JPH0129784Y2 - - Google Patents
Info
- Publication number
- JPH0129784Y2 JPH0129784Y2 JP1982165379U JP16537982U JPH0129784Y2 JP H0129784 Y2 JPH0129784 Y2 JP H0129784Y2 JP 1982165379 U JP1982165379 U JP 1982165379U JP 16537982 U JP16537982 U JP 16537982U JP H0129784 Y2 JPH0129784 Y2 JP H0129784Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- ring
- etching
- etching liquid
- annular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 128
- 239000007788 liquid Substances 0.000 claims description 82
- 238000007789 sealing Methods 0.000 claims description 27
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 description 11
- 238000009423 ventilation Methods 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000837 restrainer Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16537982U JPS5970336U (ja) | 1982-10-30 | 1982-10-30 | エツチング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16537982U JPS5970336U (ja) | 1982-10-30 | 1982-10-30 | エツチング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5970336U JPS5970336U (ja) | 1984-05-12 |
| JPH0129784Y2 true JPH0129784Y2 (es) | 1989-09-11 |
Family
ID=30362338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16537982U Granted JPS5970336U (ja) | 1982-10-30 | 1982-10-30 | エツチング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5970336U (es) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2857958B2 (ja) * | 1992-04-02 | 1999-02-17 | 株式会社デンソー | エッチングポット |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5887336U (ja) * | 1981-12-09 | 1983-06-14 | 日本電気株式会社 | 蝕刻装置 |
-
1982
- 1982-10-30 JP JP16537982U patent/JPS5970336U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5970336U (ja) | 1984-05-12 |
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