 케이블을 구비한 전자 부품 주형 수지 케이싱 | |
| JP2603105B2 (ja) | 可変抵抗器とその製造方法 | |
| JPS6020258Y2 (ja) | Ｄｉｐ型ロ−タリ−スイツチ | |
| JPH01303701A (ja) | 電子部品及びその製造方法 | |
| JPS60217601A (ja) | 可変抵抗器 | |
| JPH0714114B2 (ja) | フレキシブル基板を用いた電子部品のケース取付方法 | |
| JPH0160930B2 (enrdf_load_stackoverflow) | ||
| JPH01319906A (ja) | フラットケーブル付き電子部品及びその製造方法 | |
| US4670816A (en) | Plastic film capacitor in chip constructional form | |
| JP4371794B2 (ja) | 電子部品用基板 | |
| JPH055361B2 (enrdf_load_stackoverflow) | ||
| JPH02146706A (ja) | チップインダクタ | |
| JPH02170403A (ja) | 電子部品 | |
| JP4360989B2 (ja) | 回転式電子部品用基板及び回転式電子部品用基板の製造方法 | |
| JPH10200361A (ja) | 圧電部品及びその製造方法 | |
| JPH05251873A (ja) | 露出部品を有する電気機器及びその組み立て方法 | |
| JP2548748Y2 (ja) | 小型電子部品 | |
| JP2001185406A (ja) | 回転式電子部品及びケース付き基板及びその製造方法 | |
| JPH10275714A (ja) | 小型電子部品とその製造方法並びにその調整方法 | |
| JPH0248124B2 (ja) | Kaitensosashikikogatadenshibuhin | |
| JP2006049522A (ja) | 回転式電子部品及びその実装基板への取付構造及び回転式電子部品の製造方法 | |
| JPH0821490B2 (ja) | 可変抵抗器の製造方法 | |
| JPS6159466B2 (enrdf_load_stackoverflow) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081004 Year of fee payment: 15 |