JPH0124870B2 - - Google Patents

Info

Publication number

JPH0124870B2

JPH0124870B2 JP3982785A JP3982785A JPH0124870B2 JP H0124870 B2 JPH0124870 B2 JP H0124870B2 JP 3982785 A JP3982785 A JP 3982785A JP 3982785 A JP3982785 A JP 3982785A JP H0124870 B2 JPH0124870 B2 JP H0124870B2

Authority

JP

Japan

Prior art keywords

electrodeposited

layer

ceramic cement

thin film

film layer

Prior art date

1985-02-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000004568 cement Substances 0.000 claims description 14
• 239000000919 ceramic Substances 0.000 claims description 14
• 238000005323 electroforming Methods 0.000 claims description 12
• 238000000034 method Methods 0.000 claims description 8
• 239000011159 matrix material Substances 0.000 claims description 7
• 229910044991 metal oxide Inorganic materials 0.000 claims description 7
• 150000004706 metal oxides Chemical class 0.000 claims description 7
• 239000010409 thin film Substances 0.000 claims description 7
• 229910052751 metal Inorganic materials 0.000 claims description 6
• 239000002184 metal Substances 0.000 claims description 6
• 239000000843 powder Substances 0.000 claims description 5
• 238000004519 manufacturing process Methods 0.000 claims description 3
• 239000000945 filler Substances 0.000 claims 2
• 238000007747 plating Methods 0.000 description 8
• 238000004070 electrodeposition Methods 0.000 description 7
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 238000007772 electroless plating Methods 0.000 description 2
• 238000009713 electroplating Methods 0.000 description 2
• 238000003754 machining Methods 0.000 description 2
• 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 230000004913 activation Effects 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 230000015572 biosynthetic process Effects 0.000 description 1
• 238000005266 casting Methods 0.000 description 1
• 238000007796 conventional method Methods 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 230000005611 electricity Effects 0.000 description 1
• 239000002075 main ingredient Substances 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 239000000203 mixture Substances 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
• GNMQOUGYKPVJRR-UHFFFAOYSA-N nickel(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ni+3].[Ni+3] GNMQOUGYKPVJRR-UHFFFAOYSA-N 0.000 description 1
• TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
• PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
• 238000002360 preparation method Methods 0.000 description 1
• 238000003672 processing method Methods 0.000 description 1
• 239000000126 substance Substances 0.000 description 1
• 229920001187 thermosetting polymer Polymers 0.000 description 1
• HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1