JPH0129061B2 - - Google Patents
Info
- Publication number
- JPH0129061B2 JPH0129061B2 JP57199205A JP19920582A JPH0129061B2 JP H0129061 B2 JPH0129061 B2 JP H0129061B2 JP 57199205 A JP57199205 A JP 57199205A JP 19920582 A JP19920582 A JP 19920582A JP H0129061 B2 JPH0129061 B2 JP H0129061B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- protrusions
- substrate
- protrusion
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/04—Manufacture of electrodes or electrode systems of thermionic cathodes
-
- H10W72/701—
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57199205A JPS5988862A (ja) | 1982-11-12 | 1982-11-12 | 接続用金属への金属突起物形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57199205A JPS5988862A (ja) | 1982-11-12 | 1982-11-12 | 接続用金属への金属突起物形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5988862A JPS5988862A (ja) | 1984-05-22 |
| JPH0129061B2 true JPH0129061B2 (cg-RX-API-DMAC10.html) | 1989-06-07 |
Family
ID=16403881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57199205A Granted JPS5988862A (ja) | 1982-11-12 | 1982-11-12 | 接続用金属への金属突起物形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5988862A (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230268312A1 (en) * | 2022-02-18 | 2023-08-24 | Bae Systems Information And Electronic Systems Integration Inc. | Soft touch eutectic solder pressure pad |
-
1982
- 1982-11-12 JP JP57199205A patent/JPS5988862A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5988862A (ja) | 1984-05-22 |
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