JPS6347929A - Developing apparatus - Google Patents

Abstract

PURPOSE:To enable the uniform treatment of a semiconductor substrate and the reduction of the quantity of chemicals employed, by a construction wherein a dropping nozzle has a plurality of dropping ports and drops chemicals while it moves. CONSTITUTION:In a developing apparatus wherein chemicals are atomized or dropped onto a semiconductor substrate 3 coated with a photoresist and printed in a prescribed pattern, a dropping nozzle 1 is designed to have a plurality of dropping ports and to drop chemicals while it moves. For instance, the semiconductor substrate 3 is supported on a base body 5, the tip of the nozzle 1 is positioned in the central part, the semiconductor substrate 3 is rotated by a spin motor 7, and simultaneously a developer is made to start to drop from a plurality of dropping ports of the nozzle 1. Furthermore a moving stage 8 is reciprocated at a certain speed in the directions of A and B so that the tip of the nozzle 1 is directed toward the peripheral part of the semiconductor substrate 3. By this construction, the developer is distributed uniformly on the whole surface of the semiconductor substrate. Therefore the nonuniformity in treatment can be eliminated, and moreover the quantity of the developer used is reduced since surplus dropping becomes unnecessary.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a semiconductor manufacturing apparatus, and particularly to a photoresist developing apparatus.

[Conventional technology]

Conventionally, a photoresist developing device used in semiconductor manufacturing has a structure in which a chemical solution is dropped from a single dropping port and the nozzle is fixed.

[Problem that the invention seeks to solve]

When a developing device having the conventional structure described above is used, the chemical solution is dropped from a certain portion of the semiconductor substrate, so that a uniform spread cannot be obtained, and a large amount of the chemical solution is used. Furthermore, there is a drawback that the treatment on the surface soaked with the chemical solution may be uneven depending on the dropping point and spread of the chemical solution.

[Failure to solve the problem]

An object of the present invention is to process semiconductor substrates uniformly and to reduce the amount of chemicals used.

A feature of this invention is that it has a nozzle that drops the chemical solution uniformly onto the surface of the semiconductor substrate.

〔Example〕

Next, one embodiment of the present invention will be explained with reference to the drawings.

FIG. 1 is a cross-sectional view of a developing device for explaining one embodiment of the present invention. The present invention of this embodiment includes a base 5 that vacuum-chucks a semiconductor substrate 3 and rotates it via a spin motor 7, and a tip of a nozzle 1 having a plurality of drip openings through which a predetermined developer is passed through a pipe 2. It has a piping system for dropping the liquid onto the semiconductor substrate 3, and a moving stage 8 that supports the nozzle 1 and moves the tip of the nozzle 1 in parallel from the center of the semiconductor substrate to the periphery at a constant speed. . That is, the semiconductor substrate 3 is supported on the base, the tip of the nozzle 1 is positioned at the center, the semiconductor substrate is rotated by the spin sweater 7, and at the same time, the developer is started to be dripped from the plurality of drip ports of the nozzle 1 through the pipe 2, and further, The moving stage 8 is reciprocated in the A%B direction at a constant speed so that the nozzle tip moves toward the periphery of the semiconductor substrate. This method increases the number of parts on the surface of the semiconductor substrate where the developer is dropped, so that the distribution of the developer is averaged over the entire surface over a uniform period of time.

〔Effect of the invention〕

As explained above, by using the developing machine of the present invention, it is possible to uniformly distribute the current Ug over the entire surface of the semiconductor substrate when dropping, compared to a nozzle with a single dropping port, which reduces processing errors within the surface of the semiconductor substrate. Uniformity can be eliminated. moreover,
Since the distribution speed of the developer is constant, there is no need for excessive dropping, and the amount of developer used can be reduced.

In the embodiments described above, the shape and number of the nozzle drip openings can be freely selected.

[Brief explanation of drawings]

FIG. 1 is a sectional view for explaining one embodiment of the present invention. FIGS. 2 and 3 are cross-sectional views showing examples of the shape of the nozzle. In the same figure, 1...Nozzle, 1'...Dripping port, 2
...Piping, 3...Semiconductor substrate, 4...
...Processing cup, 5...Base, 6...
...Drain port, 7...Spin motor, 8...
...It is a moving stage.

Claims (1)

[Claims] In a developing device that performs development processing by spraying or dropping a chemical solution onto a semiconductor substrate that has been coated with photoresist and baked with a predetermined pattern, a dripping nozzle has a plurality of drip openings and drops the chemical solution while moving. A developing device characterized by: