JPH0125224B2 - - Google Patents

Info

Publication number
JPH0125224B2
JPH0125224B2 JP57188560A JP18856082A JPH0125224B2 JP H0125224 B2 JPH0125224 B2 JP H0125224B2 JP 57188560 A JP57188560 A JP 57188560A JP 18856082 A JP18856082 A JP 18856082A JP H0125224 B2 JPH0125224 B2 JP H0125224B2
Authority
JP
Japan
Prior art keywords
gate
conductor lead
contact
metallized layer
semiconductor region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57188560A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5976458A (ja
Inventor
Futoshi Tokuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57188560A priority Critical patent/JPS5976458A/ja
Publication of JPS5976458A publication Critical patent/JPS5976458A/ja
Publication of JPH0125224B2 publication Critical patent/JPH0125224B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP57188560A 1982-10-25 1982-10-25 半導体装置 Granted JPS5976458A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57188560A JPS5976458A (ja) 1982-10-25 1982-10-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57188560A JPS5976458A (ja) 1982-10-25 1982-10-25 半導体装置

Publications (2)

Publication Number Publication Date
JPS5976458A JPS5976458A (ja) 1984-05-01
JPH0125224B2 true JPH0125224B2 (cs) 1989-05-16

Family

ID=16225822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57188560A Granted JPS5976458A (ja) 1982-10-25 1982-10-25 半導体装置

Country Status (1)

Country Link
JP (1) JPS5976458A (cs)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770552B2 (ja) * 1986-03-29 1995-07-31 三菱電機株式会社 半導体装置
CN101738088B (zh) 2008-11-20 2011-09-07 中芯国际集成电路制造(上海)有限公司 炉管隔热装置及利用该装置的炉管预防维护保养方法
WO2018134204A1 (en) * 2017-01-17 2018-07-26 Abb Schweiz Ag Semiconductor switching device

Also Published As

Publication number Publication date
JPS5976458A (ja) 1984-05-01

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