JPH01236675A - Optical semiconductor device - Google Patents
Optical semiconductor deviceInfo
- Publication number
- JPH01236675A JPH01236675A JP63064225A JP6422588A JPH01236675A JP H01236675 A JPH01236675 A JP H01236675A JP 63064225 A JP63064225 A JP 63064225A JP 6422588 A JP6422588 A JP 6422588A JP H01236675 A JPH01236675 A JP H01236675A
- Authority
- JP
- Japan
- Prior art keywords
- package
- welding
- main surface
- semiconductor device
- optical semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 14
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000005357 flat glass Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000000098 azimuthal photoelectron diffraction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Semiconductor Lasers (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、光半導体装置に係り、特にそのキャンの取
付は構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an optical semiconductor device, and particularly relates to the structure of mounting a can thereon.
（従来の技術〕
第２図は従来のキャンの構成を示す図であり、第３図、
第４図は従来の光半導体装置の断面図を示すものである
。これらの図において、１はレーザダイオードチップ（
通称、ＬＤチップ）で、熱伝導性の良い放熱用ブロック
２に半田付けされ、この放熱用ブロック２を介して、パ
ッケージ８の主面に対し、ＬＤチップ１より放射される
レーザ光１３を上方へ取り出すようにマウントされる。(Prior art) Fig. 2 is a diagram showing the configuration of a conventional can, and Fig. 3 is a diagram showing the configuration of a conventional can.
FIG. 4 shows a cross-sectional view of a conventional optical semiconductor device. In these figures, 1 is a laser diode chip (
The laser beam 13 emitted from the LD chip 1 is soldered to a heat dissipation block 2 with good thermal conductivity, and the laser beam 13 emitted from the LD chip 1 is directed upward to the main surface of the package 8 through the heat dissipation block 2. It is mounted so that it can be taken out.
ＬＤチップ１の後方より放射されるレーザ光１３′をモ
ニタするために、パッケージ８の主面に、図のごとくモ
ニタ用のフォトダイオード（通称、ＰＤチップ）がマウ
ントされる。パッケージ８には、電気的に絶縁されたリ
ード４と５．電気的に導通されたり−ド６が接続されて
おり、図示のように、金ワイヤ７により、所望の極性を
得ている。パッケージ８の主面には、キャン１０がこの
キャン１ｏのフランジ１４を介して、ＬＤチップ１を被
うように溶接さる。キャン１ｏの中央部は開口されてお
り、ＬＤチップ１の前方より放射されるレーザ光１３を
取り出すために、透明な窓ガラス１１が接着剤１２によ
り取り付けられている。これによりＬＤチップ１は外部
とは遮断され、機密封止されている。In order to monitor the laser beam 13' emitted from the rear of the LD chip 1, a monitoring photodiode (commonly known as a PD chip) is mounted on the main surface of the package 8 as shown in the figure. The package 8 includes electrically insulated leads 4 and 5. The electrode 6 is electrically conductive and connected, and the desired polarity is obtained by a gold wire 7, as shown. A can 10 is welded to the main surface of the package 8 so as to cover the LD chip 1 via the flange 14 of the can 1o. The center of the can 1o is open, and a transparent window glass 11 is attached with an adhesive 12 in order to take out the laser beam 13 emitted from the front of the LD chip 1. As a result, the LD chip 1 is isolated from the outside and hermetically sealed.
パッケージ８には、第３図、第４図に示すように、パッ
ケージ８の主面に段差を有するものと無いものがあり、
キャン１０を溶接する上では、当該段差は、キャン１０
の位置決めガイドになり、キャッピングが容易に行える
反面、パッケージコストが高くなるデメリットがある。As shown in FIGS. 3 and 4, the packages 8 include those that have a step on the main surface and those that do not.
When welding the can 10, the step is
Although it can be used as a positioning guide and capping can be easily performed, it has the disadvantage of increasing packaging cost.
キャン１０をパッケージ８の主面に溶接する場合、キャ
ン１０の溶接飛びの問題がある。第３図のようにパッケ
ージ８の主面にキャン１０の位置ガイド用の段差がある
場合には、キャン１０の溶接飛びが内部の素子に付着す
ることはないが、パッケージ８の主面のキャン１０の外
部に付着することはあり、光ピツクアップに素子を組み
込んで、パッケージ８の主面を位置決めする上で問題と
なる。When welding the can 10 to the main surface of the package 8, there is a problem that the can 10 may skip welding. If there is a step on the main surface of the package 8 to guide the position of the can 10 as shown in FIG. It may adhere to the outside of the package 10, which poses a problem when installing the device in the optical pickup and positioning the main surface of the package 8.
一方、第４図のように、パッケージコストを下げる薄形
、超小型化を目的として、パッケージ８の主面に段差の
ないパッケージの場合には、キャン１０の溶接時の溶接
飛びがキャン１０の内部。On the other hand, as shown in FIG. 4, in the case of a package with no steps on the main surface of the package 8 for the purpose of reducing the package cost and making it thinner and ultra-compact, the weld skip when welding the can 10 is lower than that of the can 10. internal.
外部に発生することがあり、素子の信頼性上重大な問題
がある。This can occur externally, causing serious problems in terms of device reliability.
この問題を解決するために、第２図のように、キャン１
０のフランジ１４部分に突起リング（通称、プロジェク
ションリング）１５を設け、溶接時のキャン１０へ溶接
飛びを防止していたが、完全なものではなかった。In order to solve this problem, as shown in Figure 2,
A protrusion ring (commonly known as a projection ring) 15 was provided on the flange 14 of the weld to prevent welding from flying to the can 10 during welding, but this was not perfect.
上記のように構成された従来の光半導体装置は、キャン
１０をパッケージ８に溶接する際の、キャン１ｏの溶接
飛びを完全には防止しきれず、素子の信頼性上大きな問
題点となっていた。In the conventional optical semiconductor device configured as described above, it was not possible to completely prevent the can 1o from flying when welding the can 10 to the package 8, which caused a major problem in terms of device reliability. .
この発明は、上記のような問題点を解消するためになさ
れたもので、キャンの溶接時の溶接飛びを完全に防止で
き、高信頼度性の光半導体装置を得ることを目的とする
。The present invention was made to solve the above-mentioned problems, and an object of the present invention is to completely prevent weld skipping during can welding and to obtain a highly reliable optical semiconductor device.
この発明に係る光半導体装置は、パッケージの主面のキ
ャンを溶接する位置に、キャンのフランジ部分が嵌合す
るリング状の溝を形成したものである。In the optical semiconductor device according to the present invention, a ring-shaped groove into which the flange portion of the can fits is formed at the position where the can is welded on the main surface of the package.
この発明においては、キャンを位置決め固定するための
リング状の溝を形成したことから、このリング状の溝が
キャンのキャッピング溶接時の位置合わせガイドとして
作用するとともに、主たる目的のキャン溶接時の溶接飛
びが、リング状の溝の段差により完全に抑えられる。In this invention, since a ring-shaped groove is formed to position and fix the can, this ring-shaped groove acts as a positioning guide during can capping welding, and also serves as a welding guide during can welding, which is the main purpose. Flying is completely suppressed by the step of the ring-shaped groove.
以下、この発明の一実施例を図面について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図はこの発明の一実施例を示す光半導体装置の断面
図である。この光半導体装置の構成は、 −第３図、第
４図に示したものと同じであるが、この発明においては
、パッケージ８の主面に、キャン１０のフランジ１４の
幅よりも少し大きめのリング状の溝９が形成されている
。FIG. 1 is a sectional view of an optical semiconductor device showing an embodiment of the present invention. The configuration of this optical semiconductor device is the same as that shown in FIGS. A ring-shaped groove 9 is formed.
上記のように、パッケージ８の主面に、キャン１０のフ
ランジ１４の幅よりも少し大きめの溝９をパッケージ８
の中心に対しリング状に形成しているために、キャン１
０の溶接時に発生する溶接飛びを溝９部分で完全に吸収
できる。As mentioned above, a groove 9 slightly larger than the width of the flange 14 of the can 10 is formed on the main surface of the package 8.
Can 1
The groove 9 part can completely absorb the weld skip that occurs when welding 0.
したがって、この発明によるパッケージであれば、従来
のようにキャン１０のフランジ１４部分に突起リングを
形成する必要もなく、キャン１０の製造コストを安くす
ることができる。Therefore, with the package according to the present invention, there is no need to form a protrusion ring on the flange 14 portion of the can 10 as in the conventional case, and the manufacturing cost of the can 10 can be reduced.
なお、上記実施例では、半導体レーザ装置について説明
したが、ＬＥＤの発光装置を始め、ＰＤ、ＡＰＤ等の受
光装置でも同様の効果が得られる。In the above embodiments, a semiconductor laser device has been described, but similar effects can be obtained with light-emitting devices such as LEDs, as well as light-receiving devices such as PDs and APDs.
〔発明の効果）
以上説明したようにこの発明は、パッケージの主面に、
キャンを溶接する際のキャンの溶接飛びを完全に防止す
るために、パッケージの主面のキャンを溶接する位置に
、キャンのフランジ部分が嵌合するリング状の溝を形成
したので、パッケージの主面にキャンを位置決めする段
差のあるパッケージや、コストダウン、小型、薄型を目
的としたパッケージの主面に段差のないパッケージ等に
おいても、このリング状の溝を形成することによリキャ
ン溶接時の溶接飛びを確実に防止でき、信頼性の高い素
子が得られる。[Effects of the Invention] As explained above, the present invention has a structure in which the main surface of the package is
In order to completely prevent the can from flying when welding the can, a ring-shaped groove into which the flange of the can fits is formed on the main surface of the package at the position where the can is welded. By forming this ring-shaped groove, it is possible to form this ring-shaped groove for packages that have a step on the surface to position the can, or for packages that have no step on the main surface of the package aimed at reducing cost, compactness, and thinness. Weld skipping can be reliably prevented and a highly reliable element can be obtained.
また、この発明のパッケージを用いれば、突起リングは
なくてもよく、さらに、リング状の溝は、キャンのパッ
ケージに対する位置合わせ用ガイドとして作用すること
から、キャンの位置精度のばらつきを十分に抑制できる
効果が得られる。Furthermore, if the package of the present invention is used, there is no need for a protruding ring, and furthermore, since the ring-shaped groove acts as a guide for positioning the can with respect to the package, variations in the positional accuracy of the can can be sufficiently suppressed. You can get the desired effect.
第１図はこの発明の一実施例を示す光半導体装置の断面
図、第２図は従来のキャンの断面図、第３図、第４図は
従来の光半導体装置を示す断面図である。
図において、１はレーザダイオードチップ、２は放熱用
ブロック、３はフォトダイオードチップ、４，５．６は
リード、７は金ワイヤ、８はパッケージ、９はパッケー
ジの主面に設けられたリング状の溝、１０はキャン、１
１は窓ガラス、１２は接着剤、１３．１３’ はレーザ
光、１４はキャンのフランジである。
なお、各図中の同一符号は同一または相当部分を示す。
代理人 大 岩 増 雄 （外２名）策１図
第２図
１？
第３図
）Ａ１３FIG. 1 is a sectional view of an optical semiconductor device showing an embodiment of the present invention, FIG. 2 is a sectional view of a conventional can, and FIGS. 3 and 4 are sectional views of a conventional optical semiconductor device. In the figure, 1 is a laser diode chip, 2 is a heat dissipation block, 3 is a photodiode chip, 4, 5.6 are leads, 7 is a gold wire, 8 is a package, and 9 is a ring shape provided on the main surface of the package. groove, 10 is can, 1
1 is a window glass, 12 is an adhesive, 13.13' is a laser beam, and 14 is a flange of a can. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa (2 others) Plan 1 Figure 2 Figure 1? Figure 3) A13
Claims (1)
、前記パッケージの主面に対し上方へ発光する発光素子
と、この発光素子を被うように前記パッケージの主面に
溶接されたキャンとを有し、かつ前記キャンの中央部に
前記発光素子の光を上方へ取り出す透明な窓ガラスを備
えた光半導体装置において、前記パッケージの主面に、
前記キャンを位置決め固定するリング状の溝を設けたこ
とを特徴とする光半導体装置。The package includes a light emitting element fixed to the main surface of the package via a heat dissipation block and emitting light upward with respect to the main surface of the package, and a can welded to the main surface of the package so as to cover the light emitting element. and an optical semiconductor device comprising a transparent window glass in the center of the can for extracting light from the light emitting element upward, the main surface of the package having:
An optical semiconductor device comprising a ring-shaped groove for positioning and fixing the can.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63064225A JPH01236675A (en) | 1988-03-16 | 1988-03-16 | Optical semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63064225A JPH01236675A (en) | 1988-03-16 | 1988-03-16 | Optical semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01236675A true JPH01236675A (en) | 1989-09-21 |
Family
ID=13251949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63064225A Pending JPH01236675A (en) | 1988-03-16 | 1988-03-16 | Optical semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01236675A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009116133A1 (en) * | 2008-03-18 | 2009-09-24 | 三菱電機株式会社 | Laser light source module |
-
1988
- 1988-03-16 JP JP63064225A patent/JPH01236675A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009116133A1 (en) * | 2008-03-18 | 2009-09-24 | 三菱電機株式会社 | Laser light source module |
| US8391326B1 (en) | 2008-03-18 | 2013-03-05 | Mitsubishi Electric Corporation | Laser light source module |
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