JPH01263238A - High strength and high electric conductive copper alloy - Google Patents
High strength and high electric conductive copper alloyInfo
- Publication number
- JPH01263238A JPH01263238A JP8826688A JP8826688A JPH01263238A JP H01263238 A JPH01263238 A JP H01263238A JP 8826688 A JP8826688 A JP 8826688A JP 8826688 A JP8826688 A JP 8826688A JP H01263238 A JPH01263238 A JP H01263238A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- strength
- copper alloy
- conductivity
- conductive copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract description 5
- 229910052742 iron Inorganic materials 0.000 claims abstract description 9
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 9
- 229910052718 tin Inorganic materials 0.000 claims abstract description 9
- 229910052723 transition metal Inorganic materials 0.000 claims abstract description 4
- 150000003624 transition metals Chemical class 0.000 claims abstract description 4
- 239000012535 impurity Substances 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 7
- 229910052749 magnesium Inorganic materials 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 27
- 239000000956 alloy Substances 0.000 description 27
- 239000011777 magnesium Substances 0.000 description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 239000011135 tin Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 238000009864 tensile test Methods 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は半導体機器のリードフレームなどに使われる高
強度高導電性合金に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a high-strength, high-conductivity alloy used for lead frames of semiconductor devices.
（従来の技術）
従来、半導体機器のリードフレーム材として４２合金（
Ｆｅ−４２％Ｎｉ合金：以下垂量％を単に％と記す）な
どの鉄系合金や、錫入り銅、ＣＤＡ １９４ （ＣＩＪ
−２、４％Ｆｅ−０，１２％Ｚｎ−Ｐ合金）、りん青
銅等の銅合金か使用されている。近年、半導体集積回路
の高集積化や小型化、更には、低価格化の要求から高強
度高導電性で、且つ安価であるリードフレーム用の合金
か求められている。しかし、上述のような現用リードフ
レーム用合金は、例えは、錫入り別や、ＣＤＡｌ９４の
ように導電性の高いものは強度が低く、４２合金やりん
青銅のように強度の高いものは導電性か低く、且つ価格
も高いといったように、高強度高導電性・低価格という
条件を完全に満たしているものはない。(Prior art) Conventionally, 42 alloy (
Iron-based alloys such as Fe-42%Ni alloy (hereinafter referred to as %), tinned copper, CDA 194 (CIJ
Copper alloys such as -2.4% Fe-0.12% Zn-P alloy) and phosphor bronze are used. In recent years, in response to demands for higher integration and smaller size of semiconductor integrated circuits, as well as lower prices, there has been a demand for alloys for lead frames that are high in strength, highly conductive, and inexpensive. However, among the alloys currently used for lead frames as mentioned above, those with high conductivity such as tin-containing and CDAl94 have low strength, and those with high strength such as 42 alloy and phosphor bronze have low conductivity. There is no material that completely satisfies the requirements of high strength, high conductivity, and low price, such as low conductivity and high price.
（発明か解決しようとしている課題）
本発明の目的は、かかる点に鑑み、半導体機器のリード
フレーム等に好適な高強度高導電性且つ低価格な合金を
提供することにある。(Problems to be Solved by the Invention) In view of the above, an object of the present invention is to provide a high-strength, high-conductivity, and low-cost alloy suitable for lead frames of semiconductor devices and the like.
（課題を解決するための手段）
本発明者等は、上記目的を達成するために種々検討を加
えた結果、本発明に到達した。ずなわち、本発明の高強
度高導電性合金は、Ｍｇ：０．０５〜０．３％と、Ｐｒ
ｏ、０５〜０．２％と、Ｓｎ：０．０５〜０．５％とを
含み、更にＣｏ、Ｆｅ。(Means for Solving the Problems) The present inventors have made various studies to achieve the above object, and as a result, have arrived at the present invention. That is, the high-strength, high-conductivity alloy of the present invention contains 0.05 to 0.3% Mg and Pr.
o, 05 to 0.2%, and Sn: 0.05 to 0.5%, and further includes Co and Fe.
Ｎｉからなる鮮から選ばれた１種以上の遷移金属を合計
で０．０１〜０．３％含み、残部がＣｕ及び不可避的不
純物からなり、且つＭｇ／Ｐ重量比が１．１８を超える
ことを特徴とするものである。Contains a total of 0.01 to 0.3% of one or more transition metals selected from the group consisting of Ni, with the remainder consisting of Cu and unavoidable impurities, and the Mg/P weight ratio exceeds 1.18. It is characterized by:
（作用）
次に本発明合金を構成する合金成分の添加理由と、その
組成範囲の限定理由を説明する。(Function) Next, the reason for adding the alloy components constituting the alloy of the present invention and the reason for limiting the composition range will be explained.
（１）Ｍｇの含有量を０．０５〜０，３％と限定した理
由。(1) Reason for limiting the Mg content to 0.05-0.3%.
ＭｇはＰとともにＭ ｇ ｓ Ｐ ２という化合物析出
物を形成することによって、合金の強度・耐熱性を向上
させるが、Ｍｇ含有量０．０５％未満では析出する化合
物の量が不十分で、期待する強度・耐熱性が得られず、
逆にＭｇ含有量か０．３％を超えると強度が飽和し、且
つ粗大な第２相が出現して、メツキ性、はんだ付は性が
低下する。Mg improves the strength and heat resistance of the alloy by forming compound precipitates called M g s P 2 together with P, but if the Mg content is less than 0.05%, the amount of precipitated compounds is insufficient and the expected results are not met. strength and heat resistance cannot be obtained,
On the other hand, if the Mg content exceeds 0.3%, the strength will be saturated and a coarse second phase will appear, resulting in poor plating and soldering properties.
（２）Ｐの含有量を０．０５〜０．２％とした理由。(2) Reason for setting the P content to 0.05 to 0.2%.
Ｐ含有量か０．０５％未満ではＰ含有による特性の向上
か得られず、逆にＰ含有量か０．２％を超えると、熱間
加工性が低下し、且つ粗大な第２相か出現して、メｙ’
ｆ性・はんた付は性が低下する。If the P content is less than 0.05%, no improvement in properties can be obtained due to the P content, and conversely, if the P content exceeds 0.2%, hot workability decreases and a coarse second phase is formed. Appear, May'
The f-ability and soldering quality decreases.
（３）Ｓｎの含有量を０．０５〜０．５％とした理由。(3) Reason for setting the Sn content to 0.05 to 0.5%.
Ｓｎは固溶型の元素で合金に固溶させることによって、
合金の導電性をあまり下げずに強度を上昇させることが
できるか、Ｓｎ含有量が０．０５％未満では期待する強
度が得られず、逆に０．５％を超えると導電率の低下が
大きくなる。Sn is a solid solution type element, and by making it a solid solution in the alloy,
Is it possible to increase the strength without significantly reducing the conductivity of the alloy? If the Sn content is less than 0.05%, the expected strength will not be obtained, and if it exceeds 0.5%, the conductivity will decrease. growing.
（４）Ｃｏ、Ｆｅ、Ｎｉの量を合計で０．０１〜０．３
％とした理由。(4) The total amount of Co, Fe, and Ni is 0.01 to 0.3
Reason for %.
Ｃｏ、Ｆｅ、Ｎｉを添加すると１合金の導電率をあまり
下げずに強度と耐熱性を向上できるが、総合有量が０．
０１％未満では強度・耐熱性の向上か不十分であり、逆
に０．３％を超えると導電率の低下が大きくなる。Adding Co, Fe, and Ni can improve the strength and heat resistance of the alloy without significantly lowering its electrical conductivity, but the total content is 0.
If it is less than 0.01%, the strength and heat resistance will be insufficiently improved, and if it exceeds 0.3%, the electrical conductivity will decrease significantly.
（５）Ｍｇ／Ｐ重量比を１．．１８より大きくした理由
。(5) Mg/P weight ratio is 1. ．． Reason for making it larger than 18.
先に述べたＭ ｇ ３Ｐ ２化合物析出物を形成するＭ
ｇとＰの重量比か１．１．８：１であり、この比率に対
し濾過剰側で、すなわちＭｇ／Ｐ重量比が１．１８より
も小さくなりすぎるようにＭｇとＰを添加すると、化合
物形成にあずからない過剰のＰか合金中に固溶し、大き
な導電率低下をもたらす。M forming the M g 3P 2 compound precipitate mentioned above
The weight ratio of g to P is 1.1.8:1, and if Mg and P are added on the excessive filtration side of this ratio, that is, so that the Mg / P weight ratio becomes too small than 1.18, Excess P that does not participate in compound formation becomes a solid solution in the alloy, resulting in a large decrease in electrical conductivity.
（実施例）
通常のピース状電気別を高周波溶解炉で大気溶解し、目
的値に応じたマグネシウム、りん、錫、コバルト、鉄、
ニッケルをそれぞれ租との中間合金（マグネシウム５０
％、りん１５％、コバル１−１０％、ニッケル３０％）
及び純金属片（錫、鉄）の形で加えた後、鋳鉄製の合わ
せ鋳型に通常の鋳造法で鋳込んで鋳塊（厚さ３５ｍｍ、
幅８０ｍｍ、長さ１６０ｍｍ、ｆｆｉさ４．Ｏｋｇ）を
得た。試料の組成は第１表の通りであった。尚、同様に
して得た比較合金の鋳塊試料の組成も第１表に示す。(Example) Ordinary piece-shaped metal parts are melted in the atmosphere in a high-frequency melting furnace to produce magnesium, phosphorus, tin, cobalt, iron, etc. according to the target values.
Intermediate alloy with nickel (magnesium 50
%, phosphorus 15%, cobal 1-10%, nickel 30%)
and pure metal pieces (tin, iron), and then cast into a cast iron mold using the usual casting method to form an ingot (thickness: 35 mm,
Width 80mm, length 160mm, ffi size 4. Okg) was obtained. The composition of the sample was as shown in Table 1. Table 1 also shows the composition of a comparative alloy ingot sample obtained in the same manner.
これらの鋳埋を８５０℃で加熱後、熱間圧延により１５
ｍｍ厚の板とした。After heating these castings at 850℃, hot rolling
It was made into a plate with a thickness of mm.
第１表
次にこの板を片面１ｍｍずつ固剤し１３ｍｍ７ｇとした
後、冷間圧延と中間焼鈍を繰り返し行い、最終圧下率６
０％で０．２５ｍｍ厚さの板を得な。Table 1 Next, this plate was solidified by 1 mm on each side to a thickness of 13 mm and 7 g, and then cold rolling and intermediate annealing were repeated, and the final rolling reduction was 6.
Obtain a plate with a thickness of 0.25 mm at 0%.
この板を２７０°Ｃ１時間で歪取焼鈍し、試料とした。This plate was strain-relief annealed at 270°C for 1 hour and used as a sample.
この様にして作製した試料の評価として、強度を引張り
試験によって求めた。 導電性は導電率（％１．Ａ、Ｃ
，Ｓ、）によって示した。As an evaluation of the sample prepared in this way, the strength was determined by a tensile test. Electrical conductivity is electrical conductivity (%1.A, C
,S,).
加工性は引張り試験における破断伸びによって評価した
。Processability was evaluated by elongation at break in a tensile test.
耐熱性は試料をアルゴン雰囲気中１時間加熱した後、引
張り試験を行い強度の低下が２０％を示す温度を軟化点
として評価した。Heat resistance was evaluated by heating the sample in an argon atmosphere for 1 hour, then performing a tensile test, and evaluating the temperature at which the strength decreased by 20% as the softening point.
はんだ付は性は、前処理として脱脂及び酸洗を行った後
、ロジン系フラックスを用い５ｎ−４０％ｐｂはんだ浴
に浸漬した試料について、その表面か均一に濡れている
かどうかを観察することにより評価した。Solderability was determined by degreasing and pickling as pretreatment, then immersing the sample in a 5N-40% PB solder bath using rosin flux, and observing whether the surface was uniformly wet. evaluated.
メツキの密着性は、はんだ付は試験と同様の前処理を行
った後、３μｍのＡｇメツキを施した試料について、４
５０°Ｃ５分間の加熱を行い、ふくれの有無をｆｌ！察
することにより評価した。The adhesion of the plating was measured using a sample with a 3 μm Ag plating after the same pretreatment as in the test for soldering.
Heat at 50°C for 5 minutes and check for blisters! The evaluation was made by observing the results.
これらの結果を同様な工程で作成し、評価した比較合金
と共に第２表に示した。更に、従来材として、錫入り％
］ （Ｃｕ−０，１５％５ｎ−Ｐ）、ＣＤＡ１９４
（Ｃｕ−０，２４％Ｆｅ−０、１２％Ｚｎ、−Ｐ）、り
ん１？銅２種（Ｃｕ−６％５ｎ−Ｐ）、４２合金（Ｆｅ
−４２％Ｎｉ）を同様に評価し、第２表に示した。These results are shown in Table 2 together with comparative alloys prepared and evaluated using the same process. Furthermore, as a conventional material, tin content%
] (Cu-0,15%5n-P), CDA194
(Cu-0, 24%Fe-0, 12%Zn, -P), phosphorus 1? Copper type 2 (Cu-6%5n-P), 42 alloy (Fe
-42%Ni) was similarly evaluated and shown in Table 2.
（この頁以下余白）
（注）１）従来材 Ｎｏ、１７ 錫入り１（Ｃｕ−
０，１５Ｓｎ−Ｐ）Ｎｏｉ８ ＣＤＡ１９４（Ｃｕ−
０，２４Ｆｅ−０，１２２ｎ−Ｐ）Ｎ０１９ りん青
＠２種（Ｃｕ−６Ｓｎ−Ｐ）ＮＯ，２０４２Ａ Ｉ Ｉ
ｏ ｙ（Ｆｅ−４２Ｎｉ）２）はんだ付は性について
は、はんだか浸漬面全面に均一に濡れている場合をＯｌ
それ以外を×とした。(Margins below this page) (Note) 1) Conventional material No. 17 Tin-filled 1 (Cu-
0,15Sn-P) Noi8 CDA194(Cu-
0,24Fe-0,122n-P) N019 Phosphorus blue @ type 2 (Cu-6Sn-P) NO, 2042A I I
o y (Fe-42Ni) 2) Regarding soldering properties, it is considered that the entire dipped surface is uniformly wet with solder.
Others were marked as ×.
３）メツキ密着性については、加熱後ふくれか観察され
なかった場合○、それ以外を×とした。3) Regarding plating adhesion, if no blistering was observed after heating, it was rated as ○, otherwise it was rated as ×.
第２表に示すごとく本発明合金は比較合金や従来合金よ
りも優れていた。すなわち、例えば、比較合金Ｎｏ、
９〜１１に示すごとく、本発明の範囲に対し各元素の量
が不十分なものは強度もしくは耐熱性か低く、比較合金
Ｎｏ、 １２〜１５に示すごとく、各元素の量が過剰な
ものは、はんだ付は性、メツキ性もしくは導電性が低く
、比較合金Ｎｏ、１６に示すごと＜Ｍｇ／Ｐ重量比か１
未満のものは導電率が低いといったように比較合金の特
性は不十分であった。これに対し、本発明に係る合金か
優れた強度、導電率、耐熱性だけでなく、良好なはんだ
付は性、メツキ性、加工性をも示すことが明らかである
。As shown in Table 2, the alloy of the present invention was superior to the comparative and conventional alloys. That is, for example, comparative alloy No.
As shown in Nos. 9 to 11, those in which the amount of each element is insufficient relative to the scope of the present invention have low strength or heat resistance, and those in which the amount of each element is in excess as shown in Comparative Alloy Nos. and 12 to 15 are poor in strength or heat resistance. , soldering properties, plating properties, or conductivity are low, as shown in Comparative Alloy No. 16 <Mg/P weight ratio or 1
Comparative alloys with less than 10% had insufficient electrical conductivity. On the other hand, it is clear that the alloy according to the invention not only exhibits excellent strength, electrical conductivity, and heat resistance, but also exhibits good soldering properties, plating properties, and processability.
（発明の効果）
以上から明らかな様に本発明によれは、半導体機器のリ
ードフレーム等に好適な合金を提供することが可能であ
り、本発明の工業的価値は大である。(Effects of the Invention) As is clear from the above, according to the present invention, it is possible to provide an alloy suitable for lead frames of semiconductor devices, etc., and the industrial value of the present invention is great.
Claims (1)
重量％、Ｓｎ：０．０５〜０．５重量％、を含み、さら
にＣｏ、Ｆｅ、Ｎｉからなる群から選ばれた１種以上の
遷移金属を合計で０．０１〜０．３重量％含み、残部が
Ｃｕ及び不可避的不純物からなり、且つＭｇ／Ｐ重量比
が１．１８を超えることを特徴とする高強度高導電性合
金。Mg: 0.05-0.3% by weight, P: 0.05-0.2
wt%, Sn: 0.05 to 0.5 wt%, and further contains a total of 0.01 to 0.3 wt% of one or more transition metals selected from the group consisting of Co, Fe, and Ni. , the balance being Cu and unavoidable impurities, and having an Mg/P weight ratio of more than 1.18.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8826688A JPH01263238A (en) | 1988-04-12 | 1988-04-12 | High strength and high electric conductive copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8826688A JPH01263238A (en) | 1988-04-12 | 1988-04-12 | High strength and high electric conductive copper alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01263238A true JPH01263238A (en) | 1989-10-19 |
Family
ID=13938088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8826688A Pending JPH01263238A (en) | 1988-04-12 | 1988-04-12 | High strength and high electric conductive copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01263238A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1063309A2 (en) * | 1999-06-07 | 2000-12-27 | Waterbury Rolling Mills, Inc. | Copper alloy |
| EP1482063A1 (en) * | 2003-05-27 | 2004-12-01 | Fisk Alloy Wire, Inc. | Processing copper-magnesium alloys and improved copper alloy wire |
| JP2006265593A (en) * | 2005-03-23 | 2006-10-05 | Dowa Mining Co Ltd | Copper alloy material and production method therefor |
-
1988
- 1988-04-12 JP JP8826688A patent/JPH01263238A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1063309A2 (en) * | 1999-06-07 | 2000-12-27 | Waterbury Rolling Mills, Inc. | Copper alloy |
| US6241831B1 (en) * | 1999-06-07 | 2001-06-05 | Waterbury Rolling Mills, Inc. | Copper alloy |
| EP1063309A3 (en) * | 1999-06-07 | 2002-09-18 | Waterbury Rolling Mills, Inc. | Copper alloy |
| US6689232B2 (en) | 1999-06-07 | 2004-02-10 | Waterbury Rolling Mills Inc | Copper alloy |
| EP1482063A1 (en) * | 2003-05-27 | 2004-12-01 | Fisk Alloy Wire, Inc. | Processing copper-magnesium alloys and improved copper alloy wire |
| JP2006265593A (en) * | 2005-03-23 | 2006-10-05 | Dowa Mining Co Ltd | Copper alloy material and production method therefor |
| JP4692727B2 (en) * | 2005-03-23 | 2011-06-01 | Ｄｏｗａメタルテック株式会社 | Copper alloy material |
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