JPH01289260A - Wire bonder - Google Patents
Wire bonderInfo
- Publication number
- JPH01289260A JPH01289260A JP63120911A JP12091188A JPH01289260A JP H01289260 A JPH01289260 A JP H01289260A JP 63120911 A JP63120911 A JP 63120911A JP 12091188 A JP12091188 A JP 12091188A JP H01289260 A JPH01289260 A JP H01289260A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- capillary
- reel
- wound
- vertical groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000002159 abnormal effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
この発明は、半導体装置（ＩＣ，Ｔｒ）を組立てる際に
用いるワイヤホンダのキャピラリに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a capillary for wire honda used when assembling semiconductor devices (IC, Tr).
［従来の技術］
第２図は従来のワイヤボンダのワイヤボンドヘッドの構
造を示す概念図である。図において（１）はワイヤリー
ル、（２）はワイヤ、（４）はクランパ、（５１）はキ
ャピラリである。第３図は第２図におけるキャピラリ（
５１）を示し、（ａ）は平面図、（ｂ）は正面図である
。[Prior Art] FIG. 2 is a conceptual diagram showing the structure of a wire bond head of a conventional wire bonder. In the figure, (1) is a wire reel, (2) is a wire, (4) is a clamper, and (51) is a capillary. Figure 3 shows the capillary (
51), in which (a) is a plan view and (b) is a front view.
従来のワイヤボンダのキャピラリ（５１）は第３図に示
すように内部を円筒状にくり抜き、その内部にワイヤを
通して第２図に示すようなミステムとして用いられてい
た。The capillary (51) of a conventional wire bonder has a cylindrical interior as shown in FIG. 3, and a wire is passed through the inside to be used as a mist as shown in FIG.
次に動作について説明する。第２図のワイヤボンダシス
テム概念図に示すように、円筒状のリール（＋）にワイ
ヤ（２）が巻いてあり、ワイヤ（２）を送り出しながら
半導体の外部接続端子とチップを接続している。Next, the operation will be explained. As shown in the conceptual diagram of the wire bonder system in FIG. 2, a wire (2) is wound around a cylindrical reel (+), and the wire (2) is fed out to connect external connection terminals of the semiconductor and the chip.
［発明が解決しようとする課題］
従来のキャピラリではリールに巻かれた際のワイヤの巻
きぐせ（カール）が取れないまきワイヤボンドが行われ
るので、ワイヤボンドの際にその巻きぐせのために正し
くワイヤボンドされずに異状な形状や、横倒しのように
なフてしまう欠点があり、その対策が課題であフだ。[Problem to be solved by the invention] With conventional capillaries, wire bonding is performed in which the curl of the wire cannot be removed when it is wound on a reel. There are drawbacks such as the wire bonding not being done, resulting in an abnormal shape, and the problem of falling off when tipped on its side, so countermeasures are a challenge.
この発明は上記の課題を解決するためになされたもので
、ワイヤの巻きぐせによるループの異状の発生を押える
ことのできるワイヤボンダ用キャピラリを得ることを目
的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to obtain a capillary for a wire bonder that can suppress the occurrence of loop abnormalities due to curling of the wire.
［課題を解決するための手段］
この発明に係るキャピラリは、ワイヤがリールに巻かれ
たことによって生しる巻きぐせのために発生するワイヤ
ポンド時のループ形状の異状の発生を押えるために、キ
ャピラリの内部の貫通穴に縦溝を設けたものである。[Means for Solving the Problems] The capillary according to the present invention has the following features: A vertical groove is provided in the through hole inside the capillary.
［作用］
この発明におけるキャピラリは、その内部の貫通穴に設
けた縦溝の効果により巻きぐせによって発生しようとす
るワイヤの回転による異状なワイヤボンドループの形状
を防ぎ、所望のワイヤボンドループプの形状を得る。[Function] The capillary of the present invention prevents the irregular shape of the wire bond loop due to the rotation of the wire due to the curling due to the effect of the vertical groove provided in the through hole inside the capillary, and allows the desired wire bond loop shape to be formed. Get the shape.
［実施例］ この発明の一実施例を図によって説明する。[Example] An embodiment of the invention will be described with reference to the drawings.
７１ｇ１図はキャピラリを示しくａ）は平面図、（ｂ）
は止面図である。Figure 71g1 shows the capillary, a) is a plan view, (b)
is a top view.
図に示すキャピラリ（５２）は第２図の従来例で示した
ワイヤポンドヘッドのキャピラリ（５１）に代えて使用
する。リール（１）に巻かれたワイヤ（２）の巻きぐせ
によるワイヤ（２）の回転を防ぐために、キャピラリ（
５２）の内部の貫通穴に縦溝を設けている。この縦溝に
よりワイヤ（２）の回転によるワイヤポンドループの異
状を防ぐ。The capillary (52) shown in the figure is used in place of the capillary (51) of the wire pound head shown in the conventional example of FIG. In order to prevent the wire (2) from rotating due to the wire (2) wound around the reel (1), a capillary (
52), a vertical groove is provided in the through hole inside. This vertical groove prevents abnormalities in the wire pond loop due to rotation of the wire (2).
次に動作について説明する。Next, the operation will be explained.
リール（１）に巻いであるワイヤ（２）は、キャピラリ
（５２）にクランパー（４）を経て供給するのであるか
、リール（１）に巻かれた際の巷きぐせは充分に解放で
きずに供給される。この際に、巻きぐせはワイヤ（２）
のよじれとなり、ワイヤ（２）を回転させようとする力
が（動らく。このためにワイヤポンドループが回転力に
より横倒しとなることがあり、安定したワイヤボンドル
ープを得られない。The wire (2) wound around the reel (1) may be supplied to the capillary (52) via the clamper (4), or the wire (2) cannot be sufficiently released when wound around the reel (1). is supplied to At this time, the wire (2)
This causes the wire (2) to become twisted and the force that tries to rotate the wire (2) (moves).For this reason, the wire bond loop may fall sideways due to the rotational force, making it impossible to obtain a stable wire bond loop.
この回転力を消すためにキャピラリ（５２）の内部の貫
通穴に縦溝を設ける。この縦溝にガイドされることによ
ってワイヤ（２）の回転力を打ち消し、まっすぐにワイ
ヤ（２）が出て、正常なワイヤポンドループが形成され
る。In order to eliminate this rotational force, a vertical groove is provided in the through hole inside the capillary (52). By being guided by this vertical groove, the rotational force of the wire (2) is canceled out, the wire (2) comes out straight, and a normal wire pond loop is formed.
［発明の効果］
以上のようにこの発明によればワイヤポンダのキャピラ
リの内部の貫通穴に縦溝を設けたので、ワイヤの巻きぐ
せによるワイヤの回転（ねじれ）を抑ｒ￥Ｊ ｔ、正常
なワイヤボンドループが得られる。[Effects of the Invention] As described above, according to the present invention, since the vertical groove is provided in the through hole inside the capillary of the wireponder, rotation (twisting) of the wire due to curling of the wire is suppressed, and normal A wire bond loop is obtained.
第１図はこの発明によるワイヤポンダのキャピラリの平
面図及び正面図、第２図は従来のワイヤポンダのワイヤ
ポンドヘッドの構造の概念図、第３図は従来のキャピラ
リの平面図及び正面図である。
図において（５２）はキャピラリである。
なお、図中、同一符号は同一、又は相当部分を示す。
代理人 大 岩 増 雄
第１図
（θ）
、ｆ２ キＹビラリ
第３図
（θ）
（ｂ）
手続補正書（自発）
２、発明の名称
ワイヤボンダ
３、補正をする者
名 称 （６０１）三菱電機株式会社代表者 志 岐
守 哉
４、代理人
（連絡先０３（２１３）３４２１特許部） ′・多″５
、 補正の対象
明細書の発明の詳細な説明の欄。
６、 補正の内容
（【）明細書の第２頁第３行に「ミステム」とあるのを
「システム」に訂正する。
以 上FIG. 1 is a plan view and a front view of a capillary of a wire ponder according to the present invention, FIG. 2 is a conceptual diagram of the structure of a wire pound head of a conventional wire ponder, and FIG. 3 is a plan view and a front view of a conventional capillary. In the figure, (52) is a capillary. In addition, in the figures, the same reference numerals indicate the same or equivalent parts. Agent Masuo Oiwa Figure 1 (θ), f2 Kiy Villari Figure 3 (θ) (b) Procedural amendment (voluntary) 2. Name of the invention Wire Bonder 3. Name of the person making the amendment (601) Mitsubishi Denki Co., Ltd. Representative Mamoru Shiki 4, Agent (Contact information: 03 (213) 3421 Patent Department) '・Tai'' 5
, Detailed description of the invention in the specification subject to amendment. 6. Contents of the amendment ([) In the third line of the second page of the description, the word "Mistem" is corrected to "System."that's all
Claims (1)
ワイヤを圧接するキャピラリの内部の貫通穴に縦溝を設
けたことを特徴とするワイヤボンダ。In wire bonders used when manufacturing semiconductors,
A wire bonder characterized in that a vertical groove is provided in a through hole inside a capillary that presses a wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63120911A JPH01289260A (en) | 1988-05-17 | 1988-05-17 | Wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63120911A JPH01289260A (en) | 1988-05-17 | 1988-05-17 | Wire bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01289260A true JPH01289260A (en) | 1989-11-21 |
Family
ID=14798045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63120911A Pending JPH01289260A (en) | 1988-05-17 | 1988-05-17 | Wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01289260A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021086892A (en) * | 2019-11-27 | 2021-06-03 | 三菱電機株式会社 | Semiconductor manufacturing apparatus |
-
1988
- 1988-05-17 JP JP63120911A patent/JPH01289260A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021086892A (en) * | 2019-11-27 | 2021-06-03 | 三菱電機株式会社 | Semiconductor manufacturing apparatus |
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