JPH01283973A - Mounting device for photodetecting element - Google Patents

Abstract

PURPOSE:To improve the function of a solid state image pickup device by sealing mounting parts on which photoelectric conversion element chips are mounted with a translucent substance, while by sealing mounting parts on which element chips other than the photoelectric conversion element chips are mounted with a light shielding or translucent substance. CONSTITUTION:In a package structure where chips can be mounted on both surfaces, a solid state image pickup element chip 6'-1 is mounted on a surface of a package 12 onto which light is injected and a drive circuit or a signal processing circuit, etc., on a surface thereof onto which light is not injected. The side onto which the light is injected is sealed by a translucent plate 10', while the side onto which the light is not injected is sealed, as necessary, by sealing means 14 such as a translucent or nontranslucent plate. Accordingly, many function circuit chips 6'-2 in addition to the solid state image pickup element chip 6'-1 can be mounted with in the same mounting device, thereby reducing image pickup the size of and increasing the functions of the solid state image pickup element device.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a solid-state image sensor in which a photoelectric conversion element, a scanning element for extracting signals, etc. are integrated on a semiconductor substrate, or
The present invention relates to a photodetecting element mounting apparatus for mounting various photodetecting elements.

[Conventional technology]

Solid-state imaging devices require an imaging plate with a resolution comparable to that of the imaging electron tubes used in current television broadcasting, and for this reason, there are 500 in the vertical direction and 500 to 8 in the horizontal direction.
A matrix of 00 picture elements (photoelectric conversion elements) and a corresponding scanning element are required. Therefore, the solid-state image sensor is manufactured using MO5 large-scale circuit technology that requires high integration, and generally uses COD or MoS transistors as constituent elements.

Figure 2 (a) shows a schematic diagram of the chip of the CCDC solid-state imaging probe. 1 is a photoelectric conversion area consisting of a photodiode, a vertical COD shift register, etc., and 2 is an output signal charge transferred by the vertical COD shift register. This is a horizontal COD shift register that transfers data toward circuit 3. 4 is a bonding pad that supplies clock pulses, power supply voltage, etc. that drive the COD, 5 is a wiring that transmits pulses, etc. For example, 4V is a clock for vertical COD driving; 1, for example, 4H is a clock for horizontal COD driving; Reference numeral 40 denotes a pad that supplies power supply voltage and the like for driving the output circuit. Further, 6 is a solid-state image sensor chip in which a photoelectric conversion element, a horizontal CCD, an output circuit, wiring, pads, etc. are integrated.

FIG. 2(b) schematically shows a package in which the above solid-state imaging probe chip is mounted. 6 is a solid-state image sensor chip, 7 is a bonding pad on the package side, 8 is a wire (generally AQ, Au@, etc. is used) that electrically connects the pad (4) on the chip side and the pad 7 on the package side.
Numeral 9 is a bin terminal, and each bin is electrically connected to a predetermined pad 7.

Further, 10 is a sealing plate for sealing the chip inside the package, and transparent glass or the like is generally used to pass optical information 11 therethrough.

As is well known, the solid-state imaging device mounting device in which the imaging chip is sealed in a package as described above has many advantages over electron tube imaging devices due to its solid state structure, such as being small, lightweight, and maintenance-free.

This is a device that is expected to have a promising future as an imaging device.

[Problem to be solved by the invention]

However, the current solid-state image sensor mounting apparatus is still in the process of development and has the following problems.

(1) In addition to the solid-state image sensor, drive circuits, signal processing circuits, memory, etc. are integrated to improve functionality and reliability.

It is necessary to reduce mixed sounds by reducing parasitic capacitance and to widen the band. However, when attempting to integrate these peripheral circuits into an image sensor, the overall chip size becomes significantly large, leading to an increase in price. In addition, the power consumed within the chip increases, leading to an increase in dark current due to chip heat generation, and so the advantages of permanent installation outweigh the benefits of integration.

(2) Although the solid-state imaging probe itself is small, in an actual video camera, a drive circuit and a signal processing circuit are also required as camera components, so there is a limit to miniaturization of the entire camera. In addition, experiment costs (package costs) to implement each circuit are required for each circuit, leading to an increase in camera prices, and other problems tend to increase in parallel with the commercialization of solid-state imaging devices. be.

Therefore, it is an important issue to improve the functionality of solid-state imaging devices and to reduce the size of the entire device.

The purpose of the present invention is to solve the above problems,
An object of the present invention is to provide a compact solid-state imaging device with high functionality.

[Means to solve the problem]

The above object of the present invention is achieved by installing various types of chips on both sides of a package in which a solid-state image sensor is mounted. Specifically, we have developed a light package structure that allows the chip to be installed on both sides, the solid-state image sensor chip is placed on the side of the package where light enters, and the drive circuit is placed on the side where light does not enter. Chips such as signal processing circuits are attached, and the side where light enters is sealed with a light-transmissive plate, and the side where light is not entered is sealed with a light-transparent or non-transparent board or other sealing as necessary. The feature is that it is sealed by a sealing means.

[Effect]

As described above, in one mounting apparatus for a solid-state image sensor of the present invention, in addition to the solid-state image sensor chip, a number of functional circuit chips can be mounted in the same mounting apparatus.

Therefore, it is possible to effectively downsize and improve the functionality of the solid-state imaging device without increasing the size of the solid-state imaging device chip.

〔Example〕

The present invention will be explained in detail below using examples.

FIG. 1 is a diagram showing an embodiment that is the gist of the present invention, and shows the structure of a mounting apparatus for a solid-state image sensor. In Fig. 1, 12 indicates the two chip mounting portions 13-1.13-
2 is a mounting device, that is, a package, 6'-1 is a solid-state imaging probe chip, and 6'-2 is a chip in which a driving circuit, a signal processing circuit, etc. are integrated. 7'-1,7'
-2 is a pad on the package side, 8'-1 is a wire that electrically connects the imaging probe chip and the pad on the package side.
, 8'-2 are wires connecting the drive circuit chip and the cage side pads. 10' is a translucent sealing plate attached to the side where light enters, that is, the imaging cable chip side; , 14' is a sealing plate attached to the side where drive circuit chips etc. not related to photoelectric conversion are installed.Since the sealing plate 14 does not need to pass light, it is made of an opaque material (for example, metal, transparent material, etc.). or

Instead of using a sealing plate, the chip 6'-2 is sealed with a resin resin that is often used as a molding agent for general ICs by pouring the resin into the area 15. Good too.

When the chip 6'-2 is assumed to be a drive circuit, for example, drive pulses generated by the drive circuit are input to the image pickup element chip and drive the element. Pad (7'-
2-n: n represents a predetermined number among multiple pads) and a pad for inputting the drive pulse (7'-1-n
) may be electrically connected inside the package depending on the wiring layout laid inside the package (not shown) As shown in FIG. 2-n pin terminal (9
'-2-n) and pin terminal for pad 7'-1-n (9'
-1-n), and these two bin terminals (9'-1-n) are provided.
n and 9'-2-n) on the outside of the package.
The electrical connection may be made through A16. By using the mounting apparatus of the present invention as described above, it is possible to substantially improve the functionality of the imaging probe without increasing the chip size of the imaging probe itself.

FIG. 1(Q) shows an embodiment in which the chip mounting portions 13-1 and 13-2 have different dimensions (or areas). In this example, the dimensions (or area) of the mounting section 13-2 and the mounting of the imaging probe chip 6'-1 are smaller than those of the section 13-1. If the chip forming the image sensor chip is larger than the image sensor chip, the size (or area) of the mounting portion 13-2 may be made larger than that of the mounting portion 13-1.

FIG. 3 is a diagram showing another embodiment of the present invention, and FIG.
In a), a plurality of chips are attached to the portion 13-2. 6'-2 is, for example, a drive circuit chip, which is connected to the pad 7 of the package via a wire 8'-2.
'-2 and 6'-3 are chips for, for example, a signal processing circuit, and are electrically connected to pads 7'-3 via wires 8'-3. In this embodiment, an example is shown in which three chips including an image sensor chip are attached, but in addition to the above-mentioned chips, a large number of chips such as a video memory, an analog/digital converter, etc. may be attached.

FIG. 3(b) is an example in which a plurality of chips can be attached in the same way as in FIG. 3(a), but a pad pedestal 17 is newly provided, and the package side pads 7'-2'
, 7'-3' is newly added. The addition of these pads has the advantage of further improving the functionality of the chips 6'-2 and 6'-3. Here, the number of pin terminals 9' may be increased by the increase in the number of pads, but considering the ease of handling the device, the distance between pads (7' - 2
It is desirable to reduce the number of pin terminals 9' exposed to the outside of the device by connecting the pin terminals 9' and 7'-3' inside the package. Further, in this example, there is a gap between the head 18 of the pedestal and the sealing plate 14, but the structure may be such that it contacts the sealing plate 14 and supports the sealing plate.

FIG. 4 shows an example in which a fixing plate 19 is provided between the chip mounting parts 13-1 and 13-2. With this fixing plate 19, the imaging cord mounting device can be fixed to a camera (not shown) or the like (that is, optical alignment can be performed).

If metal is used for this fixing plate 19, the imaging chip 6'-
1 and the other circuit chip 6'-2 can be electrically shielded, and noise that enters the imaging chip from the circuit chip can be reduced. Furthermore, when the power consumption of the circuit chip is large, it can be used as a heat dissipation plate for the heat generated by power consumption, so it is possible to prevent the temperature of the imaging chip from rising (a rise in temperature of the imaging chip causes an increase in dark current) (decreases image quality).

FIG. 5 shows a structure in which the pin terminal is changed from the lead terminal type shown in FIG. 1 to a buried terminal type. With this structure, the entire package including the pin terminals can be made smaller. Although this embodiment shows an example in which two rows of terminals 20-1 and 20-2 are provided above and below, there may be only one row, or the number may be increased to three or four rows.

FIG. 6 shows an embodiment in which a plurality of packages are integrated into a single mounting device. In Figure 6 (,) 2
1-1 is an image sensor chip 6'-1 and another circuit chip 6'
-2 is attached to the package, 10' is a translucent sealing plate for sealing 21-1, and 21-2 is a package to which another circuit chip 6'-3 is attached. 2
The two packages 21-1 and 21-2 are bonded (integrated) by applying adhesive or the like to the contact surface 22 of each package after each chip is attached to a predetermined package 21-1 or 21-2.
do.

FIG. 6(b) shows packages 21'-1 and 21'-2, which are similar in form, glued together and integrated.

An imaging chip 6'-1 and another circuit chip 6'-2 are attached to the package 21'-1, and two other chips 6'-3 and 6'-4 are attached to the package 21'-2. 1 is sealed by a light-transmitting sealing plate 10', and 21'-2 is sealed by a light-shielding sealing plate. Figure 6 (a), (b)
In both cases, pin terminals are omitted to avoid complicating the drawings, but the pin terminals shown in Figure 1 or Figure 5 are
Lead type pin terminals and embedded type pin terminals may be provided at the same positions as shown in the figure.

FIG. 7 shows a mounting device in which a chip is mounted only on one side, similar to a conventional package.

In FIG. 7, 6'-1 is an imaging probe chip, 6'-2
is another circuit chip. There is no need to introduce light into the chip 6'-2, or there is a risk that the circuit operation will become unstable if light leaks.

A light shielding plate 22 is attached to a part of the transparent sealing plate 10' (in a region corresponding to the upper part of the chip 6'-2). This light-shielding plate may be pasted on the top of the chip 6'-2, or a shielding film may be deposited directly on the chip, or it may be placed on the light-transmitting plate 10' corresponding to the chip 6'-2. A light shielding film (metal film, etc.) may be deposited on the area.
Here, for chip mounting, another circuit chip in addition to the chip 6'-2 may be provided in the section 13-2, or in other words, a plurality of circuit chips may be mounted in the section 13-2. ), in this figure the two mountings are part (13-
1, 13-2), but the number of mounting parts may be increased to three, four, etc. Another pedestal 17
is not absolutely necessary, so 17 may be omitted, or chips 6'-1 and 6'-2 may be directly connected with wires (each pad provided on the chip (You may also connect them directly with a wire)
.

〔Effect of the invention〕

As described above in detail using the embodiments, according to the present invention, it is possible to mount a plurality of chips on a single mounting device by devising the mounting device, and the chip size of the image sensor chip itself can be reduced. Substantially improving the functions, characteristics and reliability of the imaging device with a single mounting device without increasing the size;
It is possible to achieve miniaturization and cost reduction. Furthermore, by unifying such a mounting device, the parasitic capacitance between chips is reduced, so that it is possible to widen the signal band and reduce noise, and the practical value of the present invention is extremely large.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing the structure of a mounting device for a solid-state imaging device according to the present invention, FIG. 2 is a plan view and a sectional view showing the structure of a conventional mounting device for a solid-state imaging device, FIGS. 3 and 4. , Figure 5,
FIGS. 6 and 7 are cross-sectional views showing other embodiments of the present invention. 1... Photoelectric conversion area, 4... Ponding pad,
6... Solid-state image sensor chip, 7... Package side pad, 8... Wire, 9... Pin terminal, 10.1
4... Sealing plate, 13... Chip mounting part, 19...
・Fixing plate, 20...embedded pin terminal. (C) (b) 1,,,t, changed to p-poor 8 ・
Wire 7 ゛・ノ 7-key compensation II ■/de Figure 3

Claims (1)

[Claims] 1. In a single photodetecting element mounting device that mounts a photodetecting element with a photoelectric conversion element formed on a semiconductor substrate, multiple element chips including the photoelectric conversion element are installed on multiple surfaces of the mounting device. A plurality of chip mounting parts are provided, and the mounting part to which the photoelectric conversion element chip is mounted is sealed with a light-transmitting material, while the mounting part to which the element chip that does not participate in photoelectric conversion is mounted is provided. 1. A mounting device for a photodetecting element, characterized in that a portion thereof is sealed with a light-shielding or light-transmitting material.