JPH01259195A - Tin coated copper or copper alloy material - Google Patents
Tin coated copper or copper alloy materialInfo
- Publication number
- JPH01259195A JPH01259195A JP8564688A JP8564688A JPH01259195A JP H01259195 A JPH01259195 A JP H01259195A JP 8564688 A JP8564688 A JP 8564688A JP 8564688 A JP8564688 A JP 8564688A JP H01259195 A JPH01259195 A JP H01259195A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- coating layer
- zinc
- alloy
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010949 copper Substances 0.000 title claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 35
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract description 29
- 239000000956 alloy Substances 0.000 title abstract description 7
- 239000011247 coating layer Substances 0.000 claims abstract description 37
- 239000011701 zinc Substances 0.000 claims abstract description 26
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 23
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910001297 Zn alloy Inorganic materials 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 239000011248 coating agent Substances 0.000 abstract description 6
- 229910018082 Cu3Sn Inorganic materials 0.000 abstract description 4
- 229910017518 Cu Zn Inorganic materials 0.000 abstract description 3
- 229910017752 Cu-Zn Inorganic materials 0.000 abstract description 3
- 229910017943 Cu—Zn Inorganic materials 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical group [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 abstract description 3
- 230000002195 synergetic effect Effects 0.000 abstract description 2
- 238000007747 plating Methods 0.000 description 27
- 238000000034 method Methods 0.000 description 17
- 239000000523 sample Substances 0.000 description 9
- 238000012545 processing Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005238 degreasing Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910020521 Co—Zn Inorganic materials 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- -1 brass Chemical compound 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、端子・コネクタ等の電子部品に使用される耐
ウィスカ性に優れた銅または銅合金の銅被覆材料に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a copper-coated material of copper or copper alloy having excellent whisker resistance and used for electronic components such as terminals and connectors.
［従来の技術］
端子・コネクタ等の電子部品ては、多くの場合、銅合金
材料の表面に被覆した錫または錫合金めっきにより、耐
食性を付与して表面を保護し、良好なはんだ付性を維持
している。[Prior Art] In many cases, electronic components such as terminals and connectors are coated with tin or tin alloy plating on the surface of a copper alloy material to provide corrosion resistance, protect the surface, and ensure good solderability. Maintained.
しかし、このような銅合金材料の錫または錫合金被覆の
表面には、ウィスカと呼ばれる錫単結晶からなる針状結
晶か発生ずることか知られている。このウィスカは、通
常太さ１〜５μｍで、長さは最大数ｍｍに達することも
ある。また、このウィスカは、特に光沢剤を添加した光
沢錫めっきに発生し易い。However, it is known that needle-shaped crystals made of tin single crystals called whiskers occur on the surface of tin or tin alloy coatings of such copper alloy materials. This whisker usually has a thickness of 1 to 5 μm, and can reach a maximum length of several mm. Further, whiskers are particularly likely to occur in bright tin plating to which a brightening agent has been added.
このような銅合金を電子部品に用いた場合、ウィスカの
発生によって、回路中の端子間での短絡、絶縁不良、あ
るいはノイズの発生等の問題か生していた。特に近年、
電子部品が小型化、高密度化されるに従い、ウィスカの
発生による短絡障害が大きな問題となってきた。When such copper alloys are used in electronic components, the generation of whiskers causes problems such as short circuits between terminals in a circuit, poor insulation, and noise generation. Especially in recent years,
As electronic components become smaller and more dense, short-circuit failures due to the generation of whiskers have become a major problem.
ウィスカ発生の原因は下記の通りである。The causes of whisker generation are as follows.
（１）ウィスカの発生し易い亜鉛やカドミウムめっきと
同様に錫か低融点金属であり、比較的低温（２００〜１
００℃）で原子が穆動して再結晶し易い。(1) Similar to zinc and cadmium plating, which tend to generate whiskers, it is made of tin or a low melting point metal, and has a relatively low temperature (200 to 1
(00°C), atoms move and recrystallize easily.
（２）光沢剤を添加した光沢錫めっ剖は、光沢剤が共存
して内部応力が大きくなったり、あるいは、結晶粒子が
小さいのでめっき皮膜中の格子欠陥密度が極めて高いた
め内部歪みエネルギーか大きく、かつ、結晶粒界が多く
て錫原子の短回路拡散の通路が多い。(2) Bright tin plating with a brightener added may cause internal stress to increase due to the coexistence of the brightener, or internal strain energy due to extremely high lattice defect density in the plating film due to the small crystal grains. It is large and has many grain boundaries, so there are many short-circuit diffusion paths for tin atoms.
（３）錫めっき時に吸蔵された高圧の水素により、錫が
めっき材の弱点部、すなわち、微細粒状の不純物等を含
有した部分に発生し易い。(3) Due to the high-pressure hydrogen occluded during tin plating, tin is likely to be generated in weak points of the plating material, that is, in areas containing fine granular impurities.
以上がウィスカ発生の原因として考えられるが、完全に
原因を究明したとはいえないのが実状である。Although the above is thought to be the cause of whisker generation, the reality is that the cause has not been completely investigated.
一方、銀核Ｎ層のウィスカの発生を防止する方法として
、従来より下記の方法が提案されている。On the other hand, as a method for preventing the generation of whiskers in the silver nucleus N layer, the following method has been conventionally proposed.
■錫めっき後、１５０〜１８０℃の温度において１〜３
時間過熱処理する方法。■After tin plating, 1 to 3 at a temperature of 150 to 180℃
How to overheat for a time.
■錫めっき後、真空中で電子線を照射する方法（特公昭
５５−３１１９６号公報）。(2) A method of irradiating electron beams in a vacuum after tin plating (Japanese Patent Publication No. 31196/1983).
■錫めっき後、陽極酸化皮膜を形成する方法（特開昭５
２−５３７３４号公報）。■Method of forming an anodic oxide film after tin plating (Unexamined Japanese Patent Publication No. 5
2-53734).
■錫と鉛やニッケル、銅、亜鉛を共析、すなわち、合金
めフきをする方法。■A method of eutectoiding tin with lead, nickel, copper, and zinc, that is, forming an alloy.
■超音波エネルギーを与えてめっき時の水素吸蔵を軽減
する方法。■A method to reduce hydrogen absorption during plating by applying ultrasonic energy.
［発明が解決しようとする課題］
しかしながら、以上のウィスカ発生防止方法は、長尺の
線、条を連続的に処理する場合には種々の課題を有して
いる。[Problems to be Solved by the Invention] However, the above whisker generation prevention method has various problems when long lines and stripes are continuously processed.
■の方法は、加熱処理に長時間を有するため、連続処理
が困難であり、かつ、光沢剤を添加した光沢めっきでは
変色、火ぶくれ、亀裂等のめつき欠陥が生しる恐れがあ
る。Method (2) involves heat treatment for a long time, making it difficult to perform continuous processing, and bright plating with brighteners added may cause plating defects such as discoloration, blisters, and cracks. .
■の方法は、真空中に保持しなければならないために、
連結処理に不向きであり、また、照射装置や真空処理装
置が高価で処理コストが高くなる。In method ①, since it must be kept in a vacuum,
It is not suitable for connection processing, and the irradiation equipment and vacuum processing equipment are expensive, resulting in high processing costs.
■の方法は、連続処理に適するが、ブリ錫めっきのよう
にめっき後に加工を行うことは加工時に酸化皮膜が破壊
される恐れがある。Method (2) is suitable for continuous processing, but if processing is performed after plating, such as in tin plating, the oxide film may be destroyed during processing.
■の方法は、めっき浴の品質管理が困難であり、また、
めっきの耐食性、はんだ付は性および電気特性等のめっ
き性能面に疑問があり、また成型加工時に発生するスク
ラップの再利用がしにくい。Method ① is difficult to control the quality of the plating bath, and
There are doubts about the performance of the plating, such as corrosion resistance, soldering properties, and electrical properties, and it is difficult to reuse scraps generated during molding.
■の方法は、ウィスカの発生、成長がめつき時の水素吸
蔵によってのみに支配されるのであれば効果は期待でき
るが、少なくともウィスカの成長については、添加剤、
めっき浴、めっき条件等の他の要因が多く関与している
と考えられるので万全ではない。Method (2) can be expected to be effective if the generation and growth of whiskers is controlled only by hydrogen absorption during plating, but at least in terms of whisker growth, additives,
It is thought that many other factors such as the plating bath and plating conditions are involved, so it is not perfect.
一方、銅被覆層の下地として亜鉛または亜鉛合金めっき
等の被覆層を設ける方法については、例えば、特開昭６
０−１６９５８９号公報に、リン含有銅合金基材上に、
厚さ０．１μｍ以上の亜鉛または亜鉛合金中間層を介し
て錫または錫合金被覆層を設ける方法が提案されている
が、これははんたの耐熱剥離性の改善を目的としたもの
で、ウィスカの発生防止に関してはなんら考慮されてい
ない。一般に、錫のウィスカ成長に対する亜鉛は有害と
されており、例えは日本電子材料技術協会・接合技術委
員会の第１９同棲合委員会資料（１９７３年１月２５日
発行）に記載のように、亜鉛または黄銅上に直接錫めっ
ぎを施した場合にウィスカの成長は最も急速である。し
たがって、端子・コネクタ等の電子部品に亜鉛を含む銅
合金、例えば、黄銅等を使用する場合は必ず銅等の下地
めっきを施しているのが現状である。On the other hand, regarding the method of providing a coating layer such as zinc or zinc alloy plating as the base of the copper coating layer, for example, JP-A No. 6
0-169589, on a phosphorus-containing copper alloy base material,
A method has been proposed in which a tin or tin alloy coating layer is provided through a zinc or zinc alloy intermediate layer with a thickness of 0.1 μm or more, but this method is aimed at improving the heat-resistant peelability of solder. No consideration was given to preventing the generation of whiskers. In general, zinc is considered to be harmful to the growth of tin whiskers; Whisker growth is most rapid when tinning is applied directly onto zinc or brass. Therefore, when copper alloys containing zinc, such as brass, are used for electronic components such as terminals and connectors, the current situation is that they are always coated with a base plating of copper or the like.
本発明は、以上説明した従来技術の課題を解決して、耐
ウィスカ性に優れた銅および銅合金の銅被覆材料を提供
しようとするものである。The present invention aims to solve the above-described problems of the prior art and provide a copper-coated material of copper and copper alloys with excellent whisker resistance.
［課題を解決するための手段］
本発明は、銅または銅合金の表面に、亜鉛を０．１〜１
０％（重量％以下同じとする）含有する亜鉛合金被覆層
を０．１〜５．０μｍ設けた後、銅被覆層を設けること
を特徴とする耐ウィスカ性に優れた銅および銅合金の銅
被覆材料に要旨が存在する。[Means for Solving the Problems] The present invention provides zinc in the amount of 0.1 to 1 on the surface of copper or copper alloy.
Copper and copper alloy copper with excellent whisker resistance, characterized in that a copper coating layer is provided after a 0.1 to 5.0 μm thick zinc alloy coating layer containing 0% (the same below weight %) is provided. There is a gist in the coating material.
［作用］
本発明者等は、従来、錫のウィスカ成長に最も有害とさ
れていた亜鉛か、銅被覆層の中で非常に速く拡散して表
面に穆動すること、および表面に拡散した亜鉛が錫より
も優先酸化されて酸化皮膜を形成し易いことに着目し、
鋭意研究を重ねた結果、本発明を完成するに至ったので
ある。[Function] The present inventors discovered that zinc, which was conventionally considered to be the most harmful to the growth of tin whiskers, diffuses very quickly in the copper coating layer and moves to the surface, and that zinc diffused on the surface Focusing on the fact that tin is more preferentially oxidized than tin and forms an oxide film,
As a result of extensive research, the present invention was completed.
本発明は、まず銅または銅合金の表面に下地層として亜
鉛を０１〜１０％含有する亜鉛合金被覆層を、厚さ０１
〜５０μｍ形成する。In the present invention, first, a zinc alloy coating layer containing 01 to 10% zinc is applied as a base layer on the surface of copper or copper alloy to a thickness of 0.1 to 10%.
~50μm is formed.
この亜鉛合金被覆層の形成方法は、銅あるいは銅合金の
表面に常法による前処理［アルカリ脱脂−電解脱脂−酸
洗］を施した後、亜鉛合金被覆層を形成する。亜鉛合金
被覆層には、Ｃｕ−Ｚｎ。In this method of forming a zinc alloy coating layer, a zinc alloy coating layer is formed after subjecting the surface of copper or copper alloy to conventional pretreatment (alkaline degreasing, electrolytic degreasing, pickling). The zinc alloy coating layer includes Cu-Zn.
５ｎ−Ｚｎ、Ｎｉ−Ｚｎ、Ｎｉ−Ｃｏ−Ｚｎ。5n-Zn, Ni-Zn, Ni-Co-Zn.
Ｃｄ−Ｚｎ、およびＦｅ−Ｚｎ系合金か用いられ特に限
定するものではないか、Ｃｕ−Ｚｎか好適に用いられる
。また、被覆方法は、前記処理の後に、溶融めっぎ、電
気めっき、蒸着等の方法により被覆する。Cd--Zn and Fe--Zn alloys may be used, but there are no particular limitations, and Cu--Zn is preferably used. Further, as for the coating method, after the above-mentioned treatment, coating is performed by hot-dip plating, electroplating, vapor deposition, or the like.
なお、亜鉛合金被覆層の亜鉛含有量を０．１〜１０％と
したのは、亜鉛含有量か０１％未満ては被覆層の厚みを
厚くしても、ウィスカ発生の抑制効果が小さく本発明の
目的が達成てきないからであり、また、亜鉛含有量か１
０％を越えると被覆層の厚みを薄くしても、逆にウィス
カの成長か促進されたり、はんだ付が低下したりするか
らである。また、亜鉛合金被覆層の厚みを０１〜５０μ
ｍとしたのは、被覆層の厚みが０１μｍ未満では均一な
被覆層が形成されないために、ウィスカか発生の抑制効
果か小さくからであり、また、被覆層の厚みか５μｍを
越えても耐ウィスカ性を大幅に改善することはなく、厚
みを必要以上に厚くするとコストが高くなるからである
。Note that the reason why the zinc content of the zinc alloy coating layer is set to 0.1 to 10% is because if the zinc content is less than 0.1%, even if the thickness of the coating layer is increased, the effect of suppressing whisker generation will be small. This is because the purpose of
This is because if it exceeds 0%, even if the thickness of the coating layer is made thin, the growth of whiskers will be promoted or the soldering will be deteriorated. In addition, the thickness of the zinc alloy coating layer is 01 to 50 μm.
The reason for choosing m is that if the thickness of the coating layer is less than 0.1 μm, a uniform coating layer will not be formed and the effect of suppressing whisker generation will be small. This is because it does not significantly improve the properties and increases the cost if the thickness is increased more than necessary.
次に、本発明では上記亜鉛合金被覆層の表面に銅被覆層
を形成する。銅被覆層は、耐食性、はんたイ」性を良好
にするものである。この銅被覆層の形成は溶融めっき、
電気めっき、リフローめっき、蒸着等のいずれの方法に
よってもよい。なお、銅被覆層の厚さは、１０〜３０μ
ｍか好ましい。Next, in the present invention, a copper coating layer is formed on the surface of the zinc alloy coating layer. The copper coating layer improves corrosion resistance and solderability. This copper coating layer is formed by hot-dip plating,
Any method such as electroplating, reflow plating, or vapor deposition may be used. Note that the thickness of the copper coating layer is 10 to 30 μm.
m is preferable.
なお、本発明のウィスカ抑制効果は、現時点ては明確化
するに至ってないが、次のように考える。Although the whisker suppressing effect of the present invention has not been clarified at present, it is considered as follows.
錫を被覆した銅合金材料は、時間の経過と共に銀表面か
徐々に酸化されて表面エネルギーか低下し、内部応力の
高い銅被覆層の内部から錫原子かり 表面へ移動しよう
とする。また、銅原子も銅被覆に徐々に拡散し、Ｃｕ６
Ｓｎ５．Ｃｕ３Ｓｎ等の金属間化合物を形成する。こ
の２つの作用により銅被覆層の内部応力の上昇と錫原子
の表面への移動が促進され、銅被覆層の欠陥部や疵部分
あるいは表面の酸化物層の弱点部から錫原子が押出され
る。さらに、表面酸化および金属間化合物の成長に伴う
内部応力の継続的な上昇によりウィスカが成長する。As time passes, the silver surface of a copper alloy material coated with tin gradually oxidizes and its surface energy decreases, causing tin atoms to move from the interior of the copper coating layer, which has high internal stress, to the surface. In addition, copper atoms also gradually diffuse into the copper coating, and Cu6
Sn5. Forms an intermetallic compound such as Cu3Sn. These two effects increase the internal stress of the copper coating layer and promote the movement of tin atoms to the surface, pushing out tin atoms from defects and flaws in the copper coating layer or weak points in the surface oxide layer. . Furthermore, whiskers grow due to surface oxidation and a continuous increase in internal stress due to the growth of intermetallic compounds.
前述したように、１０％以上の亜鉛を含有する亜鉛合金
被覆を設けると、亜鉛原子の移動が極めて早く、かつ多
量に拡散して表面に厚い酸化物を形成する。この拡散に
よって銅被覆層の内部応力か上昇し、ウィスカの発生か
著しくなるものと考えられる。As described above, when a zinc alloy coating containing 10% or more of zinc is provided, zinc atoms move extremely quickly and diffuse in large quantities, forming a thick oxide on the surface. It is thought that this diffusion increases the internal stress of the copper coating layer, leading to the occurrence of whiskers.
しかしなから、１０％未満の亜鉛含有被覆層を設りた場
合は、亜鉛の拡散量は小さく、そのため銅被覆層の内部
応力の上昇か小さく、かつ亜鉛合金被覆層を設けた銅被
覆材料は、Ｃｕ３Ｓｎ等の金属間化合物の形成か極めて
少ないという特徴かあり、この相乗効果によってウィス
カの発生か抑制されるものと推定される。However, when a coating layer containing less than 10% zinc is provided, the amount of zinc diffusion is small, so the increase in internal stress in the copper coating layer is small, and the copper coating material with a zinc alloy coating layer is , Cu3Sn, and the like, and the formation of intermetallic compounds such as Cu3Sn is extremely rare, and it is presumed that the generation of whiskers is suppressed by this synergistic effect.
［実施例］ 以下に実施例を挙げて本発明を具体的に説明する。[Example] The present invention will be specifically described below with reference to Examples.
第１表に示す組成の供試材（厚さ０．３ｍｍ。Sample material with the composition shown in Table 1 (thickness: 0.3 mm).
幅５０ｍｍ、長さ１００ｍｍ）を常法により前処理［ア
ルカリ脱脂−電解脱脂−酸洗］を行った。A sample (width: 50 mm, length: 100 mm) was pretreated using a conventional method (alkaline degreasing, electrolytic degreasing, pickling).
次に、第２表に示す条件てＣｕ、Ｃｕ−Ｚｎ下地めっぎ
を施した後、水洗した。最後に、第３表に示す条件で光
沢錫めっきを行って試料を作成した。Next, Cu and Cu-Zn base plating was applied under the conditions shown in Table 2, followed by washing with water. Finally, bright tin plating was performed under the conditions shown in Table 3 to prepare samples.
上記試料に対して耐ウィスカ性についての試験を行った
。すなわち、第１図に示すような内幅９４ｍｍの断面形
状の治具１内に試料２を取りイ」げ、試料２に圧縮応力
を負荷させ、室内に設置した。ウィスカ測定は、圧縮応
力面の第１図Ｂに示す部分（面積２０ ｍｍｘ ５０
ｍｍ）の範囲内に発生するウィスカを実体顕微鏡により
観察した。The above sample was tested for whisker resistance. That is, the sample 2 was placed in a jig 1 having a cross-sectional shape with an inner width of 94 mm as shown in FIG. 1, a compressive stress was applied to the sample 2, and the sample 2 was placed indoors. Whisker measurements were carried out on the area of the compressive stress surface shown in Figure 1B (area 20 mm x 50
Whiskers generated within a range of 1 mm) were observed using a stereomicroscope.
第４表に試験結果を示す。第４表において、試料Ｎ０１
１〜Ｎｏ、８は本発明実施例である。それぞれのＺｎ含
有量は０１〜１０％の範囲であり、厚さも０．１〜５．
０μｍと本発明条件を満足しており、試料Ｎｏ、６にお
いて１平径若干のウィスカの発生が見られたものの、そ
の他の試料ではウィスカの発生はなかった。Table 4 shows the test results. In Table 4, sample N01
1 to No. 8 are examples of the present invention. The Zn content of each ranges from 0.1% to 10%, and the thickness ranges from 0.1% to 5%.
0 μm, which satisfies the conditions of the present invention, and although some whiskers of 1 square diameter were observed in samples No. 6, no whiskers were observed in the other samples.
試料Ｎｏ、９〜Ｎｏ、１３は比較例である。Samples No. 9 to No. 13 are comparative examples.
Ｚｎは全く含有しておらず、１ケ月後にすてにウィスカ
の発生が見られ、１年後には長さ１ｍｍにも達していた
。It contained no Zn at all, and whiskers were observed to appear after one month, and the length had reached 1 mm after one year.
［発明の効果］
以上説明したように、本発明の銅あるいは銅合金の銅被
覆材料は、耐ウィスカ性が極めて優れており、端子、コ
ネクタやリードフレームなどの電子部品として好適であ
る。[Effects of the Invention] As explained above, the copper or copper alloy copper-coated material of the present invention has extremely excellent whisker resistance and is suitable for use in electronic components such as terminals, connectors, and lead frames.
第１図は試料に圧縮応力を負荷させるための治具の概略
断面図である。
１・・・治具、２・・・試料。FIG. 1 is a schematic cross-sectional view of a jig for applying compressive stress to a sample. 1... Jig, 2... Sample.
Claims (1)
量％以下同じとする）含有する亜鉛合金被覆層を０．１
〜５．０μｍ設けた後、銅被覆層を設けることを特徴と
する耐ウィスカ性に優れた銅および銅合金の銅被覆材料
。A zinc alloy coating layer containing 0.1 to 10% zinc (the same percentage by weight) is applied to the surface of copper or copper alloy.
A copper-coated material of copper and copper alloy having excellent whisker resistance, characterized in that a copper coating layer is provided after forming a copper coating layer of ~5.0 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8564688A JPH01259195A (en) | 1988-04-07 | 1988-04-07 | Tin coated copper or copper alloy material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8564688A JPH01259195A (en) | 1988-04-07 | 1988-04-07 | Tin coated copper or copper alloy material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01259195A true JPH01259195A (en) | 1989-10-16 |
Family
ID=13864586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8564688A Pending JPH01259195A (en) | 1988-04-07 | 1988-04-07 | Tin coated copper or copper alloy material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01259195A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6183886B1 (en) * | 1998-04-03 | 2001-02-06 | Olin Corporation | Tin coatings incorporating selected elemental additions to reduce discoloration |
| JP2002042556A (en) * | 2000-07-28 | 2002-02-08 | Hitachi Cable Ltd | Flat cable, conductor for it, and manufacturing method thereof |
| JP2012124025A (en) * | 2010-12-08 | 2012-06-28 | Hitachi Cable Ltd | Plated copper wire and manufacturing method thereof |
| CN104060281A (en) * | 2013-03-21 | 2014-09-24 | 吕传盛 | Solid phase diffusion reaction copper palladium alloy wire and making method thereof |
| WO2017195768A1 (en) * | 2016-05-10 | 2017-11-16 | 三菱マテリアル株式会社 | Tinned copper terminal material, terminal, and electrical wire end part structure |
| WO2018139628A1 (en) * | 2017-01-30 | 2018-08-02 | 三菱マテリアル株式会社 | Terminal material for connectors, terminal, and electric wire end part structure |
-
1988
- 1988-04-07 JP JP8564688A patent/JPH01259195A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6183886B1 (en) * | 1998-04-03 | 2001-02-06 | Olin Corporation | Tin coatings incorporating selected elemental additions to reduce discoloration |
| JP2002042556A (en) * | 2000-07-28 | 2002-02-08 | Hitachi Cable Ltd | Flat cable, conductor for it, and manufacturing method thereof |
| JP2012124025A (en) * | 2010-12-08 | 2012-06-28 | Hitachi Cable Ltd | Plated copper wire and manufacturing method thereof |
| CN102543249A (en) * | 2010-12-08 | 2012-07-04 | 日立电线株式会社 | Plating coating copper wire and method for making the same |
| CN104060281A (en) * | 2013-03-21 | 2014-09-24 | 吕传盛 | Solid phase diffusion reaction copper palladium alloy wire and making method thereof |
| WO2017195768A1 (en) * | 2016-05-10 | 2017-11-16 | 三菱マテリアル株式会社 | Tinned copper terminal material, terminal, and electrical wire end part structure |
| US10801115B2 (en) | 2016-05-10 | 2020-10-13 | Mitsubishi Materials Corporation | Tinned copper terminal material, terminal, and electrical wire end part structure |
| WO2018139628A1 (en) * | 2017-01-30 | 2018-08-02 | 三菱マテリアル株式会社 | Terminal material for connectors, terminal, and electric wire end part structure |
| US11211729B2 (en) | 2017-01-30 | 2021-12-28 | Mitsubishi Materials Corporation | Terminal material for connectors, terminal, and electric wire termination structure |
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