JPH01265587A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPH01265587A
JPH01265587A JP9418288A JP9418288A JPH01265587A JP H01265587 A JPH01265587 A JP H01265587A JP 9418288 A JP9418288 A JP 9418288A JP 9418288 A JP9418288 A JP 9418288A JP H01265587 A JPH01265587 A JP H01265587A
Authority
JP
Japan
Prior art keywords
land
solder
wiring board
printed wiring
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9418288A
Other languages
Japanese (ja)
Inventor
Toshihiko Komatsu
敏彦 小松
Shinichiro Takahashi
慎一郎 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP9418288A priority Critical patent/JPH01265587A/en
Publication of JPH01265587A publication Critical patent/JPH01265587A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To prevent the generation of a solder bridge, to eliminate a correction of the solder bridge, which is conducted as a posttreatment, and to reduce a manhour by a method wherein an extra land is provided in close proximity to the rear of each land. CONSTITUTION:A land 3 provided on each conductor part 2 is provided in close proximity to the direction rectangular to the flow direction of a flow solder. An extra land 5 provided in close proximity to the rear, which is located in the flow direction of the flow solder, of the land 3 can be provided at the rear of each land 3 or can be provided interposing a gap between the extra land and each land 3. Hereupon, the turbulance of a solder during a soldering work is pulled in the land 5 by the land and the turbulance of the solder is inhibited. Thereby, the generation of a solder bridge is prevented and a correction of the solder bridge, which is conducted as a post-treatment, is eliminated and a manhour is reduced.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は電子部品用プリント配線板等において、電子部
品実装時における半田付けによる半田ブリッジの発生を
防止したプリント配線板に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed wiring board for electronic components, which prevents the occurrence of solder bridges due to soldering during mounting of electronic components.

（従来の技術） 第２図はプリント配線板に電子部品を実装し、プリント
配線板の導体部に半田付けする一例の説明図である。(Prior Art) FIG. 2 is an explanatory diagram of an example of mounting electronic components on a printed wiring board and soldering them to conductor parts of the printed wiring board.

ＩＣのランド、トランジスタのランドのように、プリン
ト配線板基板（＋）のパターン面上に、フローソルダー
流し方向に対し直角方向に複数のランド（半田付は部）
が近接して設けられている場合、第２図のように（イ）
から（ロ）に流して半ｌｌ付けする時、それぞれのラン
ド（３）に実装された電子部品（６）の脚が半田を切り
さく形となって、半田の流れ（７′）が乱れ、それぞれ
のランド（３）に半｛月が必要以上に付若し、半田ブリ
ッジを発生してしまうことがある。Like IC lands and transistor lands, there are multiple lands (soldering parts) on the pattern surface of the printed wiring board (+) in a direction perpendicular to the direction of flow soldering.
If they are located close together, as shown in Figure 2 (a)
When half bonding is performed by flowing from (B) to (B), the legs of the electronic component (6) mounted on each land (3) cut the solder, disrupting the solder flow (7'). If a half-moon is applied to each land (3) more than necessary, a solder bridge may occur.

従来、このような半田ブリッジの発生を防ぐ１つの方法
として近接するランドの距離を極力離すとか、又他の方
法としてランドをカットすることにより、ランド間を離
す等してランド間に生じる半Ｉｌｌブリッノを防止して
いた。Conventionally, one way to prevent the occurrence of such solder bridges is to minimize the distance between adjacent lands, and another method is to cut the lands to separate them, thereby reducing the amount of solder bridges that occur between the lands. It was preventing brino.

（解決しようとする課題） 従来のランド間の距離を極力離す方法は、電子郎品個々
のリード脚間距離がきまっているため、ランドを離すに
も限度があって、半田の量によっては半田ブリッジが発
生した。(Problem to be solved) The conventional method of separating the lands as much as possible has a fixed distance between the lead legs of each electronic product, so there is a limit to how far the lands can be separated, and depending on the amount of solder, the solder bridge There has occurred.

又後者のランドをカプトする方法では、半田が付着して
も半田１の何首面積が小さいため、半田がはがれてしま
うという問題点があった。Furthermore, in the latter method of capping the lands, there is a problem that even if the solder adheres, the area of the solder 1 is small, so that the solder peels off.

（課題を解決するための手段） 本発明は上述の問題点を解消したプリント配線板を提供
するもので、その特徴は、プリント配線板のパターン面
上に、フローソルダー流し方向に対し直角方向に設けら
れた近接する複数のランドの少なくとも１つにこれに近
接して捨てランドを設けたことにある。(Means for Solving the Problem) The present invention provides a printed wiring board that solves the above-mentioned problems. A sacrificial land is provided adjacent to at least one of the plurality of adjacent lands provided.

第１図は本発明のプリント配線板の部分上面図である。FIG. 1 is a partial top view of the printed wiring board of the present invention.

図面において、（１）はプリント配線板基板、（２）は
導体部、（３）は各導体部（２）に設けられたランドで
、フローソルダー流し方向に対し直角方向に近接して設
けられている。（４）は電子部品実装穴、（５）は前記
ランド（３）のフローソルダー流し方向の後方に近接し
て設けた捨てランドで、それぞれのランド（３）の後方
に設けてもよく、間隙をおいて設けてもよい。又その位
置は、ランドの後方数■請程度のところに設ける。In the drawing, (1) is a printed wiring board board, (2) is a conductor part, and (3) is a land provided on each conductor part (2), which is provided close to each other in a direction perpendicular to the flowing direction of the flow solder. ing. (4) is an electronic component mounting hole, and (5) is a waste land provided close to the rear of the land (3) in the flow solder flowing direction. It may be provided at a later time. Also, it should be located a few feet behind the land.

（作用） 上述した本発明のプリント配線板によれば、ランドの後
方に近接して捨てランドを設けることにより、半田付は
作業中の半田のみだれをこの捨てランドが引き込み半田
の乱れを抑制する。その結果、ランドに付着する半田の
量が適当なものとなり、半田ブリッジが起こらなくなる
。(Function) According to the above-described printed wiring board of the present invention, by providing a waste land close to the rear of the land, the waste land draws in the solder scum during soldering, thereby suppressing the disorder of the solder. . As a result, an appropriate amount of solder adheres to the land, and solder bridging does not occur.

（発明の効果） 以上説明したように、本発明のプリント配線板によれば
、ランドの後方に近接して捨てランドを設けることによ
り、半田ブリッジを防ぐことができる。従ってプリント
配線板基板を多数フローンルダーに流すような場合、後
処理としての半田ブリツノの修正がなくなり、工数削減
となり極めて効果的である。(Effects of the Invention) As described above, according to the printed wiring board of the present invention, solder bridging can be prevented by providing a waste land close to the rear of the land. Therefore, when a large number of printed wiring board substrates are to be sent to the float roller, there is no need to correct solder blemishes as a post-processing process, which is extremely effective in reducing the number of man-hours.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明のプリント配線板の具体例の部分上面図
である。 第２図（イ）及び（ロ）はプリント配線基板への電子部
品の実装、半田付けの一例の説明図である。 ■・・・プリント配線基板、２・・・導体部、３・・・
ランド、４・・・電子部品実装穴、５・・・捨てランド
、６・・・電子部品。 茅　１　図FIG. 1 is a partial top view of a specific example of the printed wiring board of the present invention. FIGS. 2(A) and 2(B) are explanatory diagrams of an example of mounting and soldering of electronic components on a printed wiring board. ■...Printed wiring board, 2...Conductor part, 3...
Land, 4...Electronic component mounting hole, 5...Discarded land, 6...Electronic component. Kaya 1 figure

Claims (2)

【特許請求の範囲】[Claims] （１）プリント配線板のパターン面上に、フローソルダ
ー流し方向に対し直角方向に設けられた近接する複数の
ランドの少なくとも１つにこれに近接して捨てランドを
設けたことを特徴とするプリント配線板。(1) A print characterized in that a waste land is provided adjacent to at least one of a plurality of adjacent lands provided on the pattern surface of the printed wiring board in a direction perpendicular to the flowing direction of the flow solder. wiring board. （２）捨てランドがランドのフローソルダ流し方向の後
方に設けられていることを特徴とする請求項（１）記載
のプリント配線板。(2) The printed wiring board according to claim (1), wherein the waste land is provided at the rear of the land in the direction in which the flow solder flows.
JP9418288A 1988-04-15 1988-04-15 Printed wiring board Pending JPH01265587A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9418288A JPH01265587A (en) 1988-04-15 1988-04-15 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9418288A JPH01265587A (en) 1988-04-15 1988-04-15 Printed wiring board

Publications (1)

Publication Number Publication Date
JPH01265587A true JPH01265587A (en) 1989-10-23

Family

ID=14103181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9418288A Pending JPH01265587A (en) 1988-04-15 1988-04-15 Printed wiring board

Country Status (1)

Country Link
JP (1) JPH01265587A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827965B2 (en) * 1979-05-17 1983-06-13 東京都 Sediment basin machinery and equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827965B2 (en) * 1979-05-17 1983-06-13 東京都 Sediment basin machinery and equipment

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