JP2652163B2 - Printed wiring board for IC card - Google Patents
Printed wiring board for IC cardInfo
- Publication number
- JP2652163B2 JP2652163B2 JP62158580A JP15858087A JP2652163B2 JP 2652163 B2 JP2652163 B2 JP 2652163B2 JP 62158580 A JP62158580 A JP 62158580A JP 15858087 A JP15858087 A JP 15858087A JP 2652163 B2 JP2652163 B2 JP 2652163B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- wiring board
- printed wiring
- conductor pattern
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明によるICカード用プリント配線板は、キャッシ
ュカード、クレジットカード、各種認識カード、テレフ
ォンカード、各種メモリーカードなどのICカードに内蔵
もしくは装着され、使用されるものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial application field) A printed wiring board for an IC card according to the present invention is built in or mounted on an IC card such as a cash card, a credit card, various recognition cards, a telephone card, and various memory cards. , What is used.
（従来の技術） 従来のICカード用プリント配線板の縦断面図を図１
に、斜視図を図２に示す。ここで導体パターン形成に使
用される銅箔の厚さは通常35μｍあるいは70μｍであ
る。そのため、エッチングにより導体パターン形成後の
プリント配線板表面には35〜70μｍの凹凸が生じること
となる。従って前記ICカード用プリント配線板をICカー
ドに内蔵もしくは装着し、ICカードとした時、図３に示
す如く、カード表面には、導体パターンの凹凸による凹
凸が生じてしまう。(Prior Art) FIG. 1 is a longitudinal sectional view of a conventional printed wiring board for an IC card.
FIG. 2 shows a perspective view. Here, the thickness of the copper foil used for forming the conductor pattern is usually 35 μm or 70 μm. For this reason, the surface of the printed wiring board after the formation of the conductor pattern by etching causes irregularities of 35 to 70 μm. Therefore, when the printed wiring board for an IC card is built in or mounted on the IC card to form an IC card, as shown in FIG. 3, irregularities due to irregularities of the conductor pattern are generated on the card surface.
（本発明が解決しようとする問題点） ICカードの表面は、平滑であることが望まれ、35〜37
μｍの導体パターンの凹凸によるカード表面の凹凸も排
除する必要がある。これは外観上の美観によるものばか
りでなく、凹凸があるといたずらの原因となり易いから
である。つまり、ICカード表面の凹凸を排除すれば美観
が大幅に向上すると共に、使用者の好奇心からの悪戯な
どによるICカードの破壊をも大幅に防ぐことかが可能と
なる。(Problems to be Solved by the Present Invention) The surface of the IC card is desired to be smooth,
It is also necessary to eliminate irregularities on the card surface due to irregularities in the conductive pattern of μm. This is because not only the appearance but also the irregularities are likely to cause mischief. In other words, eliminating the irregularities on the surface of the IC card greatly improves the aesthetic appearance, and also makes it possible to largely prevent the destruction of the IC card due to mischief from the curiosity of the user.
本発明は従来技術において発生するそのような欠点を
排除することを目的とするものである。つまり、導体パ
ターン形成後、導体パターンを、熱可塑性樹脂を用いた
プリント配線板基材に埋め込んで基材表面と同一平面に
し、ICカード用プリント配線板をICカードに内蔵もしく
は装着しカード化した時、カード表面の凹凸を排除した
ICカード用プリント配線板を提供するものである。The present invention aims to eliminate such disadvantages that occur in the prior art. In other words, after the formation of the conductor pattern, the conductor pattern was embedded in a printed wiring board base material using a thermoplastic resin to be flush with the surface of the base material, and the printed wiring board for the IC card was built into or attached to the IC card to form a card. Time, eliminating irregularities on the card surface
A printed wiring board for an IC card is provided.
（問題点を解決するための手段及び作用） 以上のような問題点を解決するために、本発明では、
ICカード内に内蔵もしくは装着されるICカード用プリン
ト配線板において、 穴部を有する熱可塑性樹脂からなるプリント配線板基
材と、 このプリント配線板基材に設けられ前記穴部に臨む導
体パターン及びこの導体パターンの表面に形成されたNi
−Auメッキとを備え、 前記導体パターン及びNi−Auメッキをプリント配線板
基材の中に埋め込み、導体パターンの表面に形成された
前記Ni−Auメッキの表面を基材表面と同一平面にして成
る構造を採用した。(Means and Actions for Solving the Problems) In order to solve the above problems, in the present invention,
In a printed wiring board for an IC card incorporated or mounted in an IC card, a printed wiring board base material made of a thermoplastic resin having a hole, a conductor pattern provided on the printed wiring board base and facing the hole, and Ni formed on the surface of this conductor pattern
-Au plating, the conductor pattern and Ni-Au plating are embedded in a printed wiring board substrate, and the surface of the Ni-Au plating formed on the surface of the conductor pattern is made flush with the surface of the substrate. Structure was adopted.
以下、本発明を図面に基づいて詳細に説明する。 Hereinafter, the present invention will be described in detail with reference to the drawings.
第４図は本発明によるICカード用プリント配線板の拡
大断面図である。また第５図は本発明によるICカード用
プリント配線板の斜視図である。さらに第６図は本発明
によりICカード用プリト配線板を組み込んだICカードの
断面図である。これらの図において（１）はプリント配
線板の基材で、ABS樹脂、塩化ビニル樹脂、ポリエチレ
ン樹脂、アクリル樹脂、ポリカーボネート樹脂、ポリエ
ステル樹脂、ナイロン樹脂等の熱可塑性樹脂からなって
いる。これは導体パターン（２）の形成後、前記パター
ンの埋め込みを容易にするためである。この熱可塑性樹
脂基板に、パンチング、あるいはドリリング等により、
必要な半導体搭載用の穴（２）（いわゆるDv穴、以下こ
の穴をDv穴と略す）を加工した後、銅箔をプレスにより
接着する。そしてドライフィルム（以下DFと略す）ある
いは液体レジストなどの感光性樹脂等によりエッチング
マスクを形成し、エッチング法により、必要な導体パタ
ーンを形成する。FIG. 4 is an enlarged sectional view of a printed wiring board for an IC card according to the present invention. FIG. 5 is a perspective view of a printed wiring board for an IC card according to the present invention. FIG. 6 is a cross-sectional view of an IC card incorporating a pre-wiring board for an IC card according to the present invention. In these figures, (1) is a substrate of a printed wiring board, which is made of a thermoplastic resin such as an ABS resin, a vinyl chloride resin, a polyethylene resin, an acrylic resin, a polycarbonate resin, a polyester resin, and a nylon resin. This is for facilitating the embedding of the conductor pattern (2) after the formation. By punching or drilling on this thermoplastic resin substrate,
After processing necessary semiconductor mounting holes (2) (so-called Dv holes, hereinafter, these holes are abbreviated as Dv holes), a copper foil is bonded by pressing. Then, an etching mask is formed by a dry film (hereinafter abbreviated as DF) or a photosensitive resin such as a liquid resist, and a necessary conductor pattern is formed by an etching method.
以上、通常のサブトラクティブ法にて必要な導体パタ
ーンが形成される。As described above, the necessary conductor pattern is formed by the ordinary subtractive method.
その後、導体パターンをヒートプレスし、導体パター
ン表面と、熱可塑性樹脂基板表面を同一平面になるよう
に埋め込む。Thereafter, the conductor pattern is heat-pressed, and the surface of the conductor pattern and the surface of the thermoplastic resin substrate are embedded so as to be flush with each other.
なお、このICカード用プリント配線板の製造にあたっ
ては、基材の両側に予めあけられた基材搬送及び位置決
め用のスプロケット穴（以下SP穴と略す）を利用して、
長尺基板を連続的に製造していく方法を採っても良い。
この方法は、製造工程の連続化、自動化が進め易く大幅
なコストダウンをならしめることができる。In the manufacture of this printed wiring board for IC cards, sprocket holes (hereinafter abbreviated as SP holes) for base material transport and positioning, which are preliminarily formed on both sides of the base material, are used.
A method of continuously manufacturing a long substrate may be employed.
According to this method, the continuation and automation of the manufacturing process can be easily performed, and the cost can be significantly reduced.
（実施例） 次に、本発明の代表的な実施例を示して具体的に説明
する。(Example) Next, a typical example of the present invention will be shown and specifically described.
実施例１ 第７、８、９図においてABS樹脂（１）（耐熱性グレ
ード）をICカード用プリント配線板基材とし、パンチン
グによりDv穴（２）をあけた。次に銅箔（三井金属鉱山
製、商品名、HTE箔、35μｍ）を予熱後105℃、20kgf/cm
2で20秒間プレスし、その後Dv穴裏側に光硬化性液体レ
ジスト（東京応化製、商品名 OP−２レジストRS）をデ
ィスペンサーにて滴下し、さらに表側にはDF（デェポン
製、商品名 Ｒ−1015）をラミネートした。その後、オ
ーク社製201B型露光機にて露光し、クロロセン（東亜合
成製、商品名 スリーワンＳ）で現像し、エッチング
し、DF及び液体レジストを剥膜して導体パターンを形成
した。なお、この導体パターン形成工程において、後の
導体パターン埋め込みを容易にするため、オーバーぎみ
にエッチングするのが好まいし。Example 1 In FIGS. 7, 8, and 9, an ABS resin (1) (heat-resistant grade) was used as a printed wiring board base material for an IC card, and a Dv hole (2) was formed by punching. Next, preheat copper foil (Mitsui Metal Mining, trade name, HTE foil, 35μm) to 105 ℃, 20kgf / cm
2 for 20 seconds, and then a photo-curable liquid resist (trade name: OP-2 Resist RS, manufactured by Tokyo Ohka Co., Ltd.) was dropped on the back side of the Dv hole with a dispenser, and DF (trade name: R-D-made) was further applied to the front side. 1015) was laminated. Thereafter, exposure was carried out using a 201B type exposure machine manufactured by Oak Co., Ltd., developed with chlorocene (manufactured by Toagosei Co., Ltd., three one S), etched, and DF and liquid resist were stripped to form a conductor pattern. In this conductor pattern forming step, it is preferable to perform overetching in order to facilitate later embedding of the conductor pattern.
後に、Ni−Auメッキを施し、予熱後105℃、20kgf/cm2
で３秒間プレスし、導体パターンを、その表面がABS樹
脂基材表面と同一平面になるように埋め込んだ。Later, Ni-Au plating is applied, and after preheating 105 ° C, 20 kgf / cm 2
For 3 seconds, and the conductor pattern was embedded so that its surface was flush with the surface of the ABS resin base material.
（発明の効果） 以上のように、本発明のICカード用プリント配線板に
よれば、それをカード内蔵もしくは装着し、ICカードと
した時、導体パターン表面にNi−Auメッキが施された構
造でありながらも、その方面は極めて平滑なものとな
る。(Effects of the Invention) As described above, according to the printed wiring board for an IC card of the present invention, when the IC card is built into or mounted on the card to form an IC card, the surface of the conductive pattern is plated with Ni-Au. However, the direction becomes extremely smooth.
しかも、上記導体パターンがDv穴やボンディングボー
ルに突出あるいは橋渡しされた薄物構造であっても、基
材と導体パターンとの密着強度が極めて選れたICカード
を提供することができるICカード用プリント配線板をで
ある。Moreover, even if the conductor pattern has a thin structure in which the conductor pattern protrudes or is bridged by a Dv hole or a bonding ball, it is possible to provide an IC card in which the adhesion strength between the base material and the conductor pattern is extremely selected. Wiring board.
第１図は従来のICカード用プリント配線板の縦断面図、
第２図は従来ICカード用プリント配線板の斜視図、第３
図は従来のICカード用プリント配線板を用いたICカード
の縦断面図、第４図、第７図は本発明によるICカード用
プリント配線板の縦断面図、第５図、第８図は本発明に
よるICカード用プリント配線板の斜視図、第６図、第９
図は本発明によるICカード用プリント配線板を用いたIC
カードの縦断面図。 符号の説明 （１）……プリント配線板基材、（２）……Dv穴、 （３）……導体パターン、 （６）……半導体、 （７）……ICカード。FIG. 1 is a longitudinal sectional view of a conventional printed wiring board for an IC card,
FIG. 2 is a perspective view of a conventional printed wiring board for an IC card, and FIG.
FIG. 1 is a longitudinal sectional view of an IC card using a conventional printed circuit board for an IC card, FIGS. 4 and 7 are longitudinal sectional views of a printed circuit board for an IC card according to the present invention, FIGS. FIG. 6 is a perspective view of a printed wiring board for an IC card according to the present invention.
The figure shows an IC using a printed wiring board for IC cards according to the present invention.
FIG. Explanation of reference numerals (1) ... printed wiring board base material, (2) ... Dv hole, (3) ... conductor pattern, (6) ... semiconductor, (7) ... IC card.
Claims (1)
ード用プリント配線板において、 穴部を有する熱可塑性樹脂からなるプリント配線板基材
と、 このプリント配線板基材に設けられ前記穴部に臨む導体
パターン及びこの導体パターンの表面に形成されたNi−
Auメッキとを備え、 前記導体パターン及びNi−Auメッキをプリント配線板基
材の中に埋め込み、導体パターンの表面に形成された前
記Ni−Auメッキの表面を基材表面と同一平面にして成る
ことを特徴とするICカード用プリント配線板。1. A printed wiring board for an IC card incorporated or mounted in an IC card, comprising: a printed wiring board base made of a thermoplastic resin having a hole; and the hole provided in the printed wiring board base. Conductor pattern facing Ni and Ni- formed on the surface of this conductor pattern
With Au plating, the conductor pattern and Ni-Au plating are embedded in a printed wiring board substrate, and the surface of the Ni-Au plating formed on the surface of the conductor pattern is made flush with the substrate surface. A printed wiring board for an IC card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62158580A JP2652163B2 (en) | 1987-06-25 | 1987-06-25 | Printed wiring board for IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62158580A JP2652163B2 (en) | 1987-06-25 | 1987-06-25 | Printed wiring board for IC card |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH012388A JPH012388A (en) | 1989-01-06 |
| JPS642388A JPS642388A (en) | 1989-01-06 |
| JP2652163B2 true JP2652163B2 (en) | 1997-09-10 |
Family
ID=15674793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62158580A Expired - Lifetime JP2652163B2 (en) | 1987-06-25 | 1987-06-25 | Printed wiring board for IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2652163B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2583539B2 (en) * | 1987-12-05 | 1997-02-19 | 新光電気工業株式会社 | Circuit board and its manufacturing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59140459U (en) * | 1983-03-09 | 1984-09-19 | 日本電気株式会社 | Rolled flexible printed circuit board |
| JPS6055691A (en) * | 1983-09-07 | 1985-03-30 | ダイソー株式会社 | Conductive pattern forming unit of circuit board |
-
1987
- 1987-06-25 JP JP62158580A patent/JP2652163B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS642388A (en) | 1989-01-06 |
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