JPH012388A - Printed wiring board for IC cards - Google Patents
Printed wiring board for IC cardsInfo
- Publication number
- JPH012388A JPH012388A JP62-158580A JP15858087A JPH012388A JP H012388 A JPH012388 A JP H012388A JP 15858087 A JP15858087 A JP 15858087A JP H012388 A JPH012388 A JP H012388A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- card
- base material
- cards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 23
- 239000004020 conductor Substances 0.000 claims description 22
- 229920005992 thermoplastic resin Polymers 0.000 claims description 5
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明によるＩＣカード用プリント配線板は。[Detailed description of the invention] (Industrial application field) The printed wiring board for IC cards according to the present invention is as follows.
キャッシュカード、クレジットカード、各種認識カード
、テレフォンカード、各種メモリーカードなどのＩＣカ
ードに内蔵もしくは装ｒｉされ、使用されるものである
。It is used by being built into or mounted on IC cards such as cash cards, credit cards, various recognition cards, telephone cards, and various memory cards.
（従来の技術）
従来のＩＣカード用プリント配線板の縦断面図を図１に
、斜視図を図２に示す。ここて導体パターン形成に使用
される銅箔の厚さは通常３５ｇｍあるいは７０＃Ｌｍで
ある。そのため、エツチングにより導体パターン形成後
のプリント配線板表面には３５〜７０μｍの凹凸か生じ
ることとなる。従って前記ＩＣカード用プリント配線板
をＩＣカードに内蔵もしくは装着し、ＩＣカードとした
時、］Ａ３に示す如く、カード表面には、導体パターン
の凹凸による凹凸か生じてしまう。(Prior Art) A vertical cross-sectional view of a conventional printed wiring board for an IC card is shown in FIG. 1, and a perspective view is shown in FIG. The thickness of the copper foil used for forming the conductor pattern is usually 35 gm or 70 #Lm. Therefore, the etching results in unevenness of 35 to 70 .mu.m on the surface of the printed wiring board after the conductor pattern is formed. Therefore, when the IC card printed wiring board is built into or attached to an IC card to form an IC card, as shown in A3, the surface of the card becomes uneven due to the unevenness of the conductor pattern.
（本発明か解決しようとする１１題点）ＩＣカードの表
面は、平滑であることか望まれ、３５〜７０ｇｍの導体
パターンの凹凸によるカード表面の凹凸も排除する必要
かある。これは外観上の美観によるものばかりてなく、
凹凸かあるといたずらの原因となり易いからである。つ
まり、ＩＣカード表面の凹凸を排除すれば美観か大幅に
向上すると共に、使用者の好奇心からの悪戯などによる
ＩＣカードの破壊をも大幅に防ぐことかｕ（濠となる。(11 Problems to be Solved by the Present Invention) It is desirable that the surface of the IC card be smooth, and it is also necessary to eliminate unevenness on the card surface due to unevenness of the conductor pattern of 35 to 70 gm. This is not only due to the aesthetic appearance, but also
This is because unevenness can easily cause mischief. In other words, eliminating the unevenness on the surface of the IC card will greatly improve the aesthetic appearance, and will also greatly prevent the IC card from being destroyed due to mischief caused by the user's curiosity.
本発明は従来技術において発生するそのような欠点を排
除することを目的とするものである。つまり、導体パタ
ーン形成後、導体パターンを、熱可塑性樹脂を用いたプ
リント配線板基材に埋め込んて基材表面と同一モ面にし
、ＩＣカード用プリント配線板をＩＣカードに内蔵もし
くは装着しカード化した時、カード表面の凹凸を排除し
たＩＣカード用プリント配線板を提供するものである。The present invention aims to eliminate such drawbacks occurring in the prior art. In other words, after the conductor pattern is formed, the conductor pattern is embedded in a printed wiring board base material using thermoplastic resin so that it is flush with the surface of the base material, and the printed wiring board for IC card is built into or attached to the IC card to create a card. To provide a printed wiring board for an IC card that eliminates unevenness on the surface of the card.
（問題点を解決するための手段及び作用ン以上のような
問題点を解決するために、末完！５１ではパターン形成
後、導体パターンをプリント配線板基材の中に埋め込ん
で基材表面と、導体パターンを同一平面とする方法から
成る構造を採用した。(Means and Actions for Solving the Problems) In order to solve the above-mentioned problems, Sukan! , we adopted a structure consisting of a method in which the conductor patterns are on the same plane.
以下、本発明を図面に基づいて計則に説明する。Hereinafter, the present invention will be explained in detail based on the drawings.
第４図は本発明によるＩＣカード用プリント配線板の拡
大断面図である。また第５図は本発明によるＩＣカード
用プリント配線板の斜視図である。さらに第６図は本発
明によりＩＣカード用プリント配線板を組み込んだＩＣ
カードの断面図である。これらの図において（１）はプ
リント配線板の基材で、ＡＢＳ樹脂、塩化ビニル樹脂、
ポリエチレン樹脂、アクリル樹脂、ポリカーボネート樹
脂、ポリエステル樹脂、ナイロン樹脂等の熱可塑性樹脂
からなっている。これは導体パターン（２）の形成後、
前記パターンの埋め込みを容易にするためである。この
熱可塑性樹脂基板に、パンチング、あるいはドリリング
等により、必要な半導体塔載用の穴（３）（いわゆるＤ
ｖ穴、以下この穴をＤｖ穴と略す）を加工した後、銅箔
をプレスにより接着する。そしてドライフィルム（以下
ＤＦとと略す）あるいは液体レジストなどの感光性樹脂
等によりエツチングマスクを形成し、エツチング法によ
り、必要な導体パターンを形成す漬。FIG. 4 is an enlarged sectional view of a printed wiring board for an IC card according to the present invention. Further, FIG. 5 is a perspective view of a printed wiring board for an IC card according to the present invention. Furthermore, FIG. 6 shows an IC incorporating a printed wiring board for an IC card according to the present invention.
FIG. 3 is a cross-sectional view of the card. In these figures, (1) is the base material of the printed wiring board, which is made of ABS resin, vinyl chloride resin,
It is made of thermoplastic resin such as polyethylene resin, acrylic resin, polycarbonate resin, polyester resin, and nylon resin. After forming the conductor pattern (2),
This is to facilitate embedding of the pattern. This thermoplastic resin substrate is punched or drilled into holes (3) for mounting the semiconductor (so-called D
After processing the V hole (hereinafter referred to as Dv hole), the copper foil is bonded by pressing. Then, an etching mask is formed using a photosensitive resin such as a dry film (hereinafter abbreviated as DF) or liquid resist, and a necessary conductor pattern is formed by an etching method.
以Ｌ、通常のサブトラクティブ法にて必要な導体パター
ンが形成される。Thereafter, necessary conductor patterns are formed using a normal subtractive method.
その後、導体パターンをヒートプレスし、導体パターン
表面と、熱可塑性樹脂基板表面を同一モ面になるように
埋め込む。Thereafter, the conductor pattern is heat-pressed and embedded so that the surface of the conductor pattern and the surface of the thermoplastic resin substrate are flush with each other.
なお、このＩＣカード用プリント配線板の製造にあたっ
ては、基材の両側に予めあけられた基材搬送及び位６決
め用のスプロケット穴（以下ＳＰ穴と略す）を利用して
、長尺基板を連続的に製造していく方法を採っても良い
、この方法は、製造工程の連続化、自動化が進め易く大
幅なコストダウンをならしめることかできる。In manufacturing this printed wiring board for IC cards, we use sprocket holes (hereinafter abbreviated as SP holes) for transporting and positioning the base material, which are pre-drilled on both sides of the base material, to mount the long board. A continuous manufacturing method may also be used. This method facilitates the continuity and automation of the manufacturing process and can significantly reduce costs.
（実施例）
次に、本発明の代表的な実施例を示して具体的に説明す
る。(Example) Next, typical examples of the present invention will be shown and specifically described.
実施例１
第７．８．９図においてＡＢＳ樹脂（Ｉ）（耐熱グレー
ド）をＩＣカード用プリント配配線板材とし、パンチン
グによりＤｖ穴（２）をあけた。次に銅箔（三層金属鉱
山製、商品名 ＨＴＥ箔、３５ｇｍ）を予熱後ｉｏｓ°
Ｃ１２０ｋ ｇ ｆ ／ ｃ ｍ″で２０秒間プレスし
、その後Ｄｖ穴ＩＡ側に光硬化性液体レジスト（東京応
化製、商品名 ０Ｐ−２レジストＲ３）をデイスペンサ
ーにて滴下し、さらに表側にはＤＦ（デュポン製、商品
名 Ｒ−１０１５）をラミオートした。その後、オーク
社製２０１Ｂ型露光機にて露光し、クロロセン（東亜合
成製、商品名 スリーワンＳ）て現像し、工・・ノチン
グし、ＤＦ及び液体レジストを剥膜して導体パターンを
形成した。なお、この導体パターン形成工程において、
後の導体パターン埋め込みを容易にするため、オーバー
ぎみにエツチングするのか好ましい。Example 1 In Figures 7.8.9, ABS resin (I) (heat-resistant grade) was used as a printed wiring board material for an IC card, and Dv holes (2) were punched. Next, after preheating the copper foil (manufactured by San-layer Metal Mining, product name: HTE foil, 35gm),
Press for 20 seconds at C120kg f/cm'', then drop a photocurable liquid resist (manufactured by Tokyo Ohka, trade name 0P-2 Resist R3) on the Dv hole IA side with a dispenser, and further apply DF on the front side. (manufactured by DuPont, trade name R-1015) was laminated.Then, it was exposed with a 201B type exposure machine made by Oak Co., Ltd., developed with chlorocene (manufactured by Toagosei Co., Ltd., trade name 3-One S), notched, and DF. A conductor pattern was formed by peeling off the liquid resist and the liquid resist.In addition, in this conductor pattern forming step,
It is preferable to overetch to make it easier to embed the conductor pattern later.
後に、Ｎｉ−Ａｕメツキを施し、予熱後１０５０Ｃ１２
０ｋ ｇ ｆ ／ ｃ ｍ″で３秒間プレスし、導体パ
ターンを、その表面がＡＢＳ樹脂基材表面と同一モ面に
なるように埋め込んだ。After that, Ni-Au plating was applied, and after preheating, 1050C12
Pressing was performed for 3 seconds at 0 kg f/cm'' to embed the conductive pattern so that its surface was flush with the surface of the ABS resin base material.
実施例２
第４，５．６図において塩化ビニル樹脂（１）（耐熱グ
レード）をＩＣカード用プリント配線板基材とし、パン
チングによりＤｖ穴（３）をあけた。Example 2 In Figures 4 and 5.6, vinyl chloride resin (1) (heat-resistant grade) was used as a substrate for a printed wiring board for an IC card, and Dv holes (3) were formed by punching.
次に、銅箔（【１本鉱ヱ製、商品名 ＪＴＣ箔３５ μ
ｍ ）を予熱後１１０°Ｃ１２０ｋ ｇ ｆ 、／Ｃゴ
、１ｍ／ｍｉｎにて１４−而のみロールプレスし、その
後、実施例１と同様に導体パターン （４）を形成した
。 後に、外部接続端子側に部分Ｎｉ−Ａｕメツキを施
し、ぞしてＴ−黙祷１ｉ０°Ｃ１２０ｋ ｇ ｆ ／
ｃ ｍ’、ｌ ｍ ７’ ｍ ｉ ｎてロールプレスし
、導体パターン表面かｌ！！化ビエビニル樹脂基材表面
一モ面になるように埋め込んな。Next, copper foil (manufactured by Ipponko Co., Ltd., product name JTC foil 35μ
After preheating the sample (m), it was roll pressed at 110° C., 120 kg f, /C, and 1 m/min for 14 minutes, and then a conductive pattern (4) was formed in the same manner as in Example 1. Afterwards, a partial Ni-Au plating was applied to the external connection terminal side, and then the T-silence 1i0°C120kg f/
C m', l m7' min and roll press to form the surface of the conductor pattern or l! ! Do not embed it so that it is flush with the surface of the vinyl resin base material.
実施例３
第１Ｏ１１１，１２図においてポリエステル樹脂（１）
（耐熱クレード）をＩＣカード用プリント配線板基材と
し、パンチングによりＤｖ穴（３）をあけた。次に銅箔
（日本躯業製、商品名 ＪＴＣ箔、３ｓ ｇｍ）を予熱
後１３０°Ｃ１２Ｃ１２Ｏ／ｃｒｎ’、ｌ ｍ ／ ｍ
ｉ ｎにて片面のみロールプレスし、その後、実施例
１と同様に導体パターン（２）を形成した。そしてｐ黙
祷１３０℃、２０ｋｇｆ／ ｍ ｉ ｎでロールプレス
し、導体パターンを樹脂基材の中に、基材表面と同一平
面となるように埋め込んだ。さらに、この基板において
外部接続端子部に、相当する部分にのみ、高さ約３００
１Ｌｍの突起（４）を、特開昭６２−１８７８７の如く
メツキ法にて形成した。Example 3 Polyester resin (1) in Figures 1O111 and 12
(heat-resistant clad) was used as a substrate for a printed wiring board for an IC card, and Dv holes (3) were formed by punching. Next, copper foil (manufactured by Nippon Kogyo Co., Ltd., product name JTC foil, 3s gm) was preheated to 130°C12C12O/crn', l m/m
Only one side was roll pressed in the same manner as in Example 1, and then a conductor pattern (2) was formed in the same manner as in Example 1. Then, the conductive pattern was embedded in the resin base material so as to be flush with the surface of the base material by roll pressing at 130° C. and 20 kgf/min. Furthermore, on this board, only the portion corresponding to the external connection terminal portion has a height of approximately 300 mm.
A protrusion (4) of 1 Lm was formed by a plating method as disclosed in JP-A-62-18787.
後に、外部接続端子部側に部分Ｎ １−Ａｕメツキを施
した。Afterwards, part N1-Au plating was applied to the external connection terminal side.
実施例４
第１３図において、連続状のポリカーボネート樹脂（１
）をＩＣカード用プリント配線板基材とし、まず基材両
側に、搬送及び位置決め用のＳＰ穴（５）をあけ、さら
にＤｖ穴（３）を連続的にあけた。次に銅箔（三基金属
鉱山製、商品名 ３ＥＣ箔 ３５ ｇｍ）を予熱後１３
５℃、２０ｋｇｆ／ｃｍ’、 １ ｍ／ ｍ ｉ ｎ
にて片面のみロールプレスし、その後、実施例１と同様
に導体パターン（２）を連続的に形成した。さらに、こ
の基板において外部接続端子部に相当する部分のみに高
さ約１３０ＪＬｍの突起（４）を連続的に形成した。Example 4 In FIG. 13, a continuous polycarbonate resin (1
) was used as a printed wiring board base material for an IC card, and SP holes (5) for conveyance and positioning were first drilled on both sides of the base material, and then Dv holes (3) were continuously drilled on both sides of the base material. Next, after preheating copper foil (manufactured by Sanki Metal Mine, product name 3EC foil 35 gm),
5℃, 20kgf/cm', 1 m/min
Only one side was roll pressed, and then a conductor pattern (2) was continuously formed in the same manner as in Example 1. Furthermore, a protrusion (4) with a height of about 130 JLm was continuously formed on this substrate only in a portion corresponding to the external connection terminal portion.
後に、Ｎ ｔ Ａ ｕメツキを、外部接続端子側に施
し、そしテ’ｆ ｍ 後１３５°Ｃ１２０ｋ ｇ ｆ
、／ｃｍ’、 Ｌ ｍ／′ｍ ｉ ｎてロールプレス
し、外部接続端子部以外の導体パターンを樹脂基材の中
に、基材表面と同−平面になるように埋め込んだ。After that, apply N t Au plating to the external connection terminal side, and then heat at 135°C 120kg g f
, /cm', L m/'min, and the conductor pattern other than the external connection terminal portion was embedded in the resin base material so as to be flush with the surface of the base material.
（充用の効果）
以上のように、本発明のＩＣカード用プリント配線板に
よれば、それをカード内に内蔵もしくは装着し、ＩＣカ
ードとした時、その表面は、極めてモ滑なものとなり、
非常に芙観の優れたカードとなるばかりか、使用者の好
奇心からの悪戯などによるＩＣカードの破壊をも大幅に
防ぐことがムｆ１をとなる。(Effects of Application) As described above, according to the printed wiring board for IC cards of the present invention, when it is built into or attached to a card to form an IC card, its surface becomes extremely smooth.
Not only is it a very good card to see, but it also greatly prevents the IC card from being destroyed due to mischief caused by the user's curiosity.
また、前記ＩＣカー１く用プリント配線板の外部接続端
子部のみ厚みを厚く４−ることによつ、ＩＣカード用プ
リント配線板を内蔵もしくは装着しＩＣカードにした時
、ＩＣカード表面と外部接続端子部表面を同一平面にす
ることができ、接点の信頼性も犬きく向上することとな
る。In addition, by making only the external connection terminal part of the IC card printed wiring board thicker, when the IC card printed wiring board is built in or installed to form an IC card, the surface of the IC card and the external The surfaces of the connection terminal portions can be made on the same plane, and the reliability of the contacts is greatly improved.
さらに、このＩＣカード用プリント配線板の製盾にあた
って１店材の両側に予めあけられたＳＰ穴を利用１ノ、
製造工程を連続化、自動化することにより、大幅なコス
トダウンがｒｊｆ能となるゆFurthermore, when making the shield for this printed wiring board for IC cards, SP holes pre-drilled on both sides of the material were used.
By making the manufacturing process continuous and automated, it is possible to significantly reduce costs.
第１１ｍは従来のＩＣカード用プリント配線板の縦断面
図、第２図は従来のＩＣカード用プリント配配線板斜視
図、第３ ｔ２ｊは従来のＩＣカード用プリント配線板
を用いたＩＣカードのＲ断面図、第４ ｒ′ｆＡ、第７
図、第１０図は本発明によるＩＣカード用プリント配鰺
板の縦断面図、第５図、第８ ｒ：ｉ 、第１１図、ｔ
ｆＳｌ ３図は本発す１によるＩＣカード川用リント配
ｔ＆扱の斜視図、第６図、第９図、第１２図は本発明に
よるＩｃカード用プリント配線板を用いたＩＣカードの
縦断面［Ａ。
符 号 の 説 明
（１）・・・プリント配線板基材、（２）・・・Ｄｖ穴
、（３）・・・導体パターン、 （４）・・・外部接続
端子部、（５）−・・ｓｐ穴、（６）・・・半導体、（
７）・・・ＩＣカード。
（以 ト）11m is a vertical cross-sectional view of a conventional printed wiring board for IC cards, FIG. 2 is a perspective view of a conventional printed wiring board for IC cards, and 3rd t2j is a diagram of an IC card using a conventional printed wiring board for IC cards. R sectional view, 4th r'fA, 7th
10 are longitudinal cross-sectional views of the printed plate for IC cards according to the present invention, FIG. 5, FIG. 8 r:i, FIG. 11, t.
Figure 3 is a perspective view of IC card lint distribution and handling according to 1 of the present invention, and Figures 6, 9, and 12 are longitudinal cross-sections of an IC card using the printed wiring board for IC cards according to the present invention. A. Explanation of symbols (1)... Printed wiring board base material, (2)... Dv hole, (3)... Conductor pattern, (4)... External connection terminal section, (5) - ...sp hole, (6)...semiconductor, (
7)...IC card. (below)
Claims (1)
ド用プリント配線板において、プリント配線板基材が熱
可塑性樹脂からなり、導体パターン形成後、前記パター
ンをプリント配線板基材の中に埋め込み、導体パターン
表面を基材表面と同一平面にして成ることを特徴とする
ＩＣカード用プリント配線板。 ２）．前記ＩＣカード用プリント配線板において、外部
接続端子部のみ他の導体パターンより厚みが厚くされ、
基材表面から突出形成されていることを特徴とする特許
請求の範囲第１項記載のＩＣカード用プリント配線板。 ３）．前記ＩＣカード用プリント配線板において、リー
ル状基材の両端に予めあけられた、基材搬送及び位置決
め用のスプロケット穴を用いて、連続的に形成されて成
ることを特徴とする特許請求の範囲第１項あるいは第２
項記載のＩＣカード用プリント配線板。[Claims] 1). In a printed wiring board for an IC card that is built in or attached to an IC card, the printed wiring board base material is made of thermoplastic resin, and after the conductor pattern is formed, the pattern is embedded in the printed wiring board base material, and the conductive pattern surface is A printed wiring board for an IC card, characterized in that the printed wiring board is formed on the same plane as the surface of a base material. 2). In the IC card printed wiring board, only the external connection terminal portion is thicker than other conductor patterns,
The printed wiring board for an IC card according to claim 1, wherein the printed wiring board is formed to protrude from the surface of the base material. 3). Claims characterized in that, in the printed wiring board for IC cards, sprocket holes for conveying and positioning the base material are formed in advance at both ends of the reel-shaped base material to continuously form the sprocket holes. 1st term or 2nd term
Printed wiring board for IC cards as described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62158580A JP2652163B2 (en) | 1987-06-25 | 1987-06-25 | Printed wiring board for IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62158580A JP2652163B2 (en) | 1987-06-25 | 1987-06-25 | Printed wiring board for IC card |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH012388A true JPH012388A (en) | 1989-01-06 |
| JPS642388A JPS642388A (en) | 1989-01-06 |
| JP2652163B2 JP2652163B2 (en) | 1997-09-10 |
Family
ID=15674793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62158580A Expired - Lifetime JP2652163B2 (en) | 1987-06-25 | 1987-06-25 | Printed wiring board for IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2652163B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2583539B2 (en) * | 1987-12-05 | 1997-02-19 | 新光電気工業株式会社 | Circuit board and its manufacturing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59140459U (en) * | 1983-03-09 | 1984-09-19 | 日本電気株式会社 | Rolled flexible printed circuit board |
| JPS6055691A (en) * | 1983-09-07 | 1985-03-30 | ダイソー株式会社 | Conductive pattern forming unit of circuit board |
-
1987
- 1987-06-25 JP JP62158580A patent/JP2652163B2/en not_active Expired - Lifetime
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