JPH0129784Y2 - - Google Patents

Description

[Detailed description of the invention] The invention provides a method for etching a wafer to be etched, such as a semiconductor wafer, on only one side of the wafer.
The present invention relates to an improvement in an etching device capable of performing etching using an etching liquid.

Conventionally, an etching apparatus described below with reference to FIG. 1 has been proposed.

That is, it has an etching liquid storage section 2 which is a cylindrical body with a bottom and which stores the etching liquid 1 therein.

Further, the etching liquid storage section 2 includes a cylindrical wafer mounting section 4, which is arranged in a manner described later and on which a wafer 3 to be etched is placed.

In this case, the wafer mounting part 4 includes an annular collar 5 integrally projecting upward from the outer periphery of its upper surface, a screw 6 attached to the outer periphery, and a screw 6 integrally extending from the lower outer periphery. An annular guard 7 that protrudes in the direction
and a ventilation hole 8 extending between the top surface and the outer peripheral surface.
It has

Thus, the wafer 3 is placed on the wafer placement part 4 with the outer periphery of its lower surface in contact with the upper end surface of the annular collar 5.

Further, as described above, a wafer restrainer made of a cylindrical body is used to hold the wafer 3 placed on the wafer mounting part 4 liquid-tightly on the wafer mounting part 4 side at the outer periphery of the upper surface thereof. It has a use part 11.

In this case, the wafer holding part 11 includes an annular collar 12 integrally extending inward from the upper part of the inner surface, a screw 13 attached to the lower part of the inner face, and a ventilation pipe (described later) bored from the upper surface. It has a recessed part 14 for planting 23, and a ventilation hole 15 extending between the recessed part 14 and the inner circumferential surface.

As described above, the wafer 3 is placed on the wafer placement part 4, and the sealing O-ring 20 obtained in advance is placed on the outer periphery of the upper surface of the wafer 3. and with the sealing O-ring 21 previously obtained in the same manner placed on the annular collar 7 of the wafer placement part 4,
From above, insert the wafer holding part 11 into its screw 1.
3 and the screw 6 of the wafer mounting part 4 described above, the wafer holding part 11 is screwed together.
However, the annular collar 12 liquid-tightly holds the wafer 3 to the wafer mounting portion 4 side at the outer peripheral portion of the upper surface via the sealing O-ring 20.
Also, attach the sealing O-ring 21 to the wafer mounting section 4.
It is held down to the side.

Further, while the etching solution 1 is stored in the etching solution storage section 2, a ventilation tube 22 located above is implanted in the wafer holding section 11 at the position of the above-mentioned recess 14. It is erected.

Thus, the wafer 3 is placed on the wafer placement part 4 as described above, and the wafer 3 is held in a liquid-tight manner at the outer peripheral part of the upper surface by the wafer holding part 11 as described above. The upper surface of the wafer mounting part 4 and the annular flange 5 are pressed against the side of the wafer mounting part 4, and the etching liquid 1 is contained in the etching liquid storage part 2.
The space 24 formed by the wafer 3 and the wafer 3 is
Via the ventilation pipe 22 and the ventilation holes 8 and 15,
The etching liquid 1 is connected to the outside of the upper surface thereof.

The above is the configuration of the conventionally proposed etching apparatus.

According to the conventional etching apparatus having such a configuration, as described above, the wafer mounting section 4
Place wafer 3 on top, and then
If the wafer 3 is placed in the etching liquid storage part 2 containing the etching liquid 1 while being held down by the wafer holding part 11, the upper surface of the wafer 3 will come into contact with the etching liquid 1. .

However, the wafer 3 is liquid-tightly held down on the wafer mounting part 4 side via the sealing O-ring 20 at the outer peripheral part of its upper surface, and the wafer holding part 11 is O-ring 2
1 is held on the side of the wafer mounting section 4, so
The lower surface of the wafer 3 does not come into contact with the etching liquid 1.

Therefore, the wafer 3 can be etched only on one side thereof.

Further, in this case, the space 24 formed by the upper surface of the wafer mounting part 4, the annular collar 5, and the wafer 3 is connected to the ventilation pipe 22 and the ventilation hole 8.
Since the etching liquid 1 is in communication with the outside of the upper surface of the etching liquid 1 through There is no risk that the product will be damaged.

However, in the case of the conventional etching apparatus described above, both the wafer mounting part 4 and the wafer holding part 11 are arranged in the etching liquid storage part 2 which contains the etching liquid 1.
The etching liquid 1 is applied between the sealing O-ring 21 and the annular flange 7 of the wafer placement part 4 and the lower end surface of the wafer holding part 11, and between the annular flange 5 of the wafer placement part 4 and the wafer. There was a risk that the wafer 3 would pass between the wafer 3 and come into contact with the lower surface of the wafer 3.

Furthermore, in the case of the conventional etching apparatus mentioned above,
Since the wafer placing part 4 and the wafer holding part 11 are arranged in the etching liquid storage part 2, a sealing O-ring 21 between the wafer placing part 4 and the wafer holding part 11 is not required. It had the disadvantage of

Moreover, for this reason, when using a thick wafer 3, it has been difficult to deal with this problem.

Furthermore, in the case of the conventional etching apparatus described above, the wafer mounting part 4 and the wafer holding part 1 are
1 is placed in the etching liquid storage part 2, the outer peripheral surface of the wafer holding part 11 is also contaminated with the etching liquid 1, and the wafer mounting part 4 is also contaminated with the etching liquid 1. Ru. For this reason, when etching the wafer 3 by changing the type of etching liquid 1 again, there is a drawback that it requires a lot of effort and time to clean the etching equipment beforehand. Was.

Therefore, the present invention seeks to provide a novel etching device that does not have the above-mentioned drawbacks.

FIG. 2 shows an example of an etching apparatus according to the present invention, which has the configuration described below.

It has a wafer mounting section 31 on which a wafer 30 to be etched is mounted.

In this case, the wafer mounting portion 31 has an annular portion 32 and an annular collar 33 extending outward in the radial direction integrally with the annular portion 32 from the outer peripheral portion near the lower end thereof.

Further, the annular portion 32 has an O-ring receiving groove 35 for receiving the sealing O-ring 34 extending inward from the outer periphery of the upper surface thereof, and an O-ring receiving groove 35 extending inward from the outer periphery of the upper surface from the outside of the O-ring receiving groove 35. The annular groove 36 has an annular groove 36 extending thereinto, and a liquid outlet 37 that penetrates from the bottom surface of the annular groove 36 to the lower surface.

Furthermore, the annular collar 33 has a female thread 38 extending between its upper and lower surfaces, and a positioning pin 39 extending upwardly from the upper surface.

Thus, with the sealing O-ring 34 placed in the O-ring receiving groove 35, the wafer 30 is
With the outer periphery of the lower surface in contact with the sealing O-ring 34,
It is arranged to be placed on a wafer placement section 31.

Further, the wafer 30 placed on the wafer placement part 31 is held liquid-tightly on the wafer placement part 31 side at the outer circumferential portion of the upper surface thereof, and is placed on the wafer placement part 31. Wafer 3
The wafer 30 has a wafer holding/etching liquid accommodating part 43 made of a cylindrical body, which cooperates with the wafer 30 to form an etching liquid accommodating part 42 for accommodating an etching liquid 41 to be brought into contact with the upper surface of the wafer 30.

In this case, the wafer holding and etching liquid storage portion 43 includes a cylindrical portion 45 and an annular flange 46 integrally extending inward from the inner circumferential surface of the lower end thereof.
and an annular collar 47 extending outward from the outer peripheral surface of the lower end portion of the cylindrical portion 45 integrally therewith.

Further, the cylindrical portion 45 has an etching liquid inlet 48 at its upper portion, and an etching liquid outlet 49 at its lower portion.

Furthermore, the annular collar 46 has an O-ring receiving groove 51 for receiving the sealing O-ring 50, which extends inward from the outer peripheral portion of the lower surface thereof.

Further, the annular collar 47 has a bolt through hole 52 extending between its upper and lower surfaces, and the above-mentioned wafer mounting portion 31 extending inward from the lower surface.
Positioning hole 53 for receiving positioning pin 39
It has

Therefore, as described above, the wafer 30 is
The wafer is placed on the wafer placement part 31, and an annular spacer 54 is arranged on the annular collar 33 of the wafer placement part 31, and an O-ring of the wafer holding and etching liquid storage part 43 is placed on the wafer placement part 31. With the sealing O-ring 50 placed in the receiving groove 51, the wafer holding part 43 is placed on the wafer placement part 31, and the wafer is placed in the positioning hole 53. While inserting the positioning pin 39 of the use part 31, insert the sealing O-ring 50 onto the wafer 30.
It is placed in contact with the outer periphery of the upper surface, and then, in that state, the tightening bolt 55 is passed through the bolt insertion hole 52 and screwed into the female thread 38 of the wafer mounting part 31 to tighten it. Therefore, the wafer holding part 43 and the etching liquid storage part 43 are the same as the wafer mounting part 3.
The wafer 30 placed on the wafer mounting portion 31 is placed on the wafer mounting portion 31 in a liquid-tight manner at the outer peripheral portion of the upper surface thereof.
The wafer 30 is pressed to the side and cooperates with the wafer 30 placed on the wafer placement part 31 to form an etching liquid storage part 42 for storing an etching liquid 41 to be brought into contact with the upper surface of the wafer 30. .

The above is an example of the configuration of the etching apparatus according to the present invention.

According to the etching apparatus according to the present invention having such a configuration, as described above, the wafer 30 is placed on the wafer placement part 31, and the wafer 30 is placed on the outer periphery of the upper surface as described above. If the etching liquid 41 is contained in the etching liquid storage part 42 using the etching liquid inlet 48, the etching liquid storage part 42 can be kept liquid-tight. The upper surface of 30 contacts etching liquid 41.

However, the wafer 30 is liquid-tightly held at the outer peripheral portion of the upper surface of the wafer 30 through the sealing O-ring 50 toward the wafer mounting portion 31 side.
Moreover, at this time, since the sealing O-ring 50 maintains liquid tightness between the wafer 30 and the wafer mounting part 31 at the outer peripheral part of the lower surface of the wafer 30, the lower surface of the wafer 30 is It does not come into contact with the etching liquid 41.

Therefore, the wafer 30 can be etched only on one side thereof.

As described above, according to the etching apparatus according to the present invention described above, the wafer 30 can be etched only on one side thereof. Since the portion 43 is not disposed in the etching solution storage section that stores the etching solution like the wafer mounting section 4 and the wafer holding section 11 in the etching apparatus described above in FIG. 1, the etching solution 41 is There is no risk of contact with the lower surface of the wafer 30.

Further, according to the etching apparatus according to the present invention described above, the wafer mounting part 31 and the wafer holding part 43 and the etching liquid storage part 43 are the same as the wafer mounting part 4 in the etching apparatus described above in FIG.
Since the wafer holding part 11 is not disposed in the etching liquid storage part that contains the etching liquid, a sealing part such as the sealing O-ring 21 in the conventional etching apparatus described above in FIG. No O-ring required.

Furthermore, in the case of the etching apparatus according to the present invention described above, the wafer mounting part 31 and the wafer holding and etching liquid storage part 43 are the same as the wafer mounting part 4 in the etching apparatus described above in FIG.
Since the wafer holding part 11 is not disposed in the etching liquid storage part that contains the etching liquid, the inner surface of the wafer holding and etching liquid storage part 43 may be contaminated by the etching liquid 41. Also, the outer surface of the wafer holding and etching solution storage portion 43 and the wafer mounting portion 31
The inner and outer surfaces of the etching liquid 41 are not contaminated by the etching liquid 41.

Therefore, when etching the wafer 30 by changing the type of etching liquid 41 again, it does not require much effort and time to clean the etching apparatus, which is required beforehand.

Further, in the case of the etching apparatus according to the present invention described above, the wafer mounting part 31 and the wafer holding part 43 and the wafer holding part 43 in the etching apparatus described above in FIG. Since it is not disposed in the etching liquid storage part that stores the etching liquid like the part 11, there is no need to prepare an etching liquid storage part for storing the etching liquid, and the amount of the etching liquid is smaller than that shown in FIG. This requires less etching than when using the conventional etching apparatus described above.

Further, according to the etching apparatus according to the present invention described above, the wafer mounting part 31 and the wafer holding part 43 are the same as the wafer holding part 4 and the wafer holding part 4 in the etching apparatus described above in FIG. Since the etching part 11 is not disposed in the etching liquid storage part that stores the etching liquid, the sealing O-ring such as the sealing O-ring 21 in the conventional etching apparatus described above in FIG. Therefore, even if the thickness of the wafer 30 is increased, there is no need to provide the wafer 30 with
It can easily be arranged that only one side thereof is in contact with the etching liquid.

Further, according to the above-described etching apparatus according to the present invention, the wafer 30 is held down by tightening the wafer holding/etching liquid storage part 43 to the wafer mounting part 31 using the tightening bolt 55. And at this time,
Since the annular spacer 54 is used, the wafer 30 in the wafer holding and etching liquid storage section 43 is
The holding force against the wafer 30 can be precisely controlled, and the holding force is therefore appropriate when holding the wafer 30 liquid-tightly against the wafer mounting part 31 at the outer circumferential portion of the upper surface thereof. In addition, damage to the wafer 30 can be prevented.

Further, according to the above-described etching apparatus according to the present invention, since the wafer mounting portion 31 has the annular groove 36, the etching liquid 41 can flow between the wafer 30 and the wafer holding/etching liquid storage portion 43. Even if the etching solution does not reach the bottom side of the wafer 30 through the annular groove 3
Since the etching solution flows into the etching solution 6 and is then led out to the outside through the solution outlet 37, there is no possibility that the lower surface of the wafer 30 will be contaminated by the etching solution.

Further, according to the above-described etching apparatus according to the present invention, the wafer mounting portion 31 is connected to the annular portion 3.
2, the wafer 30
The lower surface of the etching apparatus is configured to communicate with the outside air, and thus has the same effect as when the space 24 in the conventional etching apparatus described above in FIG. 1 is communicated with the outside through the ventilation pipe 22.

Further, since the etching apparatus according to the present invention described above has the liquid inlet 48 and the liquid outlet 49, by connecting these to the cleaning pipe 56 and the liquid draining pipe 57, respectively, the etching liquid can be stored. The etching liquid 41 contained in the portion 42 can be easily discharged, and the inner surface of the wafer holding and etching liquid storage portion 43 can be easily cleaned.

Further, according to the etching apparatus according to the present invention described above, by disposing the heater 48 for heating the etching liquid 41 in the etching liquid storage section 42 configured as described above, the etching liquid 51 can be kept at an appropriate temperature. can be kept at

The above description merely shows an example of the present invention, and without departing from the spirit of the present invention,
Various modifications and changes may be made.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view showing a conventional etching apparatus. FIG. 2 is a schematic cross-sectional view showing an example of an etching apparatus according to the present invention. 30... Wafer, 31... Wafer placement part, 32... Annular part, 33... Annular collar, 34
... O-ring for sealing, 35 ... O-ring receiving groove, 36 ... Annular groove, 37 ... Liquid outlet, 38 ...
... Female thread, 39 ... Positioning pin, 41 ... Etching liquid, 42 ... Etching liquid storage part, 43
...Wafer holding and etching liquid storage section, 4
5... Cylindrical part, 46... Annular flange, 47... Annular flange, 48... Liquid inlet, 49... Liquid outlet, 5
0...Sealing O-ring, 51...O-ring receiving groove, 52...Bolt through hole, 53...Positioning hole, 54...Spacer, 55...Bolt.

Claims (1)

[Claims for Utility Model Registration] A wafer mounting part 31 having an annular part 32 and an annular collar 33 integrally extending outward in the radial direction from the outer circumferential part of the wafer mounting part 31; , an annular collar 46 extending inwardly from the inner circumferential surface of the lower end thereof, and an annular collar 47 extending outward integrally from the outer circumferential surface of the lower end of the cylindrical portion 45. The annular part 32 of the wafer mounting part 31 has a first sealing O-ring 34 extending inward from the outer periphery of the upper surface thereof. O-ring receiving groove 35
and the O-ring receiving groove 35 on the outer periphery of the upper surface.
and an annular groove 36 extending from the outside to the inside of the wafer holding and etching liquid storage part 4.
The cylindrical part 45 of No. 3 has an etching liquid inlet 48 at the upper part and an etching liquid outlet 49 at the lower part, and the part 4 for holding the wafer and storing the etching liquid.
The annular collar 46 of No. 3 has a second O-ring receiving groove 51 for receiving the second sealing O-ring 50 extending inward from the outer periphery of the lower surface thereof, and the annular collar 46 has a second O-ring receiving groove 51 for receiving the second sealing O-ring 50. Housing section 4
3 is an annular portion 32 of the wafer mounting portion 31;
into the first O-ring receiving groove 51.
A sealing O-ring 34 is disposed, a wafer 30 is placed on the first sealing O-ring 34, an annular spacer 54 is placed on the annular collar 33 of the wafer placement part 31, With the second sealing O-ring placed in the second O-ring receiving groove 51 of the annular collar 46 of the wafer holding and etching liquid storage section 43, tighten the tightening bolt 55. The wafer 30 is held on the side of the wafer mounting section 31, and works together with the wafer 30 to form an etching solution storage section 42 that accommodates an etching solution 41 that is brought into contact with the upper surface of the wafer 30. Etching equipment.