JPH0126058Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an airtight terminal base for an electronic device element such as an IC board.

When making terminal connections by stacking electronic device elements on a solid-type metal base, the powdered sintered glass sealed together with the lead wires in the holes of the solid-type metal base creeps up onto the lead wires, and the creeping up portion, that is, the wetting, becomes a part of the solid-type metal base. It may be higher than face. For this reason, it is no longer possible to place electronic device elements closely on the metal-based face, and a gap is created between the solid-type metal-based face and the electronic device element, making quality control of the airtight terminal base difficult. .

The purpose of this invention is to prevent the glass from creeping up along the lead wire when sealing the lead wire into the hole of the solid type metal base with glass, and to keep the glass surface at least at a position lower than the height of the face of the solid type metal base. When holding an IC board, etc. on the face of a solid type metal base and grounding the electronic device element using a lead wire, the IC board, etc. can be connected closely to the surface of the airtight terminal base, and the volume is small. The purpose is to provide a stable and airtight terminal base.

Other objects, configurations, functions, effects, etc. of the present invention will be explained with reference to drawings of embodiments. 1 is a metal base, 2 is a glass filling hole made in the solid type metal base 1, 3 is a powdered sintered glass sealed in the glass filling hole 2, and 4 is a round, square, or rectangular cross section sealed in the powdered sintered glass. 6 is a flange formed on the outer periphery of the intermediate portion of the lead wire 4. As shown in Fig. 1, the upper surface of the flange 6 is placed at a position H lower than the face 5 on the inner side of the solid type metal base 1, and the powdered sintered glass 3 is melted in a furnace to fill the glass sealing hole. 2, and the lower edge of the collar 6 prevents it from creeping up along the lead wire 4. Therefore, the glass 3 is not exposed above the face 5. 7 is face 5
The upper connecting part 4a of the lead wire penetrates the hole 8 of the electronic device element 7 and protrudes to the surface side of the IC board, and the part is connected to the electronic device element 7.
Solder the terminals.

FIG. 2 shows another embodiment of the present invention, in which a narrowed edge 9 is formed inside the glass sealing hole 2 on the inner face 5 side of the solid type metal base 1.
A lead wire 4 below the narrowed edge 9 is provided.
The lower part of the collar 6 is filled with powdered sintered glass 3.

As mentioned above, the present invention is based on the fact that the flange provided at the middle of the lead wire in the glass sealing hole of the solid type metal base is positioned slightly lower than the face of the solid type metal base, and the lead wire is sealed with powdered sintered glass. When the powdered sintered glass is melted, it is possible to prevent the molten glass from creeping upward from the flange, and it is possible to connect lead wires to the solid type metal base face with electronic device elements closely attached. Therefore, it is possible to provide airtight terminal bases of uniform quality. In addition, by providing a narrowing edge on the face side of the glass filling hole of the solid type metal base, it is possible to further ensure that the glass in the glass filling hole is prevented from creeping up.

[Brief explanation of the drawing]

The drawings show an embodiment of the invention. FIG. 1 is a longitudinal side view, and FIG. 2 is a longitudinal side view of another embodiment. DESCRIPTION OF SYMBOLS 1...Solid type metal base, 2...Glass sealing hole, 3...Powder sintered glass, 4...Lead wire, 4a...Top end connection portion of lead wire, 5...Face of solid type metal base, 6... Tsuba of lead wire, 7...Electronic device element, 9...Narrowed edge of metal base.

Claims (1)

[Scope of utility model registration request] In the airtight terminal base of an electronic device element, in which a lead wire 4 is sealed with powdered sintered glass 3 into a glass sealing hole 2 made in a solid type metal base 1, H is inserted from the face 5 side of the solid type metal base 1.
A collar 6 provided in the middle of the lead wire 4 at a lower position.
is positioned to prevent the powdered sintered glass 3 from creeping up above the flange 6, and a narrowing edge 9 protruding inside the glass sealing hole 2 is provided to prevent the lead wire 4 below the narrowing edge 9. Powder sintered glass 3 below the tsuba 6
and the connection part 4a above the collar 6.
This structure is an airtight terminal base for an electronic device element, in which an electronic device element 7 is made to protrude above the face 5 of the solid type metal base 1, and an electronic device element 7 is attached to the face 5 of the solid type metal base 1.