JPH0124931Y2 - - Google Patents
Info
- Publication number
- JPH0124931Y2 JPH0124931Y2 JP1982135552U JP13555282U JPH0124931Y2 JP H0124931 Y2 JPH0124931 Y2 JP H0124931Y2 JP 1982135552 U JP1982135552 U JP 1982135552U JP 13555282 U JP13555282 U JP 13555282U JP H0124931 Y2 JPH0124931 Y2 JP H0124931Y2
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- speed
- circuit
- current
- speed command
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000013459 approach Methods 0.000 claims description 2
- 239000008188 pellet Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982135552U JPS5939931U (ja) | 1982-09-07 | 1982-09-07 | ワイヤボンデイング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982135552U JPS5939931U (ja) | 1982-09-07 | 1982-09-07 | ワイヤボンデイング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5939931U JPS5939931U (ja) | 1984-03-14 |
JPH0124931Y2 true JPH0124931Y2 (US20020095090A1-20020718-M00002.png) | 1989-07-27 |
Family
ID=30305066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982135552U Granted JPS5939931U (ja) | 1982-09-07 | 1982-09-07 | ワイヤボンデイング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5939931U (US20020095090A1-20020718-M00002.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0618222B2 (ja) * | 1985-09-02 | 1994-03-09 | 日立東京エレクトロニクス株式会社 | ワイヤボンディング装置 |
-
1982
- 1982-09-07 JP JP1982135552U patent/JPS5939931U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5939931U (ja) | 1984-03-14 |
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