JPH01254392A - Dull working method for product surface - Google Patents
Dull working method for product surfaceInfo
- Publication number
- JPH01254392A JPH01254392A JP63022038A JP2203888A JPH01254392A JP H01254392 A JPH01254392 A JP H01254392A JP 63022038 A JP63022038 A JP 63022038A JP 2203888 A JP2203888 A JP 2203888A JP H01254392 A JPH01254392 A JP H01254392A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- pulse
- dulling
- laser beam
- roll surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 20
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000003786 synthesis reaction Methods 0.000 claims description 2
- 101100500049 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) YSR3 gene Proteins 0.000 abstract description 5
- 101100339482 Colletotrichum orbiculare (strain 104-T / ATCC 96160 / CBS 514.97 / LARS 414 / MAFF 240422) HOG1 gene Proteins 0.000 abstract 1
- 101100048228 Homo sapiens UBP1 gene Proteins 0.000 abstract 1
- 101100117629 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) LCB3 gene Proteins 0.000 abstract 1
- 102100040065 Upstream-binding protein 1 Human genes 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 230000005284 excitation Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000010979 ruby Substances 0.000 description 2
- 229910001750 ruby Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明はレーザ光を利用したロール等の製品表面のダル
加工法に関し、特にパルスレーザのビーム合成制御を行
うダル加工法に係る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for dulling the surface of a product such as a roll using laser light, and particularly to a method for dulling the surface of a product such as a roll using laser light, and in particular to a method for controlling pulsed laser beam synthesis.
[従来の技術]
ロールのダル加工法としては、ショツトブラスト法、放
電加工法やレーザを用いてロール表面を加工する方法な
どがある。[Prior Art] As a method for dulling a roll, there are a shot blasting method, an electric discharge machining method, and a method of processing the roll surface using a laser.
レーザを用いてロール表面のダル加工を行う装置につい
ては、特公昭5B−25557号、特公昭60−215
6号により公告されている。特公昭60−2156号公
報に記載の装置は、YAGレーザ、ルビーレーザなどの
光源をQスイッチを用いてパルスレーザを発生させてロ
ール表面のダル加工を行う装置で、複数パルスによって
ダル形状(高さ、深さ、穴径)を制御している。すなわ
ち、単パルスではダル形状の高さ部分が低く適正なダル
加工にならないため、複数パルスを使用している。Regarding the device for dulling the roll surface using a laser, Japanese Patent Publication No. 5B-25557 and Japanese Patent Publication No. 60-215
It has been announced by No. 6. The device described in Japanese Patent Publication No. 60-2156 is a device that uses a light source such as a YAG laser or a ruby laser to generate a pulsed laser using a Q switch to dull the roll surface. (hole size, depth, hole diameter). In other words, multiple pulses are used because the height of the dull shape is too low and proper dulling cannot be achieved with a single pulse.
しかして、ロール表面のダル加工においては、所定の周
波数、パルス幅、尖頭値などをもつパルスレーザを用い
て、ロール表面に周期的な加工を施す必要がある。この
ようなパルスレーザ出力を得る方法としては、連続発振
(CW)レーザ出力を機械的光学装置(チョッパー、シ
ャッター等)でパルス化する方法と、パルス励起あるい
はQスイッチパルスなどのパルスレーザ励起、あるいは
Qスイッチパルスなどのパルスレーザを使用する方法が
ある。Therefore, in dulling the roll surface, it is necessary to periodically process the roll surface using a pulsed laser having a predetermined frequency, pulse width, peak value, etc. There are two ways to obtain such a pulsed laser output: pulsating continuous wave (CW) laser output using a mechanical optical device (chopper, shutter, etc.), pulsed laser excitation such as pulsed excitation or Q-switch pulse, or There is a method using a pulse laser such as a Q-switch pulse.
Qスイッチパルスは機械装置を必要としないため、Ii
η者に比較して装置が小型、簡素化出来ると同時に、周
波数制御が容易でかつ制御範囲が広いという特徴を有し
ている。しかしながら、Qスイッチは周波数を変化させ
ると、発振励起条件が変化するため、パルス波形や尖頭
出力などが同時に変化し、安定したダル加工か出来ない
。又、第2図に示したように、尖頭パルスの尖頭値(四
)か後続のパルス(P2 、113.114 、・・・
)よりも極度に大きくなる。Since Q-switched pulses do not require mechanical equipment, Ii
Compared to the η type, the device is smaller and simpler, and at the same time, frequency control is easy and the control range is wide. However, when the Q switch changes the frequency, the oscillation excitation conditions change, so the pulse waveform, peak output, etc. change at the same time, making stable dull processing impossible. Also, as shown in Fig. 2, the peak value (4) of the peak pulse or the subsequent pulse (P2, 113.114, . . .
) becomes extremely large.
また、特公昭60−2156号においても上記短所の解
決法については示されていない。Furthermore, Japanese Patent Publication No. 60-2156 does not disclose any solutions to the above-mentioned disadvantages.
[発明か解決しようとする問題点]
パルス列の尖頭値が大きく異なると、最初のパルスP1
で六の深さが決まるのでP2〜P4の効果が小ざくなり
、総合的なパルス群としての制御性がよくないので、こ
の問題を解決する必要がある。[Problem to be solved by the invention] If the peak values of the pulse train differ greatly, the first pulse P1
Since the depth of 6 is determined by , the effect of P2 to P4 becomes small, and the controllability as a comprehensive pulse group is not good, so this problem needs to be solved.
本発明はこのような問題点を解決することを目的とする
ものである。The present invention aims to solve these problems.
[問題点を解決するための手段]
上記「1的を達成するため、本発明は複数のパルスレー
ザおよびパルス発生制御系(Qスイッチレーザの場合は
Qスイッチ制御系)とビームスプリッタ−を用いてレー
ザビーム群を合成し、レーザ発振器の励起ランプの電流
値をもって各レーザのパルスピーク値を制御することに
より、ロール表面のダル加工に適したパルス群を構成す
ることを特徴とする、ダル加工に適したパルスレーザ制
御方法を提供するものである。[Means for Solving the Problems] In order to achieve the above object 1, the present invention uses a plurality of pulse lasers, a pulse generation control system (Q switch control system in the case of a Q switch laser), and a beam splitter. For dull processing, the laser beam group is synthesized and the pulse peak value of each laser is controlled using the current value of the excitation lamp of the laser oscillator, thereby configuring a pulse group suitable for dull processing of the roll surface. A suitable pulsed laser control method is provided.
すなわち、本発明の要旨とするところは、パルスレーザ
を用いて製品表面をダル加工する方法において、個々に
パルスピーク値を設定した2台を1組とするレーザ発振
器よりレーザを発振し、加工表面に達する途中で個々の
レーザ成分の分離と同軸合成を行い、所定間隔で加工面
にレーザを照射することを特徴とする製品表面のダル加
工法である。That is, the gist of the present invention is to provide a method for dulling the surface of a product using a pulsed laser, in which a laser is oscillated from a set of two laser oscillators each having a pulse peak value set individually, and the surface to be machined is This method of dulling the surface of a product is characterized by separating the individual laser components and coaxially combining them on the way to reach the target surface, and then irradiating the processed surface with the laser at predetermined intervals.
以下本発明に係る方法について図面を用いて説明する。The method according to the present invention will be explained below with reference to the drawings.
[作用]
ここでいうビームスプリッタ−とは、ある一定波長域の
光を、ある固有の角度で入射した場合に、入射光を反射
光と透過光に分離する機能を有する光学素子のことであ
る。通常、これらの光学素子は、石英などのFu材表面
に数種類の屈折率の異なる物質を多層膜として積層した
構造を有している。また多層1漠の特性により反射光と
透過光の偏光を同時に行うことも可能であり、この場合
には1.B1の透過光はLIllの入射面に平行な偏光
成分(P波)、L112の反射光は水平偏光成分(S波
)となる。[Function] The beam splitter here refers to an optical element that has the function of separating incident light into reflected light and transmitted light when light in a certain wavelength range is incident at a certain specific angle. . Generally, these optical elements have a structure in which several types of substances having different refractive indexes are laminated as a multilayer film on the surface of a Fu material such as quartz. Also, due to the characteristics of the multilayer structure, it is possible to simultaneously polarize the reflected light and the transmitted light; in this case, 1. The transmitted light of B1 becomes a polarized light component (P wave) parallel to the incident plane of LIll, and the reflected light of L112 becomes a horizontally polarized light component (S wave).
第1図(a)は、本発明方法を実施するに適したパルス
数2木の場合のパルスレーザ制御装置の基本構成を示す
。05CI、05C2はレーザ発振器である。QSI、
QS2はQスイッチであり、発振器0501゜05C2
にセットされている。10はQスイッチの制御系であり
、これよりQスイッチ信号Ql、Q2が順次送出され、
それに応じて発振H4osc+、osczよりレーザビ
ーム1.111.1、B2が発生ずる。レーザビームL
B 2は直接に、レーザビームL[llは折曲げ鏡B
MIを介しビームスプリッタ−IIsに投入され、LB
Iの透過光LBI (T)とL[12の反射光LB2
(It)を同軸のレーザビーム群LBI’ Iとして合
成する。FIG. 1(a) shows the basic configuration of a pulsed laser control device in the case of a two-pulse tree suitable for carrying out the method of the present invention. 05CI and 05C2 are laser oscillators. QSI,
QS2 is a Q switch, and the oscillator 0501゜05C2
is set to . 10 is a Q switch control system, from which Q switch signals Ql and Q2 are sequentially sent out;
Accordingly, laser beams 1.111.1 and B2 are generated from the oscillations H4osc+ and oscz. Laser beam L
B 2 directly connects the laser beam L [ll is the bending mirror B
into the beam splitter-IIs via the MI, and the LB
Transmitted light LBI (T) of I and reflected light LB2 of L[12
(It) are synthesized as a coaxial laser beam group LBI'I.
一方、ビームスプリッタ−BSの他の1方向に、LB2
の透過光LB2 (T)とLBIの反射光LBI (I
t)を同軸なレーザビーム群LBP2として合成する。On the other hand, in the other direction of the beam splitter BS, LB2
The transmitted light LB2 (T) and the reflected light LBI (I
t) are combined into a coaxial laser beam group LBP2.
レーザビーム群LBPI、LBP2はそれぞれは集光レ
ンズFLI、l1L2によって集光される。集光点FP
I。The laser beam groups LBPI and LBP2 are focused by condenser lenses FLI and l1L2, respectively. Focus point FP
I.
FP2においてあたかも一つのレーザビームが集光され
たと同様なレーザ集光ビーム群LBP I 、 LBP
2となり、ロール表面のダル加工をロールを二分割して
高速ダル加工を可能にしている。In FP2, the laser focused beam group LBP I, LBP is the same as if one laser beam was focused.
2, which enables high-speed dulling of the roll surface by dividing the roll into two.
第1図(b)はビームスプリッタ−にて合成したレーザ
ビーム群LBP2のみを使用し、他方のレーザビームL
B 11 +はビームダンパー11Dで吸収し使用し
ない。この場合は第1図(a)に比較してダル加工速度
は2分の1になる。In FIG. 1(b), only the laser beam group LBP2 combined by the beam splitter is used, and the other laser beam LBP2 is used.
B 11 + is absorbed by the beam damper 11D and is not used. In this case, the dulling speed is halved compared to that in FIG. 1(a).
20は被加工ロールの表面である。本数が2本になると
ともに穴の深さはほぼ二倍に深くなり、ダル加工を行う
ロール表面粗度の要求品質に合わせて本数を選択する事
になる。20 is the surface of the roll to be processed. As the number of holes increases to two, the depth of the hole becomes almost twice as deep, and the number of holes is selected according to the required quality of the surface roughness of the roll to be dulled.
第3図はロール表面ダル加工を行う場合の理想のパルス
波形であり、τ0は各パルス幅、τ1は尖頭パルス+1
L lと2番目のパルスPL2の間隔である。第3図
に示したように、ロールダル加工に適した理想的なパル
ス波形はPLI =PL2である。Figure 3 shows the ideal pulse waveform when performing roll surface dulling, where τ0 is each pulse width, and τ1 is the peak pulse +1
This is the interval between L l and the second pulse PL2. As shown in FIG. 3, the ideal pulse waveform suitable for rolled dull processing is PLI=PL2.
ビームスプリッタ−の偏光による分割機能を用い、かつ
レーザビームL[lI、LB2はランダム偏向として、
そわぞれP波とS波が50%ずつの場合、レーザビーム
l[lI、I、+12のパワーを同じにし、またビーム
スプリッタ−の固有の入射角(P波とS波を完全に分離
できる入射角)にすることによってPLI =PL2と
することが可能である。Using the polarization splitting function of the beam splitter, the laser beam L[lI, LB2 is randomly polarized,
If the P waves and S waves are 50% each, the powers of the laser beams l[lI, I, +12 should be the same, and the beam splitter's unique angle of incidence (the P waves and S waves can be completely separated) By setting the angle of incidence), it is possible to set PLI = PL2.
レーザビーム1.Bl、L[12が完全なランダム偏向
でなくP波とS波が50%に分離できない場合は、レー
ザビームLBI、L[12のパワーをP波とS波の分離
比に合わせることによって、PLI =PL2とするこ
とが可能である。Laser beam 1. If Bl, L[12 is not a completely random deflection and P waves and S waves cannot be separated by 50%, PLI =PL2.
次に、Qスイッチ制御系lOの具体的な制御回路を第4
図に、また制御信号の時間関係を第5図に示す。Next, the specific control circuit of the Q switch control system IO will be explained in the fourth section.
In addition, the time relationship of the control signals is shown in FIG.
第4図は、パルス群の周波数1゜を決定するパルス発生
RY P Gと、パルス群内のパルス間隔て1を決定す
るワンショットバイブレータOMI 、0M2にて構成
されており、第5図において、各OMI 、0M2はそ
わぞれの人カイ3号の立上り信号に同期している。In FIG. 4, it is composed of a pulse generator RYPG that determines the frequency of a pulse group of 1°, and a one-shot vibrator OMI and 0M2 that determines a pulse interval of 1 in the pulse group, and in FIG. Each OMI and 0M2 are synchronized with the rise signal of the respective Jinkai-3.
すなわち、パルス発生器PGよりの出力信号f。をOM
+のクロックCに1に人力する。これによ)てr。That is, the output signal f from the pulse generator PG. OM
Manually input 1 to clock C of +. This)te r.
の立上り信号に同期してOM+で設定したパルス幅τ1
のパルスQlが発生する、同時にQlと逆極性の信号側
が発生する。Pulse width τ1 set by OM+ in synchronization with the rising signal of
A pulse Ql is generated, and at the same time a signal with the opposite polarity to Ql is generated.
以上のように、ダル加工用のパルス群の周波数「。はパ
ルス発生器PGで設定、その先頭信号に同期し、一定の
時間遅れをもったパルス群が発生し、LDI、L[12
のQスイッチ制御を実施することが可能となる。また、
τ1を0にすれば、両パルスは同時に照射することもで
きる。As described above, the frequency of the pulse group for dull processing "." is set by the pulse generator PG, and a pulse group is generated with a certain time delay in synchronization with the leading signal, LDI, L[12
Q-switch control can be implemented. Also,
If τ1 is set to 0, both pulses can be applied simultaneously.
第6図はビーム合成を示す図で、第6図(a)がビーム
スプリッタ−によるビーム合成で人力レーザビームLB
IとLB2の入射角θ8.θ2をビームスプリッタ−の
固有値内で同一に設定することによって、L[11の透
過光とLB2の反射光を同軸の合成ビームLPBにする
ことか出来る。第6図(b)は全反射鏡TMによるビー
ム合成の図である。この場合、人力レーザビームL[l
IとLB2を並行に合成できるが同軸に合成できず、合
成ビームLPBの径が大きくなり、集光系のレンズが大
型化する欠点がある。Figure 6 is a diagram showing beam combination, and Figure 6(a) shows beam combination using a beam splitter to produce a human-powered laser beam LB.
Incident angle θ8 between I and LB2. By setting θ2 to be the same within the eigenvalues of the beam splitter, the transmitted light of L[11 and the reflected light of LB2 can be made into a coaxial combined beam LPB. FIG. 6(b) is a diagram of beam combination by the total reflection mirror TM. In this case, the human-powered laser beam L[l
Although I and LB2 can be combined in parallel, they cannot be combined coaxially, and the diameter of the combined beam LPB becomes large, which has the disadvantage that the lens of the condensing system becomes large.
なお、レーザ加工をする対象物は、ロール表面に限定さ
れるものではなく、一般の製品いずれでもよい。また、
加工に用いるレーザの種類は、YAG、ルビーなどの固
体レーザである。Note that the object to be laser processed is not limited to the roll surface, but may be any general product. Also,
The type of laser used for processing is a solid laser such as YAG or ruby.
[実施例]
本発明による方法で2台のQスイッチレーザのパルス波
形制御を行いロールダル加工を実施した。Qスイッチレ
ーザのパルス波形制御条件は次の通りである。[Example] Roll dull processing was carried out by controlling the pulse waveforms of two Q-switched lasers using the method according to the present invention. The pulse waveform control conditions of the Q-switched laser are as follows.
ビームスプリッタ−2インチ径
レーザビーム で。: 300nsecτI =5μ5
ec
fo : 20kllz
レンズ焦点距離 FL : 25mm
ロール形状 長さ: 1500mm
径 : 600mm
処理時間 約1時間
その結果、処理時間も約1時間と高速で、穴形状として
内径1001、粗度値2.b+mのダル加工となり、鋼
板表面への転写率も80%と高く、耐摩耗性も向上した
。Beam splitter - 2 inch diameter laser beam. : 300nsecτI =5μ5
ec fo: 20kllz Lens focal length FL: 25mm Roll shape Length: 1500mm Diameter: 600mm Processing time: about 1 hour As a result, the processing time was about 1 hour, which was fast, and the hole shape had an inner diameter of 1001 and a roughness value of 2. B+M dull processing was obtained, the transfer rate to the steel plate surface was as high as 80%, and the wear resistance was also improved.
[発明の効果]
以上説明した本発明の方法によれば、パルスレーザビー
ムが同軸で合成出来るので、レンズによる集光系が小型
でシンプルになり、集光点での荀置合せが容易になる。[Effects of the Invention] According to the method of the present invention explained above, pulsed laser beams can be combined coaxially, so the condensing system using lenses becomes small and simple, and alignment at the condensing point becomes easy. .
又、パルス群の中のパルス個別にピーク値が設定出来る
ので、粗面化における穴あけ工程での被照射体の溶融お
よび蒸発現象を制御でき、適正な硬度の穴を形成するこ
とが出来る。しかも、パルス群のパルス間隔を制御でき
るので、さらにダル加工に適した穴加工を11−ること
かでき、その効果は大きい。Furthermore, since the peak value can be set individually for each pulse in the pulse group, it is possible to control the melting and evaporation phenomena of the irradiated object in the hole-drilling process for surface roughening, and to form holes with appropriate hardness. Moreover, since the pulse interval of the pulse group can be controlled, it is possible to perform hole machining more suitable for dull machining, which is highly effective.
第1図(a) (b)は本発明によるダル加ニジステム
の構成を示すブロック図、第2図はQスイッチを用いた
パルス群のレーザ出力の状態を示す波形図、第3図は本
発明によるパルス群の出力状態を示す波形図、第4図は
Qスイッチ制御系の其体的な制御回路を示すブロック図
、第5図は制御信号の時間関係を示すタイミングチャー
トで、第6図はビーム合成を示す図で、(a)がビーム
スプリッタ−によるビーム合成を、(b)が全反射鏡に
よるビーム合成を説明する図である。FIGS. 1(a) and 1(b) are block diagrams showing the configuration of the darning system according to the present invention, FIG. 2 is a waveform diagram showing the state of the laser output of a pulse group using a Q switch, and FIG. Figure 4 is a block diagram showing the control circuit of the Q-switch control system, Figure 5 is a timing chart showing the time relationship of control signals, and Figure 6 is a waveform diagram showing the output state of the pulse group. FIG. 3 is a diagram illustrating beam combining, in which (a) illustrates beam combining using a beam splitter, and (b) illustrates beam combining using a total reflection mirror.
Claims (1)
いて、個々にパルスピーク値を設定した2台を1組とす
るレーザ発振器よりレーザを発振し、加工表面に達する
途中で個々のレーザ成分の分離と同軸合成を行い、所定
間隔で加工面にレーザを照射することを特徴とする製品
表面のダル加工法。In the method of dulling the surface of a product using a pulsed laser, the laser is emitted from a set of two laser oscillators with individually set pulse peak values, and the individual laser components are separated on the way to the processing surface. A method for dulling the surface of a product, which is characterized by performing coaxial synthesis and irradiating the processed surface with a laser at predetermined intervals.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63022038A JPH01254392A (en) | 1987-12-11 | 1988-02-03 | Dull working method for product surface |
EP88902201A EP0308512B1 (en) | 1987-02-24 | 1988-02-24 | Apparatus for dull finish of roll with pulse laser |
PCT/JP1988/000194 WO1988006504A1 (en) | 1987-02-24 | 1988-02-24 | Method and apparatus for dull finish of roll with pulse laser |
DE3850330T DE3850330T2 (en) | 1987-02-24 | 1988-02-24 | DEVICE FOR FINISHING A ROLL WITH IMPULSE LASER. |
US07/305,121 US4947023A (en) | 1987-02-24 | 1988-10-18 | Method and apparatus for roll dulling by pulse laser beam |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31362087 | 1987-12-11 | ||
JP62-313620 | 1987-12-11 | ||
JP63022038A JPH01254392A (en) | 1987-12-11 | 1988-02-03 | Dull working method for product surface |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01254392A true JPH01254392A (en) | 1989-10-11 |
JPH0440118B2 JPH0440118B2 (en) | 1992-07-01 |
Family
ID=26359197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63022038A Granted JPH01254392A (en) | 1987-02-24 | 1988-02-03 | Dull working method for product surface |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01254392A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992011960A1 (en) * | 1991-01-11 | 1992-07-23 | Nippon Steel Corporation | Cooling drum for casting thin cast piece; device for and method of forming dimples on peripheral surface of said drum |
WO1994029069A1 (en) * | 1993-06-04 | 1994-12-22 | Seiko Epson Corporation | Apparatus and method for laser machining, and liquid crystal panel |
JPH10156571A (en) * | 1996-12-02 | 1998-06-16 | Toshiba Electron Eng Corp | Laser beam machine |
US6897405B2 (en) * | 2001-11-30 | 2005-05-24 | Matsushita Electric Industrial Co., Ltd. | Method of laser milling using constant tool path algorithm |
JP2010115661A (en) * | 2008-11-11 | 2010-05-27 | Panasonic Corp | Laser beam machining apparatus and method |
-
1988
- 1988-02-03 JP JP63022038A patent/JPH01254392A/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992011960A1 (en) * | 1991-01-11 | 1992-07-23 | Nippon Steel Corporation | Cooling drum for casting thin cast piece; device for and method of forming dimples on peripheral surface of said drum |
AU646547B2 (en) * | 1991-01-11 | 1994-02-24 | Nippon Steel Corporation | Cooling drum for casting thin cast piece; device for and method of forming dimples on peripheral surface of said drum |
WO1994029069A1 (en) * | 1993-06-04 | 1994-12-22 | Seiko Epson Corporation | Apparatus and method for laser machining, and liquid crystal panel |
US6635850B2 (en) | 1993-06-04 | 2003-10-21 | Seiko Epson Corporation | Laser machining method for precision machining |
JPH10156571A (en) * | 1996-12-02 | 1998-06-16 | Toshiba Electron Eng Corp | Laser beam machine |
US6897405B2 (en) * | 2001-11-30 | 2005-05-24 | Matsushita Electric Industrial Co., Ltd. | Method of laser milling using constant tool path algorithm |
JP2010115661A (en) * | 2008-11-11 | 2010-05-27 | Panasonic Corp | Laser beam machining apparatus and method |
Also Published As
Publication number | Publication date |
---|---|
JPH0440118B2 (en) | 1992-07-01 |
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