JPH01270397A - Multilayer interconnection board - Google Patents
Multilayer interconnection boardInfo
- Publication number
- JPH01270397A JPH01270397A JP9972688A JP9972688A JPH01270397A JP H01270397 A JPH01270397 A JP H01270397A JP 9972688 A JP9972688 A JP 9972688A JP 9972688 A JP9972688 A JP 9972688A JP H01270397 A JPH01270397 A JP H01270397A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- inner layer
- layer material
- base material
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 69
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000003431 cross linking reagent Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract description 13
- 230000007797 corrosion Effects 0.000 abstract description 7
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000035515 penetration Effects 0.000 abstract description 7
- 239000004744 fabric Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 239000011888 foil Substances 0.000 abstract description 5
- 239000011521 glass Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 239000002253 acid Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 238000004132 cross linking Methods 0.000 abstract description 2
- 238000001723 curing Methods 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 6
- 239000002966 varnish Substances 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） この発明は、多層配線基板に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to a multilayer wiring board.
さらに詳し−くは、この発明は、内層材と樹脂含浸基材
との界面におけるクラック発生を防止し、耐酸性を向上
させた多層配線基板に関するものである。More specifically, the present invention relates to a multilayer wiring board that prevents the occurrence of cracks at the interface between an inner layer material and a resin-impregnated base material and has improved acid resistance.
（従来の技術）
計算機、通信機器、電子機器等に用いられる配線基板に
ついては、高密度実装の傾向にあり、多層配線基板に対
する需要が高まってきている。(Prior Art) With regard to wiring boards used in computers, communication equipment, electronic equipment, etc., there is a trend toward high-density packaging, and demand for multilayer wiring boards is increasing.
このような多層配線基板としては、たとえば第２図に示
したように、回路（ア）を有する内層材（イ）の上下の
両面にガラスクロスに樹脂を含浸させた樹脂含浸基材（
つ）を配設し、金属箔（１）を有する外層材（オ）を配
して積層一体化したものが知られている。この多層配線
基板については、第２図に示したように積層一体化した
後にドリル。As shown in FIG. 2, for example, such a multilayer wiring board is made of a resin-impregnated base material (with glass cloth impregnated with resin) on both upper and lower surfaces of an inner layer material (B) having a circuit (A).
It is known that an outer layer material (e) having a metal foil (1) is arranged and integrated into a laminated structure. This multilayer wiring board is drilled after being laminated and integrated as shown in Figure 2.
パンチ等によって穴あけ加工し、スルホールメツキして
メツキ層（力）を形成している。Holes are punched, etc., and through-hole plating is performed to form a plating layer (force).
このような多層配線基板については、通常は、内層材（
イ）への樹脂含浸基材（つ）の配設にあたって特に両者
の接触界面の状態について留意することはなかった。For such multilayer wiring boards, the inner layer material (
When disposing the resin-impregnated base material (a) in (a), no particular attention was paid to the state of the contact interface between the two.
しかしながら、配線基板の高密度化と高速化への要求が
高まるにつれてその信頼性に注意が払われるようになっ
た結果、多層配線基板の穴あけ加王による衝撃によって
樹脂含浸基材（つ）の内層材接触部にマイクロクラヴク
が発生し、このクランクにはメツキ加工時のメツキ液が
侵入し、内層材（イ）の回路（ア）を侵食することが新
たな問題として浮−１ニしてきている。However, as the demand for higher density and higher speed wiring boards increases, more attention is paid to their reliability, and as a result, the inner layer of the resin-impregnated base material is damaged due to the impact caused by drilling holes in multilayer wiring boards. A new problem has emerged as a new problem: micro-clavicle occurs at the material contact area, and the plating liquid from the plating process invades the crank, corroding the circuit (a) of the inner layer material (a). There is.
（発明が解決しようとする課題）
この発明は、以上の通りの事情に鑑みてなされたもので
あり、従来は特段の注意を払ってこなかった多層配線基
板の内層材に設けた回路のメツキ液による侵食を防止し
、信頼性の高い多層配線基板を提供することを目的とし
ている。(Problems to be Solved by the Invention) This invention was made in view of the above-mentioned circumstances, and it uses a plating solution for circuits provided on the inner layer material of multilayer wiring boards, which has not conventionally received special attention. The purpose of this invention is to provide a highly reliable multilayer wiring board that prevents corrosion caused by corrosion.
さらに詳しくは、この発明は、従来の内層材と接する樹
脂として完全硬化樹脂を基材とともに配設した多層配線
基板の場合には避けられなかった穴あけ加工による衝撃
での内層材界面でのクラックの発生と、このクラックへ
のメツキ液の侵入による回路１１食を防廿し、耐酸性を
向上させた信頼性の高い多層配線基板を提供することを
目的としている。More specifically, this invention prevents cracks at the interface of the inner layer material due to the impact caused by drilling, which was unavoidable in the case of conventional multilayer wiring boards in which a fully cured resin was disposed together with the base material as the resin in contact with the inner layer material. The purpose of the present invention is to provide a highly reliable multilayer wiring board that prevents circuit corrosion caused by the occurrence of plating liquid and the penetration of plating liquid into cracks, and has improved acid resistance.
この発明の多層配線基板は、上記の課題を解決するなめ
に、内層材の上下の面に樹脂含浸基材を介在させて外層
材を配設一体止してなる多層配線基板において、内層材
に接する樹脂層を未硬化樹脂層としてなることを特徴と
している。In order to solve the above-mentioned problems, the multilayer wiring board of the present invention is a multilayer wiring board in which an outer layer material is disposed and integrally fixed to the upper and lower surfaces of the inner layer material with resin-impregnated base materials interposed between the upper and lower surfaces of the inner layer material. It is characterized in that the contacting resin layer is an uncured resin layer.
この発明の多層配線基板の要部を拡大して示したものが
第１図である。この第１図に示したように、内層材（１
） 上下の面には銅等の金属箔から形成した回路（２）
を設けており、この回路（２）を有する内層材（１）の
上下の面にはｔｓｂ含浸基材（３）を配設している。こ
の配設に際して、この発明においては、たとえばガラス
クロス、ガラスマット、紙などからなる基材（４）の内
層材に接する面にエポキシ樹脂、ポリイミドｔＩ＞１脂
、ポリアミド樹脂、ポリエステル樹脂等の樹脂未硬化層
（５）を設けることを特徴としている。内層材（１）と
接する樹脂含浸基材（３）の界面では、内層材（１）と
基材（４）との間には未硬化の樹脂層（５）が介在する
ことになる。FIG. 1 is an enlarged view of the main parts of the multilayer wiring board of the present invention. As shown in Fig. 1, the inner layer material (1
) Circuits formed from metal foil such as copper on the top and bottom surfaces (2)
A TSB-impregnated base material (3) is provided on the upper and lower surfaces of the inner layer material (1) having the circuit (2). In this arrangement, in the present invention, a resin such as epoxy resin, polyimide tI>1 resin, polyamide resin, polyester resin, etc. It is characterized by providing an uncured layer (5). At the interface of the resin-impregnated base material (3) in contact with the inner layer material (1), an uncured resin layer (5) is interposed between the inner layer material (1) and the base material (4).
この内層Ｎ（１）に接する未硬化樹脂層（５）は、ガラ
スクロス、紙等の基材（４）に含浸させて設けてもよい
し、または基材（４）に塗布することにより形成するこ
ともできる。The uncured resin layer (5) in contact with the inner layer N(1) may be provided by impregnating a base material (4) such as glass cloth or paper, or may be formed by coating the base material (4). You can also.
このような未硬化樹脂層（５）は、あらかじめ内層材（
１）の表面に塗布して形成することもできる。この層は
、通常の基材の含浸に用いる樹脂ワニスに配合する硬化
剤やノボラック等の架橋剤の添加量を減少させるか、ま
たはこれらを添加しないものを用いて形成することがで
きる。これらの添加量は、好ましくはＯ〜３重量％程度
とする。Such an uncured resin layer (5) is coated with an inner layer material (
It can also be formed by coating on the surface of 1). This layer can be formed by reducing the amount of a crosslinking agent such as a curing agent or novolak that is blended into a resin varnish used for impregnating a normal base material, or by using a resin varnish that does not contain these. The amount of these added is preferably about 0 to 3% by weight.
、二のようなこの発明の多層配線基板においては、通常
、その内層材（１）としては２両面または片面金属張積
層板をエツチング等によって表面に回路（２）を形成し
たものを用いる。しかもこの内層材（１）としては、樹
１指含浸基材（３）との接着性を向上させるため酸や酸
化剤で表面粗化処理〈黒化処理）したものが好適に用い
られる。In the multilayer wiring board of the present invention such as No. 2, the inner layer material (1) is usually a two-sided or one-sided metal-clad laminate with a circuit (2) formed on the surface by etching or the like. Moreover, as this inner layer material (1), a material whose surface has been roughened (blackened) with an acid or an oxidizing agent is preferably used in order to improve the adhesion with the wood-impregnated base material (3).
樹脂含浸基材（３）としては、上記のようにガラスクロ
ス、紙等の基材にエポキシ樹脂、ポリイミド樹脂、不飽
和ポリエステル樹脂、フェノール樹脂等の樹脂ワニスを
乾燥後の樹脂量が約４０〜５０重量％程度となるように
含浸したものを複数枚、たとえば２〜３枚程度使用する
ことができる。As the resin-impregnated base material (3), as described above, a resin varnish of epoxy resin, polyimide resin, unsaturated polyester resin, phenol resin, etc. is applied to a base material such as glass cloth or paper, and the amount of resin after drying is about 40~ It is possible to use a plurality of sheets, for example, about 2 to 3 sheets, impregnated to a concentration of about 50% by weight.
また、この発明の配線基板の外層材としては、銅、アル
ミニウム等の金属箔や、片面金属張積層板の金ｍＩ！Ｉ
を最外層としたものを用いることができる。Further, as the outer layer material of the wiring board of the present invention, metal foils such as copper and aluminum, and gold mI! of single-sided metal-clad laminates can be used. I
can be used as the outermost layer.
積層成形は、従来公知の圧力、温度等において適宜に実
施することができる。Laminate molding can be carried out appropriately under conventionally known pressures, temperatures, and the like.
（作 用）
この発明の多層配線基板においては、内層材（１）と接
するＶＡ脂として未硬化樹脂１ｍ（５）を形成すること
により、硬化・架橋密度を抑え、ドリル等による穴あけ
加工時のｉ撃をこの未硬化樹脂層（５）が応力緩和し、
内層材（１）の回路（２）部と樹脂含浸基材（３）との
剥離、クラックの発生を防止する。これによりメツキ液
の侵入による回路（２）の侵食も抑制する。(Function) In the multilayer wiring board of the present invention, by forming 1 m (5) of uncured resin as VA resin in contact with the inner layer material (1), the curing/crosslinking density is suppressed, and the This uncured resin layer (5) relieves the stress of the impact,
Prevents peeling and cracking between the circuit (2) portion of the inner layer material (1) and the resin-impregnated base material (3). This also suppresses erosion of the circuit (2) due to penetration of the plating liquid.
次にこの発明の実施例を示し、さらに詳しくこの発明の
多層配線基板について説明する。らちろん、この発明は
、以下の実施例によって限定されるものではない。Next, examples of the present invention will be shown, and the multilayer wiring board of the present invention will be explained in more detail. Of course, this invention is not limited to the following examples.
（実施ρ１）
０．８＋ｖｆＩ７￥の両面ＭＩＪ ’Ｊガラスクロスエ
ポキシ積層板の両面をエツチングおよび黒化処理して内
層材とした。(Execution ρ1) Both sides of a double-sided MIJ 'J glass cloth epoxy laminate with a 0.8+vfI of 7 yen were etched and blackened to form an inner layer material.
この内層材の表面に、あらかじめ
エポキシ樹脂 １００（重量部）（エピコー
ト１００１ ニジエル化学）メチルオキシトール
１００
の配合からなる樹脂ワニスを５０ ｇ ／ ｒｄの割合
で塗布した。On the surface of this inner layer material, 100 (parts by weight) of epoxy resin (Epicote 1001 Nigel Chemical) methyloxytol was applied in advance.
A resin varnish consisting of a formulation of 100% was applied at a rate of 50g/rd.
これとは別に、次の配合
エポキシ樹脂 １００（重量部）（エピコー
ト１００１ ニジエル化学）ジシアンジアミド
４
ベンジルジメチルアミン ０．２
メチルオキシトール １００
からなる１！ｉ脂ワニスを厚み０．ｌＩＩ、樹脂付着厚
み５μｍのカラスクロス（樹脂量４５重量％）に含浸さ
せ、これと最外層として厚み３５μｍの胴箔を配し、こ
れらからなる積層体を成形圧力４０ｋｇ／−１１６５°
Ｃで１００分間加熱加圧して４層の多層配線基板を得た
。Separately, the following compounded epoxy resin 100 (parts by weight) (Epicote 1001 Nigel Chemical) dicyandiamide
1 consisting of 4 benzyldimethylamine 0.2 methyloxytol 100! i Apply fat varnish to a thickness of 0. lII, resin is impregnated with crow cloth (resin amount: 45% by weight) with a thickness of 5 μm, and a body foil with a thickness of 35 μm is arranged as the outermost layer, and a laminate consisting of these is molded under a molding pressure of 40 kg/-1165°.
C for 100 minutes to obtain a four-layer multilayer wiring board.
また、比較のために、内層材表面にあらかじめ樹脂ワニ
スを塗布しないほかは、上記と同様にして多層配線基板
を製造した。For comparison, a multilayer wiring board was manufactured in the same manner as above, except that the surface of the inner layer material was not coated with resin varnish in advance.
これらの多層配線基板について、ドリル穴あけ部のメツ
キ液の侵入の大きさと、塩酸による腐食を評価した。そ
の結果を示したものが表１である。These multilayer wiring boards were evaluated for the degree of penetration of plating liquid into the drilled portion and for corrosion caused by hydrochloric acid. Table 1 shows the results.
この表１から明らかなように、この発明の実施例の場合
には、メツキ液のしみ込みは少なく、かつ塩酸による回
路腐食は認められなかった。As is clear from Table 1, in the case of the examples of the present invention, there was little penetration of the plating solution, and no circuit corrosion due to hydrochloric acid was observed.
表 １
（発明の効果）
この発明の多層配線板においては、穴あけ加工時の内層
材と樹脂含浸基材との剥離や該基材のクランク発生は防
止され、メツキ液の浸入による回路侵食は著しく抑制さ
れる。信頼性の高い多層配線基板か実現される。Table 1 (Effects of the invention) In the multilayer wiring board of the present invention, peeling of the inner layer material and the resin-impregnated base material during drilling and occurrence of cranking of the base material are prevented, and circuit erosion due to penetration of plating liquid is significantly reduced. suppressed. A highly reliable multilayer wiring board will be realized.
第１図は、この発明の多層配線基板について示した要部
断面図である。
第２図は、従来の多層配線基板の例を示した部分断面図
である。
１・・・内層材 ２・・・回 路３・・・樹脂含
浸基材 ４・・・基 材５・・・未硬化ｔ！ＩＩ指層
代理人 弁理士 西 １ 利 火弟 １
図
第 ２ 図FIG. 1 is a sectional view of essential parts of a multilayer wiring board according to the present invention. FIG. 2 is a partial cross-sectional view showing an example of a conventional multilayer wiring board. 1...Inner layer material 2...Circuit 3...Resin-impregnated base material 4...Base material 5...Uncured t! II Top Agent Patent Attorney Nishi 1 Toshihiro 1
Figure 2
Claims (2)
層材を配設一体化してなる多層配線基板において、内層
材に接する樹脂層を未硬化樹脂層としてなることを特徴
とする多層配線基板。(1) A multilayer wiring board formed by disposing and integrating an outer layer material with a resin-impregnated base material interposed between the upper and lower surfaces of the inner layer material, characterized in that the resin layer in contact with the inner layer material is an uncured resin layer. Multilayer wiring board.
硬化樹脂層を配した請求項（１）記載の多層配線基板。(2) The multilayer wiring board according to claim (1), further comprising an uncured resin layer containing a curing agent or a crosslinking agent of 0 to 3%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9972688A JPH01270397A (en) | 1988-04-22 | 1988-04-22 | Multilayer interconnection board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9972688A JPH01270397A (en) | 1988-04-22 | 1988-04-22 | Multilayer interconnection board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01270397A true JPH01270397A (en) | 1989-10-27 |
Family
ID=14255074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9972688A Pending JPH01270397A (en) | 1988-04-22 | 1988-04-22 | Multilayer interconnection board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01270397A (en) |
-
1988
- 1988-04-22 JP JP9972688A patent/JPH01270397A/en active Pending
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