JPH01276059A - Humidity sensor - Google Patents
Humidity sensorInfo
- Publication number
- JPH01276059A JPH01276059A JP10613788A JP10613788A JPH01276059A JP H01276059 A JPH01276059 A JP H01276059A JP 10613788 A JP10613788 A JP 10613788A JP 10613788 A JP10613788 A JP 10613788A JP H01276059 A JPH01276059 A JP H01276059A
- Authority
- JP
- Japan
- Prior art keywords
- fixed
- cover
- electrodes
- humidity sensor
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000000428 dust Substances 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 3
- 239000012298 atmosphere Substances 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 230000010358 mechanical oscillation Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は室内空調あるいは調理のための機器の湿度制御
に使用する湿度センサに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a humidity sensor used for humidity control of indoor air conditioning or cooking equipment.
従来の湿度センサは第２図に示すように多孔質体１０の
孔ｌｌ中に感湿材を保持させ、表面に多孔質電極１２を
設けた感湿素子１３を用い、これらの電極１２にリード
１４を例えば半田１５で取り付け、このリード部１４を
利用して制御機器またはその他の機器に取り付けるよう
にしたいわゆるディスクリート部品、換言すれば個別の
部品であった。このような湿度センサは、感湿材が接触
している気体中の水分を吸うと感湿材の電気抵抗が変化
するので感温素子の電極間に流れる電流が変化する。従
ってこの電流の変化を測定することによって気体中の湿
度を測定することができる。As shown in FIG. 2, a conventional humidity sensor uses a moisture sensing element 13 in which a moisture sensitive material is held in the pores of a porous body 10, porous electrodes 12 are provided on the surface, and leads are connected to these electrodes 12. 14 is attached with, for example, solder 15, and the lead portion 14 is used to attach it to a control device or other device, which is a so-called discrete component, in other words, an individual component. In such a humidity sensor, when the moisture-sensitive material absorbs moisture from the gas with which it is in contact, the electrical resistance of the moisture-sensitive material changes, so that the current flowing between the electrodes of the temperature-sensitive element changes. Therefore, by measuring changes in this current, the humidity in the gas can be measured.
このとき感湿素子の温度変化による電気抵抗の変化を補
償するためサーミスタ素子と組合せて湿度センサを構成
することも行われている。At this time, in order to compensate for changes in electrical resistance due to temperature changes in the humidity sensing element, a humidity sensor is also constructed by combining the humidity sensing element with a thermistor element.
この場合サーミスタ素子も別に作られ、かつ別に独立し
て前記各機器に取り付けられている。In this case, the thermistor elements are also manufactured separately and separately attached to each of the devices.
前記従来の湿度センサは前記動作説明から明らかなよう
に、感湿材および表面電極が気体と接触した状態を安定
にするためには塵埃等の付着は好ましくない。このため
個々の素子、特に感湿素子全体を網状カバーで被うこと
が行われている。As is clear from the above description of the operation of the conventional humidity sensor, adhesion of dust and the like is undesirable in order to stabilize the state in which the moisture sensitive material and the surface electrode are in contact with gas. For this reason, it is common practice to cover the individual elements, especially the entire moisture-sensitive element, with a mesh cover.
前述した従来の湿度センサの構成では、感湿素子、サー
ミスタ素子が個別に作られているので全体として小型化
することができず、また特に全体の厚さを小さくするこ
とも困難で、カバーを用いる場合には更に厚さを小さく
することができなかった。また各素子をリード部を利用
して機器に取り付けているため、各素子は振動の影響を
受は易く、このため振動に対して不安定で信頼性も充分
でなかった。In the configuration of the conventional humidity sensor described above, the humidity sensing element and thermistor element are made individually, so it is impossible to miniaturize the whole, and it is especially difficult to reduce the overall thickness, so it is difficult to reduce the cover. When used, the thickness could not be further reduced. Furthermore, since each element is attached to the device using a lead portion, each element is easily affected by vibration, and therefore is unstable with respect to vibration and has insufficient reliability.
従って本発明の目的は前述した従来の湿度センサの問題
点を解決することにあり、小型化ができ、振動に対する
不安定性をなくシ、信頼性が高く、感湿素子に設けるカ
バーも必要部分にのみととめうる一体化された湿度セン
サを提供することにある。Therefore, the purpose of the present invention is to solve the above-mentioned problems of the conventional humidity sensor.It can be miniaturized, eliminates instability due to vibration, is highly reliable, and eliminates the need for a cover for the humidity sensor. The object of the present invention is to provide an integrated humidity sensor that can be easily detected.
本発明は相互に接続された電極を両面に有する絶縁性基
板の第１の面に板状の感湿素子を固定し、前記第１の面
の反対側の第２の面に板状のサーミスタ素子を固定し、
前記基板の何れかの電極に導電性端子を接続し、前記感
湿素子側を穴付きカバーで被ってなる湿度センサである
。In the present invention, a plate-shaped moisture sensing element is fixed to a first surface of an insulating substrate having mutually connected electrodes on both sides, and a plate-shaped thermistor is fixed to a second surface opposite to the first surface. fix the element,
The humidity sensor is formed by connecting a conductive terminal to one of the electrodes of the substrate and covering the humidity sensing element side with a cover with a hole.
本発明による湿度センサは、感湿素子およびサーミスタ
素子を板状に形成して薄型化し、これら画素子を電極を
両面に有する絶縁性基板の両面にそれぞれ固定しである
ため、全体として薄型化、小型化することができ、しか
も機械的振動に対する不安定性をなくり、信頼性を高く
することができる。また塵埃等を防止するカバーも感湿
素子側のみを被う、ようにして設けることができ、カバ
ーを設けても薄型化、小型化することができる。In the humidity sensor according to the present invention, the humidity sensing element and thermistor element are formed into a plate shape to reduce the thickness, and these pixel elements are respectively fixed to both sides of an insulating substrate having electrodes on both sides, so that the overall thickness is reduced. It is possible to reduce the size, eliminate instability due to mechanical vibration, and increase reliability. Further, a cover for preventing dust and the like can be provided to cover only the moisture sensitive element side, and even if the cover is provided, the device can be made thinner and smaller.
以下に本発明の実施例を図面を参照して説明する。第１
図は本発明の一実施例の断面図である。Embodiments of the present invention will be described below with reference to the drawings. 1st
The figure is a sectional view of one embodiment of the present invention.
第１図において、１は感湿素子で、例えばＭｇＣｒ＊Ｏ
＊ −ＴｌＯｓ系多結晶質体からなる多孔質体の孔中に
重合度２０００〜５０００のポリアクリル酸ナトリウム
の感湿材が保持されてなり、板状に形成しである。２は
これも板状に形成された汎用サーミスタ素子である。３
は絶縁性基板で例えばガラス−エポキシ樹脂製であり、
この絶縁性基板３には図示してないが、その両面に例え
ば銅または金で適状に形成した電極が設けである。そし
【これら両面の重視は導電性にされたスルーホール４で
電気的に接続されている。前記感湿素子１は前記電極を
有する絶縁性基板３の第１の而５に半日または導電性接
着剤で固定しＣあり、また前記サーミスタ索子２は、前
記第１の面５の反対側の第２の面６にこれも半日または
導電性接着剤で固定しである。７は感湿素子１が固定し
である５の面側を被い、塵埃等の感湿素子１への付着を
防止するためのカバーで、絶縁性樹脂またはセラミック
で作られ、絶縁性基板３に嵌合固定しである。なおこの
カバー７には周囲雰囲気の感湿素子１への流通を。In FIG. 1, 1 is a moisture sensitive element, for example, MgCr*O
* - A moisture-sensitive material of sodium polyacrylate having a polymerization degree of 2000 to 5000 is held in the pores of a porous body made of a TlOs-based polycrystalline body, and is formed into a plate shape. 2 is a general-purpose thermistor element also formed in a plate shape. 3
is an insulating substrate, for example made of glass-epoxy resin,
Although not shown in the drawings, this insulating substrate 3 is provided with electrodes suitably made of copper or gold, for example, on both surfaces thereof. [These two surfaces are electrically connected by a conductive through hole 4. The moisture sensing element 1 is fixed to the first surface 5 of the insulating substrate 3 having the electrodes by half a day or a conductive adhesive, and the thermistor wire 2 is fixed to the first surface 5 of the insulating substrate 3 having the electrodes. This is also fixed on the second side 6 of the holder with a half-stick or conductive adhesive. Reference numeral 7 denotes a cover that covers the surface side of 5 to which the humidity sensing element 1 is fixed, and is used to prevent dust and the like from adhering to the humidity sensing element 1. The cover 7 is made of insulating resin or ceramic, and is made of insulating substrate 3. It is fitted and fixed. Note that this cover 7 allows the surrounding atmosphere to flow to the humidity sensing element 1.
可能にすると共に、塵埃の侵入を防止する太きさの多数
の六８が設けである。９は導電性端子で図ではサーミス
タ索子２の固定しである側の絶縁性基板３の第２の面６
上に設けた電極に半田付けしてあり、カバー７の外へ引
き出しである。A large number of 68 are provided, which are thick enough to allow this and to prevent dust from entering. Reference numeral 9 denotes a conductive terminal, which in the figure is a second surface 6 of the insulating substrate 3 on the side to which the thermistor cable 2 is fixed.
It is soldered to the electrode provided on the top and can be drawn out from the cover 7.
なお前記感湿素子は金１！４酸化物あるいは塩化リチウ
ムのような無機電解質を板状に形成したものでもよい。The moisture-sensitive element may be formed into a plate of an inorganic electrolyte such as gold 1!4 oxide or lithium chloride.
基板３はセラミックまたは紙フエノール樹脂製であって
もよい。また導電性端子９は感湿素子１が固定しである
絶縁性基板３の第１の面５に取り付けてもよい。The substrate 3 may be made of ceramic or paper phenolic resin. Further, the conductive terminal 9 may be attached to the first surface 5 of the insulating substrate 3 to which the moisture sensitive element 1 is fixed.
以上説明したように本発明の湿度センサは、電極を両面
に有する絶縁性基板の両面にそれぞれ板状に形成した感
湿素子およびサーミスタ素子を固定しであるため、機械
的振動に対する不安定性なく、信頼性を高くすることが
できると共に薄型化、小型化ができる。またカバーも感
湿素子のある基板の第１面にのみ設ければよく、これを
設けた状態でも小型化、薄型化できるすぐれた効果を有
する。As explained above, the humidity sensor of the present invention has a humidity sensing element and a thermistor element each formed in a plate shape fixed to both sides of an insulating substrate having electrodes on both sides, so that there is no instability due to mechanical vibration. The reliability can be increased, and the thickness and size can be reduced. Furthermore, the cover only needs to be provided on the first surface of the substrate where the moisture-sensitive element is located, and even with this cover provided, there is an excellent effect of making the device smaller and thinner.
第１図は本発明の湿度センサの一実施例の断面図、第２
図は従来の湿度センサの断面図である。
１−ｍ−感湿素子、２−ｍ−サーミスタ素子、３−ｍ−
絶縁性基板、４−ｍ−スルーホール、５−一一基板第１
面、６一−−基板第２面、７−−−カバー、８−ｍ−穴
、９−ｍ−導電性端子。
特許出願人 松下電器産業株式会社
第１図
９：ｆｓＪ子
第２図
ｎFIG. 1 is a sectional view of one embodiment of the humidity sensor of the present invention, and FIG.
The figure is a cross-sectional view of a conventional humidity sensor. 1-m-moisture sensitive element, 2-m-thermistor element, 3-m-
Insulating board, 4-m-through hole, 5-11 board 1st
surface, 6--second surface of the board, 7--cover, 8-m-hole, 9-m-conductive terminal. Patent applicant Matsushita Electric Industrial Co., Ltd. Figure 1 9: fsJ child Figure 2 n
Claims (1)
縁性基板の第１の面に板状の感湿素子を固定し、前記第
１の面の反対側の第２の面に板状のサーミスタ素子を固
定し、前記基板の何れかの電極に導電性端子を接続し、
前記感湿素子側を穴付きカバーで被つてなる湿度センサ
。1. A plate-shaped moisture sensing element is fixed to a first surface of an insulating substrate having mutually electrically connected electrodes on both sides, and a plate-shaped thermistor is fixed to a second surface opposite to the first surface. fixing the element and connecting a conductive terminal to one of the electrodes of the substrate,
The humidity sensor includes a cover with a hole covering the humidity sensing element side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10613788A JPH01276059A (en) | 1988-04-28 | 1988-04-28 | Humidity sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10613788A JPH01276059A (en) | 1988-04-28 | 1988-04-28 | Humidity sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01276059A true JPH01276059A (en) | 1989-11-06 |
Family
ID=14425993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10613788A Pending JPH01276059A (en) | 1988-04-28 | 1988-04-28 | Humidity sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01276059A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007212054A (en) * | 2006-02-09 | 2007-08-23 | Tdk Corp | Sensor module |
| JP2017527507A (en) * | 2014-05-27 | 2017-09-21 | ノキア テクノロジーズ オサケユイチア | Apparatus and related methods |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5814149B2 (en) * | 1978-07-03 | 1983-03-17 | 旭電業株式会社 | angle motor |
-
1988
- 1988-04-28 JP JP10613788A patent/JPH01276059A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5814149B2 (en) * | 1978-07-03 | 1983-03-17 | 旭電業株式会社 | angle motor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007212054A (en) * | 2006-02-09 | 2007-08-23 | Tdk Corp | Sensor module |
| JP4716018B2 (en) * | 2006-02-09 | 2011-07-06 | Ｔｄｋ株式会社 | Sensor module |
| JP2017527507A (en) * | 2014-05-27 | 2017-09-21 | ノキア テクノロジーズ オサケユイチア | Apparatus and related methods |
| US10995001B2 (en) | 2014-05-27 | 2021-05-04 | Nokia Technolgies Oy | Graphene oxide percolation network |
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