JPH01302794A - Manufacture of printed circuit board - Google Patents
Manufacture of printed circuit boardInfo
- Publication number
- JPH01302794A JPH01302794A JP32064788A JP32064788A JPH01302794A JP H01302794 A JPH01302794 A JP H01302794A JP 32064788 A JP32064788 A JP 32064788A JP 32064788 A JP32064788 A JP 32064788A JP H01302794 A JPH01302794 A JP H01302794A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed circuit
- circuit board
- etching
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000005530 etching Methods 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 239000003513 alkali Substances 0.000 abstract 1
- 230000009545 invasion Effects 0.000 abstract 1
- 239000002195 soluble material Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、高密度化に最適なプリント回路板の製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a printed circuit board that is optimal for high density.
プリント回路板を製造するには、従来、１８〜３５μｍ
の銅箔上に３０μｍ前後の電気銅めっきを析出させ、ド
ライフィルムを用いたテンティング法または孔埋めによ
る印刷法により回路形成後エツチングにて回路を独立さ
せていた。To manufacture printed circuit boards, traditionally 18-35 μm
Electrolytic copper plating with a thickness of about 30 μm was deposited on copper foil, and circuits were formed by a tenting method using a dry film or a printing method by filling holes, and then etched to make the circuits independent.
高密度のプリント回路板に上記従来技術を適用した場合
、次のような問題が生じる。When the above-mentioned conventional technology is applied to a high-density printed circuit board, the following problems occur.
プリント回路板を高密度化すると必然的にスルーホール
孔径が小さくなるが、この場合、エツチングレジストを
形成する際の位置ずれが問題となる。エツチングレジス
トのランド部とスルーホールが位置ずれを起こすとスル
ーホール内にエツチング液が入り込み、スルーホール内
のめっき及び銅箔層が侵食されるのである。この状況を
第８図に示す。第８図において（ａ）は、エツチング中
のスルーホール部断面図、（ｂ）は、エツチング後の同
断面図であり、ドライフィルム５の左方向のずれにより
、スルーホール内にエツチング液１２が浸入し、スルー
ホール内のめっき層４及び銅箔層１が侵食されている。When the density of a printed circuit board is increased, the diameter of the through hole inevitably becomes smaller, but in this case, positional deviation when forming an etching resist becomes a problem. If the land portion of the etching resist and the through hole are misaligned, the etching solution will enter the through hole, corroding the plating and copper foil layer inside the through hole. This situation is shown in FIG. In FIG. 8, (a) is a cross-sectional view of the through-hole during etching, and (b) is the same cross-sectional view after etching. Due to the leftward shift of the dry film 5, the etching liquid 12 leaks into the through-hole. The plating layer 4 and copper foil layer 1 inside the through hole are being eroded.
本発明の目的は、上記問題を解決し、高密度でしかも高
品質のプリント回路板を製造することを可能にするプリ
ント回路板の製造方法を提供することである。An object of the present invention is to provide a method for manufacturing a printed circuit board that solves the above-mentioned problems and makes it possible to manufacture a printed circuit board with high density and high quality.
上記目的は、スルーホール内に可溶性物質を充填した後
、前記エツチングレジストを形成し、エツチングをおこ
なうことにより達成される。The above object is achieved by filling the through hole with a soluble substance, forming the etching resist, and performing etching.
スルーホール内に可溶性物質を充填したことにより、エ
ツチングレジストが位置ずれを起こしても、エツチング
液がスルーホール内に浸入することはなく、スルーホー
ル内のめっき及び銅箔層が侵食されることはなくなる。By filling the through-hole with a soluble substance, even if the etching resist is misaligned, the etching solution will not enter the through-hole, and the plating and copper foil layer inside the through-hole will not be eroded. It disappears.
以下に、実施例１を用いて本発明を一層詳しく説明する
が、それは例示にすぎず、本発明の枠を超えることなく
、いろいろな変形や改良があり得ることは、勿論である
。The present invention will be described in more detail below using Example 1, but this is merely an example, and it goes without saying that various modifications and improvements can be made without going beyond the scope of the present invention.
第１図に示す樹脂板２の両面に１８μｍまたは３５μｍ
の銅箔を有する積層板にドリルまたはパンチングにてス
ルーホール孔３をあけ、第２図のようにする。孔あけ後
処理としてパリ除去を行なった後、表面及び孔内を含め
全面を脱脂、清浄化、触媒付与を施し、硫酸銅、錯化剤
ベースの還元性化学銅めっき浴に浸漬し、第３図のごと
く銅めっき膜４を２〜１０μｍ析出させる。エツチング
液のスルーホール内への浸入を防ぐためスルーホール孔
３内にアルカリ可溶型インク１１を挿入した後、そのも
のにドライフィルム５を用いた露光法にてテンティング
を行ない、第４図のように回路形成する。アンモニウム
水、塩化アンモニウムよりなるアルカリエツチング液に
て回路以外の銅を溶解除去し、ドライフィルム５を塩化
メチレン等を用いて剥離し、独立ライン６及びランド部
７を形成し、アルカリ可溶型インク１１を溶解除去し、
第５図に示すように回路を独立させる。エポキシ樹脂を
ベースにした高耐薬品性のソルダーレジスト９をスクリ
ーン版を用い、ランド部７及びスルーホール部８を除く
全面に印刷塗布し、第６図のようにした後、露出してい
るランド部７及びスルーホール部８に再度硫酸銅、錯化
剤ベースの化学銅めっき浴に浸漬する方法で、銅めっき
膜ｌＯを厚さ１５〜３０μｍ析出させ、第７図のごとく
なる。18 μm or 35 μm on both sides of the resin plate 2 shown in FIG.
A through-hole hole 3 is made by drilling or punching in a laminate having copper foil, as shown in FIG. After removing paris as a post-drilling treatment, the entire surface, including the surface and inside of the hole, is degreased, cleaned, and catalyzed, and then immersed in a reducing chemical copper plating bath based on copper sulfate and a complexing agent. As shown in the figure, a copper plating film 4 of 2 to 10 μm is deposited. After inserting the alkali-soluble ink 11 into the through-hole hole 3 to prevent the etching liquid from entering the through-hole, tenting is performed using an exposure method using a dry film 5, as shown in FIG. Form the circuit as follows. Copper other than the circuit is dissolved and removed using an alkaline etching liquid consisting of ammonium water and ammonium chloride, and the dry film 5 is peeled off using methylene chloride or the like to form independent lines 6 and land portions 7, and alkali-soluble ink is removed. 11 is dissolved and removed,
The circuits are made independent as shown in FIG. A highly chemical-resistant solder resist 9 based on epoxy resin is printed and coated on the entire surface except for the land portions 7 and through-hole portions 8 using a screen plate, as shown in Fig. 6, and then the exposed lands are coated. A copper plating film 10 having a thickness of 15 to 30 μm is deposited on the portion 7 and the through-hole portion 8 by dipping it again in a chemical copper plating bath based on copper sulfate and a complexing agent, as shown in FIG.
本発明によれば、エツチングレジストを形成する際の位
置ずれが生じても、スルーホールは、完全に密閉される
ので、スルーホール内にエツチング液が入り込むことは
なくなる。従って、高密度でしかも高品質のプリント回
路板を製造することができる。According to the present invention, even if a positional shift occurs when forming an etching resist, the through hole is completely sealed, so that no etching solution will enter the through hole. Therefore, printed circuit boards with high density and high quality can be manufactured.
第１図から第７図までは本発明によるプリント回路板の
製造方法を示す断面図、第８図は、エツチングレジスト
が位置ずれしたときの状態を示す図である。
符号の説明
１・・・銅張り積層板の銅箔、
２・・・銅張り積層板の樹脂板、
３・・・スルーホール孔、
４・・・パネル化学銅めっき層、
５・・・ドライフィルム、 ６・・・独立ライン、７
・・・ランド部、 ８・・・スルーホール部、
９・・・ソルダーレジスト、１０・・・化学銅めっき膜
、１１・・・アルカリ可溶型インク、
１２・・・エツチング液。
ｎ１図1 to 7 are cross-sectional views showing the method of manufacturing a printed circuit board according to the present invention, and FIG. 8 is a view showing the state when the etching resist is misaligned. Explanation of symbols 1...Copper foil of copper-clad laminate, 2...Resin plate of copper-clad laminate, 3...Through hole, 4...Panel chemical copper plating layer, 5...Dry Film, 6...Independent line, 7
...Land part, 8...Through hole part,
9...Solder resist, 10...Chemical copper plating film, 11...Alkali-soluble ink, 12...Etching liquid. n1 diagram
Claims (1)
となる部分、ランド部及び該スルーホール端部にエッチ
ングレジストを形成した後、エッチングを行なうことに
より回路パターン及びランド部を形成する工程を含むプ
リント回路板の製造方法において、前記スルーホール内
に可溶性物質を充填した後、前記エッチングレジストを
形成することを特徴とするプリント回路板の製造方法。1. Printing that includes the step of forming a circuit pattern and a land portion by etching after forming an etching resist on the through hole and the circuit portion of a laminate having copper layers on both sides, the land portion, and the end of the through hole. A method for manufacturing a printed circuit board, the method comprising: filling the through hole with a soluble substance and then forming the etching resist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32064788A JPH01302794A (en) | 1988-12-21 | 1988-12-21 | Manufacture of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32064788A JPH01302794A (en) | 1988-12-21 | 1988-12-21 | Manufacture of printed circuit board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8484682A Division JPS58202589A (en) | 1982-05-21 | 1982-05-21 | Method of producing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01302794A true JPH01302794A (en) | 1989-12-06 |
Family
ID=18123747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32064788A Pending JPH01302794A (en) | 1988-12-21 | 1988-12-21 | Manufacture of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01302794A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110072339A (en) * | 2019-05-31 | 2019-07-30 | 高德（无锡）电子有限公司 | The design method of welding resistance consent under two kinds of PCB single side different ink type ink |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4926784A (en) * | 1972-07-05 | 1974-03-09 | ||
| JPS5526679A (en) * | 1978-08-16 | 1980-02-26 | Shindo Denshi Kogyo Kk | Method of manufacturing through hole printed board |
| JPS5599796A (en) * | 1979-01-26 | 1980-07-30 | Sanwa Kagaku Kogyo Kk | Method of fabricating copper throughhhole printed circuit board |
-
1988
- 1988-12-21 JP JP32064788A patent/JPH01302794A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4926784A (en) * | 1972-07-05 | 1974-03-09 | ||
| JPS5526679A (en) * | 1978-08-16 | 1980-02-26 | Shindo Denshi Kogyo Kk | Method of manufacturing through hole printed board |
| JPS5599796A (en) * | 1979-01-26 | 1980-07-30 | Sanwa Kagaku Kogyo Kk | Method of fabricating copper throughhhole printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110072339A (en) * | 2019-05-31 | 2019-07-30 | 高德（无锡）电子有限公司 | The design method of welding resistance consent under two kinds of PCB single side different ink type ink |
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