JP2780398B2 - Moisture sensitive element - Google Patents
Moisture sensitive elementInfo
- Publication number
- JP2780398B2 JP2780398B2 JP1309634A JP30963489A JP2780398B2 JP 2780398 B2 JP2780398 B2 JP 2780398B2 JP 1309634 A JP1309634 A JP 1309634A JP 30963489 A JP30963489 A JP 30963489A JP 2780398 B2 JP2780398 B2 JP 2780398B2
- Authority
- JP
- Japan
- Prior art keywords
- moisture
- electrode
- sensitive
- sensitive element
- porous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 産業上の利用分野 本発明は空調機器の湿度検知，湿度制御に用いる感湿
素子に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a humidity sensing element used for detecting and controlling humidity of an air conditioner.
従来の技術 近年、空調機器、特にカーエアコン，小型家電製品等
においても機器の自動制御化に伴い湿度センサが利用さ
れるようになってきているが、これに伴い高精度，高信
頼性かつ小型，薄型の感湿素子が求められている。2. Description of the Related Art In recent years, humidity sensors have come to be used in air-conditioning equipment, particularly in car air conditioners and small household electric appliances, in conjunction with automatic control of the equipment. There is a demand for a thin moisture-sensitive element.
以下に従来の感湿素子について説明する。 Hereinafter, a conventional moisture-sensitive element will be described.
従来の電気抵抗式感湿素子には金属酸化物のバルクか
ら一定の寸法に切断したもの（特開昭57−15404号公
報）、金属酸化物ペーストを櫛形電極上に厚膜形成後焼
成したもの（特開昭57−80703号公報）、あるいは有機
高分子を櫛形電極上にコーティングしたもの（特開昭55
−10502号公報）等がある。金属酸化物のバルクから切
断したものは特性に関与する実効的な体積を一定にする
ことが可能であるため特性のバラツキを小さく抑えら
れ、特性の制御が容易であるという利点があるが、電極
と電気的接合を行うためにリードを設ける必要があると
いう欠点がある。また、金属酸化物や有機高分子電解質
を櫛形電極上に形成したものはセンサを薄くすることは
可能であるが特性の制御やバラツキを抑えることが困難
である。A conventional electric resistance type moisture-sensitive element is obtained by cutting a metal oxide bulk to a certain size (Japanese Patent Laid-Open No. 57-15404), or a metal oxide paste fired after forming a thick film on a comb-shaped electrode. (Japanese Patent Application Laid-Open No. 57-80703) or an organic polymer coated on a comb-shaped electrode (Japanese Patent Application Laid-Open No. 55-80703).
No. -10502). The one cut from the bulk of the metal oxide has the advantage that the variation in the characteristics can be kept small and the characteristics can be easily controlled because the effective volume related to the characteristics can be kept constant. There is a disadvantage that a lead needs to be provided in order to make electrical connection with the semiconductor device. Further, when a metal oxide or an organic polymer electrolyte is formed on a comb-shaped electrode, it is possible to make the sensor thinner, but it is difficult to control characteristics and suppress variations.
第５図は従来用いられている金属酸化物のバルクから
切断した感湿素子の斜視図である。14は多孔質の金属酸
化物、15は金属酸化物上に形成されたRuO2の多孔質電
極、16は電極に接続されたPtリード、17は電極とリード
を接合するための無機導電性接着剤である。FIG. 5 is a perspective view of a moisture-sensitive element cut from a conventionally used metal oxide bulk. 14 is a porous metal oxide, 15 is a porous electrode of RuO 2 formed on the metal oxide, 16 is a Pt lead connected to the electrode, 17 is an inorganic conductive adhesive for joining the electrode and the lead Agent.
以上のように構成された感湿素子について、以下その
動作を説明する。The operation of the moisture sensitive element configured as described above will be described below.
まず、雰囲気の湿度の変化によって金属酸化物表面上
の可動プロトンおよびヒドロニウムイオン数が変化す
る。そしてこの可動イオンの変動を抵抗値の変化として
とらえ、電極を介してリードから湿度検知回路に伝達す
る。First, the number of mobile protons and hydronium ions on the metal oxide surface changes due to a change in the humidity of the atmosphere. Then, the change in the movable ions is regarded as a change in the resistance value, and is transmitted from the lead to the humidity detection circuit via the electrode.
発明が解決しようとする課題 しかしながら上記従来の構成では抵抗値変化伝達のた
めのリード取り出しが必要で、他の部品にリードを接合
する必要があるためのチップ化が困難であり、湿度検知
部を薄くできないという欠点がある。また、電極とリー
ド接続のための作業と材料が必要であるうえ、２本のリ
ードのみで機械的な感湿素子の保持を行うと振動により
容易に感湿素子の位置が変動するためリード以外に感湿
素子を保持する手段を設ける必要がある。However, in the above-described conventional configuration, it is necessary to take out a lead for transmitting a resistance value change, and it is difficult to form a chip because it is necessary to join a lead to another component. There is a disadvantage that it cannot be thinned. In addition, work and materials for connecting the electrode and the lead are required, and if the mechanical moisture-sensitive element is held with only two leads, the position of the moisture-sensitive element easily changes due to vibration, so that the position other than the lead is changed. It is necessary to provide a means for holding the moisture sensitive element.
課題を解決するための手段 上記問題点を解決する為に、請求項１に係る発明は、
多孔質状の感湿体に多孔質状の第２の電極と、回路基板
の配線パターンと接合する第１の電極をそれぞれ設け
た。Means for Solving the Problems In order to solve the above problems, the invention according to claim 1 is
A porous second electrode and a first electrode to be joined to a wiring pattern of a circuit board were provided on the porous moisture-sensitive body.
請求項２に係る発明は、請求項１において、第１の電
極を一対の電極で構成し、互いに非接触とするように構
成した。According to a second aspect of the present invention, in the first aspect, the first electrode is constituted by a pair of electrodes, and is configured to be in non-contact with each other.
請求項３に係る発明は、請求項２において、第２の電
極を感湿体の他方の全面に形成した。According to a third aspect of the present invention, in the second aspect, the second electrode is formed on the other entire surface of the moisture sensitive body.
請求項４に係る発明は、請求項１において、第２の電
極及び感湿体に保持させる感湿材として、高分子電解質
を用いた。According to a fourth aspect of the present invention, in the first aspect, a polymer electrolyte is used as a moisture-sensitive material held by the second electrode and the moisture-sensitive body.
作用 請求項１に係る発明により、リード端子などを用いず
に、直接回路基板上に実装できるので、小型化、薄型化
を行うことができ、しかも第２の電極を多孔質とするこ
とによって、空気などの気体を感湿体に導きやすくな
り、しかも第２の電極自体に感湿材を設けているので、
更に感度が向上する。According to the first aspect of the present invention, since the semiconductor device can be directly mounted on a circuit board without using a lead terminal or the like, the size and thickness can be reduced, and the second electrode is made porous. Since gas such as air is easily guided to the moisture-sensitive body, and the second electrode itself is provided with a moisture-sensitive material,
Further, the sensitivity is improved.
請求項２に係る発明によって、回路基板との接続端子
を素感湿体自体に設けることができるので、リード端子
などが不要になり非常に簡単な構成となる。According to the second aspect of the present invention, since the connection terminal for connecting to the circuit board can be provided on the moisture sensing element itself, a lead terminal and the like are not required, and the configuration becomes very simple.
請求項３に係る発明によって、感湿体に保持された感
湿材の流出等を防止でき、特性劣化を起こすことが無
く、しかも第１の電極間の電気抵抗を小さくすることが
でき、素子の感度を向上させることができる。According to the third aspect of the present invention, it is possible to prevent outflow of the moisture-sensitive material held by the moisture-sensitive body, to prevent deterioration of characteristics, and to reduce the electric resistance between the first electrodes. Sensitivity can be improved.
請求項４に係る発明によって、特性の経時変化を非常
に小さくすることができる。According to the fourth aspect of the present invention, the change with time of the characteristics can be extremely reduced.
実 施 例 実施例 １ 以下、本発明の感湿素子の実施例を詳細に説明する。EXAMPLES Example 1 Hereinafter, examples of the moisture-sensitive element of the present invention will be described in detail.
第１図は、本発明の感湿素子の構造の一例を示す斜視
図である。１は表電極でありRuO2ペーストをスクリーン
印刷し、800℃で焼き付けたものである。形成された電
極は多孔質である。２は裏電極でありAgペーストをスク
リーン印刷し800℃で焼き付けたものである。なお裏電
極２に使用する材料はAgに限らず、基板に半田もしくは
有機系の導電性接着剤で接着する場合は、Au,Pt,Cu,Zn
などの金属電極が使用できる。さらには基板にガラス系
の導電性接着剤で接着する場合はRuO2などの金属酸化物
電極なども使用出来る。３は感湿体で、感湿材としては
重合度が2000〜10000のポリアクリル酸ソーダを使用
し、これを気孔率30％のMgCr2O4−TiO2系多孔質セラミ
ックスの気孔中に保持したものであり、特性の経時変化
が非常に小さいという特徴をもっている。なお感湿体３
は多孔質セラミックにポリアクリル酸ソーダを保持しな
くとも使用できるが、この場合長期的な使用で経時変化
が発生する。感湿体３の寸法は3mm×5.3mm×0.25mm、裏
電極２の面積は3mm×3mmであり、感湿素子の特性は感湿
体３の寸法、裏電極２の面積を種々設定することで容易
に設定することができる。感湿材を多孔質体中に保持す
る方法として、電極形成後の多孔質体をポリアクリン酸
ソーダ水溶液中にディッピングした後、150℃,1時間乾
燥した。なお、感湿材の保持方法は電極形成後の多孔質
体を基板に接着した後、ポリアクリル酸ソーダ水溶液を
ディスペンサーを用いて素子上に定量滴下して乾燥する
ことでも可能である。FIG. 1 is a perspective view showing an example of the structure of the moisture-sensitive element of the present invention. Reference numeral 1 denotes a front electrode, which is obtained by screen-printing a RuO 2 paste and baking at 800 ° C. The formed electrode is porous. Reference numeral 2 denotes a back electrode, which is obtained by screen-printing an Ag paste and baking at 800 ° C. The material used for the back electrode 2 is not limited to Ag, and when the substrate is bonded to the substrate with solder or an organic conductive adhesive, Au, Pt, Cu, Zn
And other metal electrodes can be used. Further, in the case of bonding to a substrate with a glass-based conductive adhesive, a metal oxide electrode such as RuO 2 can be used. Reference numeral 3 denotes a moisture-sensitive material, which uses sodium polyacrylate having a degree of polymerization of 2000 to 10000 as a moisture-sensitive material, and holds it in the pores of a MgCr 2 O 4 —TiO 2 porous ceramic having a porosity of 30%. It has the characteristic that the change with time of the characteristics is very small. Note that the moisture sensitive body 3
Can be used without holding sodium polyacrylate in the porous ceramic, but in this case, a long-term use causes a change over time. The dimensions of the moisture sensitive body 3 are 3 mm × 5.3 mm × 0.25 mm, the area of the back electrode 2 is 3 mm × 3 mm, and the characteristics of the moisture sensitive element are to set the dimensions of the moisture sensitive body 3 and the area of the back electrode 2 variously. Can be set easily. As a method of holding the moisture-sensitive material in the porous body, the porous body after forming the electrode was dipped in an aqueous solution of sodium polyacrylate and dried at 150 ° C. for 1 hour. The moisture-sensitive material can be held by bonding the porous body after forming the electrode to the substrate, then dropping a fixed amount of aqueous solution of sodium polyacrylate on the element using a dispenser, and drying the element.
以上のように構成された本実施例の感湿素子について
以下の動作を説明する。The following operation will be described for the moisture-sensitive element of the present embodiment configured as described above.
まず雰囲気の湿度が変化することにより、感湿体３の
多孔質セラミックス中に保持したポリアクリル酸ソーダ
中の可動イオンの数が増加する。そしてこの可動イオン
数の変動を抵抗値の変化としてとらえ、電極1,3から直
接湿度検知回路に伝達するものである。First, when the humidity of the atmosphere changes, the number of mobile ions in the sodium polyacrylate held in the porous ceramics of the moisture-sensitive body 3 increases. The change in the number of movable ions is regarded as a change in the resistance value, and is transmitted directly from the electrodes 1 and 3 to the humidity detection circuit.
実施例 ２ 第２図は本発明による感湿素子をアルミナ基板上に実
装した構造の斜視図を示す。４は実施例１と同一の感湿
素子、５はアルミナ基板、６はアルミナ基板上に形成さ
れたAgパターン、７は感湿素子の表電極とAgパターンを
電気的に接続するためのRuO2を主成分とする導電性接着
剤であり、RuO2に有機物を添加したペースト状のものを
ディスペンサーを用いてポッティングした後焼成したも
のである。なお導電性接着材としてはAuやAgなどの金属
を主成分とするものも使用できる。また感湿素子の裏電
極２とアルミナ電極５上のパターン６も同様に導電性接
着剤で電気的、且つ機械的に接続されている。感湿素子
の裏面の電極未塗布の部分の面積は3mm×2.3mmである
が、使用する導電性接着剤が表裏電極を短絡しないよう
に導電性接着剤の物性に応じて決定されている。Embodiment 2 FIG. 2 is a perspective view of a structure in which a moisture-sensitive element according to the present invention is mounted on an alumina substrate. 4 is the same moisture-sensitive element as in Example 1, 5 is an alumina substrate, 6 is an Ag pattern formed on the alumina substrate, 7 is RuO 2 for electrically connecting the front electrode of the moisture-sensitive element and the Ag pattern. Is a conductive adhesive mainly composed of: a paste obtained by adding an organic substance to RuO 2 , potted using a dispenser, and then baked. Note that as the conductive adhesive, an adhesive mainly containing a metal such as Au or Ag can be used. Similarly, the back electrode 2 of the moisture sensitive element and the pattern 6 on the alumina electrode 5 are also electrically and mechanically connected by a conductive adhesive. The area of the uncoated electrode on the back surface of the moisture-sensitive element is 3 mm × 2.3 mm, but is determined according to the physical properties of the conductive adhesive so that the conductive adhesive used does not short-circuit the front and back electrodes.
実施例 ３ 第３図は本発明による感湿素子の構造の一例を示す斜
視図である。８は表電極、９は裏電極、10は感湿体であ
り各材料は実施例１と同一である。Embodiment 3 FIG. 3 is a perspective view showing an example of the structure of a moisture-sensitive element according to the present invention. Reference numeral 8 denotes a front electrode, 9 denotes a back electrode, and 10 denotes a moisture-sensitive body, and each material is the same as in the first embodiment.
また、表電極８を設ける事によって、互いに離間して
設けられた一対の裏電極９間の電気抵抗を小さくするこ
とができるので、素子の感度が向上すると共に、感湿体
10に保持されている感湿材の流出を防止することができ
る。第４図は本発明による感湿素子を基板上に実装した
際の斜視図である。11は本実施例による感湿素子、12は
アルミナ基板、13は基板上に形成されたAgパターンであ
る。実施例１による感湿素子と異なり裏電極９は２つに
分割されているが、この素子をアルミナ基板上に実装す
る際は裏電極９に電気的接続を行うのみで感湿素子の抵
抗値変化を伝達できる。尚、実装方法は実施例２と同一
である。In addition, by providing the front electrode 8, the electric resistance between the pair of back electrodes 9 provided apart from each other can be reduced, so that the sensitivity of the element is improved and the moisture sensitive body is improved.
It is possible to prevent the moisture-sensitive material held in 10 from flowing out. FIG. 4 is a perspective view when the moisture-sensitive element according to the present invention is mounted on a substrate. Reference numeral 11 denotes a moisture-sensitive element according to the present embodiment, 12 denotes an alumina substrate, and 13 denotes an Ag pattern formed on the substrate. Unlike the moisture-sensitive element according to the first embodiment, the back electrode 9 is divided into two. However, when this element is mounted on an alumina substrate, only the electrical connection to the back electrode 9 is made and the resistance value of the moisture-sensitive element is changed. Can communicate change. The mounting method is the same as that of the second embodiment.
発明の効果 以上の説明から明らかなように、本発明による感湿素
子は多孔質状の感湿体に多孔質状の第２の電極と、回路
基板の配線パターンと接合する第１の電極をそれぞれ設
けたことで、リードが不要のチップ化が可能となり、従
来の感湿素子に比べ小型で、非常に薄い形状が可能にな
るという効果が得られる。Effect of the Invention As is apparent from the above description, the moisture-sensitive element according to the present invention comprises a porous moisture-sensitive body including a porous second electrode and a first electrode joined to a wiring pattern of a circuit board. By providing each of them, it is possible to form a chip that does not require a lead, and it is possible to obtain an effect that a small and extremely thin shape can be achieved as compared with a conventional moisture-sensitive element.
第１図は本発明の実施例１における感湿素子の斜視図、
第２図は実施例２における感湿素子をアをアルミナ基板
上に実装した状態を示す斜視図、第３図は実施例３にお
ける感湿素子の斜視図、第４図は実施例３による感湿素
子を基板上に実装した状態を示す斜視図、第５図は従来
の感湿素子の斜視図である。 １……表電極、２……裏電極、３……感湿体。FIG. 1 is a perspective view of a moisture-sensitive element according to Embodiment 1 of the present invention,
FIG. 2 is a perspective view showing a state in which the moisture sensitive element in Example 2 is mounted on an alumina substrate, FIG. 3 is a perspective view of the moisture sensitive element in Example 3, and FIG. FIG. 5 is a perspective view showing a state where the wet element is mounted on a substrate, and FIG. 5 is a perspective view of a conventional moisture-sensitive element. 1 front electrode, 2 back electrode, 3 moisture sensitive body.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 多木 宏光 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭59−47703（ＪＰ，Ａ) 特開 昭54−107797（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) G01N 27/12────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiromitsu Taki 1006 Kazuma Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-59-47703 (JP, A) JP-A-54 -107797 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) G01N 27/12
Claims (4)
前記感湿体の一方の面に接触して設けられ、回路基板上
の配線パターンと接合する第１の電極と、前記感湿体の
他方の面に接触して設けられ、感湿材を保持させた多孔
質状の第２の電極とを備え、回路基板に実装されたとき
には回路基板側から前記第１の電極，前記感湿体，前記
第２の電極の順に配置される事を特徴とする感湿素子。1. A moisture-sensitive body in which a moisture-sensitive material is held in a porous body;
A first electrode that is provided in contact with one surface of the moisture-sensitive body and is joined to a wiring pattern on a circuit board; and a first electrode that is provided in contact with the other surface of the moisture-sensitive body and holds the moisture-sensitive material. And a porous second electrode which is arranged on the circuit board in the order of the first electrode, the moisture-sensitive body, and the second electrode when mounted on the circuit board. Moisture sensitive element.
対の電極は互いに非接触とした事を特徴とする請求項
（１）記載の感湿素子。2. The moisture-sensitive element according to claim 1, wherein the first electrode comprises a pair of electrodes, and the pair of electrodes are not in contact with each other.
た事を特徴とする請求項（２）記載の感湿素子。3. The moisture-sensitive element according to claim 2, wherein the second electrode is formed on one entire surface of the moisture-sensitive body.
る感湿材として、高分子電解質を用いた事を特徴とする
請求項（１）記載の感湿素子。4. The moisture-sensitive element according to claim 1, wherein a polymer electrolyte is used as the moisture-sensitive material held by the moisture-sensitive body and the second electrode, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1309634A JP2780398B2 (en) | 1989-11-29 | 1989-11-29 | Moisture sensitive element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1309634A JP2780398B2 (en) | 1989-11-29 | 1989-11-29 | Moisture sensitive element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03170045A JPH03170045A (en) | 1991-07-23 |
| JP2780398B2 true JP2780398B2 (en) | 1998-07-30 |
Family
ID=17995400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1309634A Expired - Fee Related JP2780398B2 (en) | 1989-11-29 | 1989-11-29 | Moisture sensitive element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2780398B2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54107797A (en) * | 1978-02-13 | 1979-08-23 | Denki Onkyo Co Ltd | Humidityysensitive element employing highhmolecular electrolyte |
| JPS57196143A (en) * | 1981-05-29 | 1982-12-02 | Konishiroku Photo Ind Co Ltd | Humidity-sensitive element |
| JPS5947703A (en) * | 1982-09-10 | 1984-03-17 | 株式会社富士通ゼネラル | Moisture sensitive element |
| JP2677991B2 (en) * | 1987-03-19 | 1997-11-17 | 松下電器産業株式会社 | Moisture sensitive element |
-
1989
- 1989-11-29 JP JP1309634A patent/JP2780398B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03170045A (en) | 1991-07-23 |
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