JPH01258759A - Apparatus for applying liquid - Google Patents
Apparatus for applying liquidInfo
- Publication number
- JPH01258759A JPH01258759A JP8472588A JP8472588A JPH01258759A JP H01258759 A JPH01258759 A JP H01258759A JP 8472588 A JP8472588 A JP 8472588A JP 8472588 A JP8472588 A JP 8472588A JP H01258759 A JPH01258759 A JP H01258759A
- Authority
- JP
- Japan
- Prior art keywords
- roller
- liquid
- thickness
- base material
- liq
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 title claims description 34
- 239000000758 substrate Substances 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 abstract description 25
- 238000007598 dipping method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、半導体と電子デバイス分野等での液体塗布装
置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a liquid coating apparatus used in the semiconductor and electronic device fields.
従来の技術
従来のこの種液体塗布装置としては、第４図に示すスピ
ンコータが用いられていた。すなわち、支持台ｌの上に
真空吸着された基材２に、滴下器３からレジスト等の液
体４を滴下し、支持台１を回転させ液体４を遠心力によ
り基材２上に押し広げるものであった。なお、５は支持
台ｌを回転させるモータ、６は真空ポンプである。2. Description of the Related Art A spin coater shown in FIG. 4 has been used as a conventional liquid coating apparatus of this type. That is, a liquid 4 such as a resist is dropped from a dropper 3 onto a base material 2 vacuum-adsorbed onto a support base l, and the support base 1 is rotated to spread the liquid 4 over the base material 2 by centrifugal force. Met. Note that 5 is a motor that rotates the support base l, and 6 is a vacuum pump.
発明が解決しようとする課題
しかし、このような従来のスピンコータでは、材料であ
る液体の使用効率がせいぜい４〜５％と極めて低いとい
う課題があった。Problems to be Solved by the Invention However, such conventional spin coaters have a problem in that the usage efficiency of the liquid material is extremely low, at most 4 to 5%.
これは、スピンコード方式で製膜を行う場合には、基材
が回転を始める前に、基材の広い部分に液体が供給され
ていないと均一な製膜が達成されない。しかし、上記の
滴下による液体供給方式では、少量の液体で基材の広い
部分を覆うことは雅しく、大部分の液体は遠心力により
基材外に撮り飛ばされることとなっていた。This is because when forming a film using the spin cord method, uniform film formation cannot be achieved unless the liquid is supplied to a wide area of the base material before the base material starts rotating. However, in the above-mentioned dripping liquid supply method, it is difficult to cover a wide area of the base material with a small amount of liquid, and most of the liquid is blown off the base material due to centrifugal force.
本発明はかかる点に鑑み、材料使用効率が高く、しかも
膜厚均一性の良い液体塗布装置を提供することを目的と
する。In view of these points, it is an object of the present invention to provide a liquid coating device with high material usage efficiency and good film thickness uniformity.
課題を解決するための手段
本発明の技術的手段は、液体が塗布される基材を置く支
持台と、前記基材に液体を塗布するローラーと、前記基
材を回転させる装置を具備するものである。Means for Solving the Problems The technical means of the present invention comprises a support platform on which a substrate to which a liquid is applied is placed, a roller for applying the liquid to the substrate, and a device for rotating the substrate. It is.
作用
ローラーで所定膜厚に近い膜厚で基材全面に液体を塗布
する。その後、基材を回転させローラーでの４布時に生
じていた膜厚むらを平坦化し、均一な製膜を達成する。The liquid is applied to the entire surface of the substrate with a film thickness close to a predetermined film thickness using a working roller. Thereafter, the base material is rotated to flatten the film thickness unevenness that occurred during the 4-rolling process with a roller, thereby achieving uniform film formation.
この結果、捨て人られる液体は少なくなり材料利用効率
が−Ｌがることになる。As a result, less liquid is thrown away, and the material utilization efficiency decreases by -L.
実施例
以下、本発明の一実施例を図面に基ずき説明する。第１
図において、従来例と共通する要素には同一番号を付す
。ｌは支持台、２は基材て支持台ｌに真空吸着されてい
る。５は支持台を回転させるモータ、６は真空ポンプで
ある。また、７はローラーであり、８のつけローラーと
接触して回転している。つけローラー８の上方には滴下
器９があり、液体４をつけローラー８に供給する。また
、ローラー７は、エアーシリンダーＩＯにより歯１１１
を介しレール１２にを移動し、基材２との問を往復でき
る。＋３はつけローラー８を回転させるモータである。EXAMPLE Hereinafter, an example of the present invention will be explained based on the drawings. 1st
In the figure, elements common to those of the conventional example are given the same numbers. 1 is a support base, and 2 is a base material which is vacuum-adsorbed to the support base l. 5 is a motor that rotates the support base, and 6 is a vacuum pump. Further, 7 is a roller, which rotates in contact with the application roller 8. Above the dipping roller 8 is a dropper 9 which supplies the liquid 4 to the dipping roller 8. Further, the roller 7 is moved by the teeth 111 by the air cylinder IO.
It can be moved to the rail 12 via the rail 12 and reciprocated to and from the base material 2. +3 is a motor that rotates the application roller 8.
次に、この一実施例の構成における作用を説明する。回
転しているつけローラー８に、レジスト等の液体４を滴
下器９で滴下する。このとき、滴下器９はつけローラー
８の長手方向に移動して、つけローラー８にむらなく液
体４を供給する方が良い。つけローラー８には、ローラ
ー７が接触して、つけローラー８にの液体がローラー７
に移動する。ローラー７上の液体４の厚みは、つけロー
ラー８への液体４の滴下量と１コーラ−７とつけ〔２−
ラー８の接触圧により制御できる。一定厚の液がのつい
たローラー７はエアーシリンダーＩＯによりレール１２
上を移動して、基材（例えばガラス板）２にほぼ一定膜
厚の液体４を塗布する。このとき、第２図に示すように
基材２の全面に）α体４が塗イ６されているが、膜厚む
らは生じている。そこで、支持台ｌに真空吸着されてい
る基材２を回転させると、第３図に示すように遠心力に
よりレベリングされ平坦化された膜厚となる。例えば、
基材２に１．０７１ｍ厚の製膜を行おうとすれば、ロー
ラー７で１．２〜１．４１Ｌｍの精度で塗イ１しておけ
ばよく、ローラー塗布ではこの精度は可能である。また
、やや厚目に塗布する理由は、そのあとの基材２の回転
により、液体４が飛散するからである。基材２への液体
４の塗布は、この例に示したようにローラー７が移動す
る方式に限ることはなく、基材２が移動してローラー７
に接触して塗布する方式でもよい。Next, the operation of the configuration of this embodiment will be explained. A liquid 4 such as a resist is dropped onto a rotating application roller 8 using a dropper 9. At this time, it is preferable that the dropper 9 moves in the longitudinal direction of the dipping roller 8 to evenly supply the liquid 4 to the dipping roller 8. The roller 7 is in contact with the dipping roller 8, and the liquid on the dipping roller 8 is transferred to the roller 7.
Move to. The thickness of the liquid 4 on the roller 7 is determined by the amount of liquid 4 dropped onto the roller 8, 1 cola-7, and the thickness of the liquid 4 on the roller 8.
It can be controlled by the contact pressure of roller 8. The roller 7 with a certain thickness of liquid on it is moved to the rail 12 by an air cylinder IO.
The liquid 4 is applied to the base material (for example, a glass plate) 2 with a substantially constant thickness. At this time, as shown in FIG. 2, the α body 4 is coated on the entire surface of the base material 2, but the film thickness is uneven. Therefore, when the base material 2 vacuum-adsorbed on the support 1 is rotated, the film thickness is leveled and flattened by centrifugal force as shown in FIG. 3. for example,
If it is desired to form a film with a thickness of 1.071 m on the substrate 2, it is sufficient to apply the coating with an accuracy of 1.2 to 1.41 Lm using the roller 7, and this accuracy is possible with roller coating. Further, the reason why the coating is applied somewhat thickly is that the liquid 4 is scattered by the subsequent rotation of the base material 2. Application of the liquid 4 to the base material 2 is not limited to the method in which the roller 7 moves as shown in this example, and the method in which the base material 2 moves and the roller 7
It may also be applied by contacting.
発明の効果
以上のように本発明によれば、スピンコード方式で、基
材が回転する前に基材全面に、所定膜厚よりやや厚い製
膜が達成されているため、回転により液体がムダに９１
する暇が少なくてすむ。すなわち、液体の利用効率が高
く、しかも均一膜厚の製膜が達成されることになる。Effects of the Invention As described above, according to the present invention, a film that is slightly thicker than a predetermined film thickness is formed on the entire surface of the substrate before the substrate is rotated using the spin code method, so that liquid is not wasted due to rotation. 91
I don't have much time to do it. In other words, the efficiency of liquid utilization is high and film formation with a uniform film thickness is achieved.
第１図は本発明の一実施例の液体塗布装置の構成図、第
２図は本発明のローラーで液体を塗布した直後の膜厚分
布を示す断面図、第３図は同基材２を回転させた直後の
膜厚分布を示す断面図、第４図は従来例の液体塗布装置
構成図である。
ｌ・・・支持台、２・・・基材、４・・・液体、７・・
・ローラー。
第 １ 図
第２図Fig. 1 is a configuration diagram of a liquid coating device according to an embodiment of the present invention, Fig. 2 is a cross-sectional view showing the film thickness distribution immediately after coating the liquid with the roller of the present invention, and Fig. 3 is a diagram showing the same substrate 2. FIG. 4 is a sectional view showing the film thickness distribution immediately after rotation, and is a configuration diagram of a conventional liquid coating device. l...Support stand, 2...Base material, 4...Liquid, 7...
·roller. Figure 1 Figure 2
Claims (1)
体を塗布するローラーと、前記基材を回転させる装置を
具備することを特徴とする液体塗布装置。A liquid coating device comprising: a support base on which a substrate to which a liquid is applied is placed; a roller for applying the liquid to the substrate; and a device for rotating the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8472588A JPH01258759A (en) | 1988-04-06 | 1988-04-06 | Apparatus for applying liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8472588A JPH01258759A (en) | 1988-04-06 | 1988-04-06 | Apparatus for applying liquid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01258759A true JPH01258759A (en) | 1989-10-16 |
Family
ID=13838662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8472588A Pending JPH01258759A (en) | 1988-04-06 | 1988-04-06 | Apparatus for applying liquid |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01258759A (en) |
-
1988
- 1988-04-06 JP JP8472588A patent/JPH01258759A/en active Pending
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