JPH01272142A - Socket for semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To attach or detach a semiconductor device to or from a socket easily by installing a spring having force pushing up a cradle receiving a J lead package and a pawl-shaped terminal capable of being opened and closed by the height of the spring at the central section of a socket to the central section of the socket. CONSTITUTION:When a J lead package 1 is pushed down, a cradle 6 and a spring 3 at the central section of a socket 4 are lowered, pawl-shaped terminals 5 capable of being opened and closed by the height of the spring 3 are opened to left and right, and the J lead package 1 is introduced into the pawl-shaped terminals 5. When the J lead package 1 is lifted gradually, the left and right pawl-shaped terminals 5 are closed, and the J lead package is connected to the socket 4. The open-close type left and right pawl-shaped terminals 5 applying downward force to the upper section of the J lead package 1 are opened. When force applied to the upper section of the J lead package 1 is brought rapidly to zero at that time, the J lead package 1 is slipped off from the socket 4 by the spring pressure of the spring 3 at the central section, and the J lead package 1 is released from the socket 4.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a socket for a semiconductor integrated circuit.

[Conventional technology]

Conventionally, when a J'J-lead package is removably mounted on a board, a socket dedicated to the J-lead package has been used. 5 and 6 are cross-sectional views showing how a J-lead package is connected to a conventional J-lead package dedicated socket. 1) is the J-lead package body, (2) is the pin that electrically connects the J-lead package by applying spring pressure inward, and (4) is the J-lead package.
This is a socket body exclusively for the hard package.

Let me briefly explain the operation. The J lead package body (
1) Attachment and detachment will be described.

First, install the JIJ-do package body (1).
The socket body (4) has a pin (2) that electrically connects the J-lead package body (1) with an inward spring pressure.
) to make an electrical connection. At this time, the pins (2) using spring pressure sandwich the JIJ-do package body (1) from the left and right, so the JIJ-do package body +11 and the socket body (4) are securely connected. It can be performed.

To remove the J-lead package body (1), insert the J-lead package body (1) from the package-dedicated socket body (4) with the pin (2).
By removing 1), it is electrically opened.

[Problem to be solved by the invention]

With conventional sockets exclusively for J'J-do packages, there was a problem that sometimes it was difficult to attach the J-lead package body because the spring pressure of the left and right bins of the socket body was applied to the J'J-do package body. . Additionally, when removing the J-lead package, the spring pressure of the left and right pins that hold down the J-lead package body and make electrical connections is applied to the J-lead package body, making it difficult to remove. .

This invention was made in order to solve the problems as described below.When installing, it is possible to make a reliable electrical connection between the claw-shaped terminal and the package, and when it is removed, the J-lead package body The purpose of the present invention is to provide a socket that can be easily removed from the socket body.

[Means to solve the problem]

This invention provides a dedicated socket for J-lead packages, which includes a cradle in the center of the socket for receiving the J-lead package body, a spring that has the force to push up the cradle, and a claw-shaped socket that can be opened and closed by the height of the spring in the center of the socket. It is a package equipped with a terminal.

[Effect]

The dedicated socket for the J lead package in this invention is
During installation, the J-lead package body is inserted and an electrical connection is established by applying spring pressure from the center of the socket body to the top and by closing the retractable claw-shaped terminal. Further, when removing the package, the retractable claw-shaped terminal opens left and right, and the spring pressure at the center of the socket body pushes the J-lead package body, making removal easy.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a semiconductor integrated circuit socket according to the present invention will be described below with reference to sectional views shown in FIGS. 1 to 4.

In the figure, +11, +21, (41 are equivalent to those shown in the conventional example in Fig. 5. (3) is a spring, (5
) claw-shaped terminal.

(6) is a cradle.

Next, the operation will be explained. First, when attaching the J-lead package body (1), press down the J-lead package body (1) from the state shown in FIG. This allows the socket body (4), the cradle (6) in the center, and the cradle (6)
Spring (3), which has the force of pushing up, lowers and spring (3)
The claw-shaped terminal (5), which can be opened and closed depending on the height of the terminal, opens left and right. Through this operation, the JIJ-de package body (1) enters the inside of the claw-shaped terminal (5). next,
When the J-lead package body (1) is slowly raised, the left and right claw-shaped terminals +51 close, and the J-lead package body is connected to the socket body (1) as shown in FIG. The installation is now complete.

Insert the J-lead package body (1) into the socket body (4).
), apply downward force to the upper part of the JU-hard package body (1) as shown in FIG.

This opens the open/close type left and right claw-shaped terminals (5).

If you quickly reduce the force applied to the top of the J-lead package body (1) to zero, the spring pressure of the spring (3) in the center will cause the J-lead package body (1) to move from the socket body (4). As shown in FIG. 4, the J-lead package body (1) is released from the socket body (4). The removal is now complete.

In addition, although the pedestal (6) was provided in the embodiment described above, the spring (
3) allows the cradle (6) to be used also as the pedestal (6), thereby making it possible to omit the cradle (6).

〔Effect of the invention〕

As described above, according to the present invention, it is possible to easily attach and detach a semiconductor device to and from a socket body. Furthermore, since attachment and detachment are performed perpendicularly to the mounting surface, high-density mounting is possible.

[Brief explanation of the drawing]

1 to 4 are diagrams showing how to attach and detach the J-lead package body using an embodiment of the socket for semiconductor integrated circuits according to the present invention, and FIG. 1 shows the state before the J-lead package body is attached to the socket body. 2 is a sectional view showing the attached state, FIG. 3 is a sectional view showing the state before removal, and FIG. 4 is a sectional view showing the removed state. Figures 5 and 6 are diagrams showing the attachment and detachment of the conventional J-lead package body. Figure 5 is a sectional view showing the state before the J-lead package body is attached to the socket body, and Figure 6 is the state after it is attached. In Figure 3, which is a cross-sectional view of the It is a cradle. In the figures, the same reference numerals indicate the same or equivalent parts. Agent Masuo Oiwa Figure 1 Figure 4

Claims (1)

[Claims] It is equipped with a spring and a pedestal that push the package up into the center of the socket where the semiconductor is mounted, and a claw-shaped terminal that opens and closes depending on the height of the spring in the center and inserts the package together with the center spring to make an electrical connection. A socket for semiconductor integrated circuits characterized by: