JPH01236263A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPH01236263A
JPH01236263A JP6189388A JP6189388A JPH01236263A JP H01236263 A JPH01236263 A JP H01236263A JP 6189388 A JP6189388 A JP 6189388A JP 6189388 A JP6189388 A JP 6189388A JP H01236263 A JPH01236263 A JP H01236263A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
filler
weight
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6189388A
Other languages
Japanese (ja)
Other versions
JPH07107122B2 (en
Inventor
Koichi Tanaka
孝一 田中
Naoki Mogi
直樹 茂木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP6189388A priority Critical patent/JPH07107122B2/en
Publication of JPH01236263A publication Critical patent/JPH01236263A/en
Publication of JPH07107122B2 publication Critical patent/JPH07107122B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain an epoxy resin composition prevented from being cracked by a soldering stress and improved in heat resistance, by mixing an epoxy resin with a curing agent, a cure accelerator and a specified filler. CONSTITUTION:An epoxy resin (A) is mixed with a curing agent (B) (e.g., phenol novolac) and a cure accelerator (C) (e.g., diazabicycloundecene) in an equivalent ratio of the epoxy groups of component A to the hydroxyl groups of component B of 0.5-5, and the obtained mixture is further mixed with 50-90wt.% filler (D) containing 10-100wt.% secondary agglomerates of silica powder of a mean particle diameter of 20-60mum, an apparent density of 0.1-0.6g/cc and a specific surface area <=5m<3>/g.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、耐半田ストレス性に優れた、電子部品等の対
土用エポキシ樹脂組成物に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an epoxy resin composition for use with soil, such as electronic parts, which has excellent solder stress resistance.

〔従来技術〕[Prior art]

従来、ダイオード、トランジスタ、集積回路等の電子部
品を熱硬化性樹脂で封止しているが、特に集積回路では
耐熱性、耐湿性に優れた0−タレゾールノボラックエポ
キシ樹脂をノボラック型フェノール樹脂で硬化させたエ
ポキシ樹脂が用いられている。
Conventionally, electronic components such as diodes, transistors, and integrated circuits are sealed with thermosetting resins, but especially for integrated circuits, 0-talesol novolac epoxy resin, which has excellent heat resistance and moisture resistance, is used as a novolac type phenolic resin. A hardened epoxy resin is used.

ところが近年、集積回路の高集積化に伴いチップがだん
だん大型化し、かつパッケージは従来のDIPタイプか
ら表面実装化された小型、薄型のフラットパッケージ、
SOP、SOJ、PLCCに変わってきている。
However, in recent years, as integrated circuits have become more highly integrated, chips have become larger and larger, and packages have changed from the conventional DIP type to surface-mounted small, thin flat packages.
It is changing to SOP, SOJ, and PLCC.

即ち大型チップを小型で薄いパッケージに封入すること
になり、応力によるクランク発生、これらのクラックに
よる耐湿性の低下等の問題が大きくクローズアップされ
てきている。
That is, a large chip is enclosed in a small and thin package, and problems such as the occurrence of cranks due to stress and a decrease in moisture resistance due to these cracks have been brought into focus.

特に半田づけの工程において象、激に200 ”C以上
の高温にさらされることによりパッケージの割れや樹脂
とチップの剥離により耐湿性が劣化してしまうといった
問題点がでてきている。
In particular, problems have arisen in the soldering process where exposure to extremely high temperatures of 200"C or higher can cause cracks in the package and deterioration of moisture resistance due to peeling of the resin and chip.

これらの大型チップを封止するの、に適した、信頼性の
高い封止用樹脂組成物の開発が望まれてきている。
It has been desired to develop a highly reliable encapsulating resin composition suitable for encapsulating these large chips.

〔発明の目的〕[Purpose of the invention]

本発明の目的とするところは、半田熱ストレスによるク
ラック発生をおさえ、耐湿性に優れた信頬性が高い封止
用樹脂組成物を提供するにある。
An object of the present invention is to provide a sealing resin composition that suppresses the occurrence of cracks due to soldering heat stress, has excellent moisture resistance, and has high reliability.

〔発明の構成〕[Structure of the invention]

本発明は電子部品等の対土用エポキシ樹脂組成物におい
て充填剤として平均粒径が20〜60 μmであり見掛
は密度がo、t 〜0.6g/ccであり、かつ比表面
積が3 rd / g以下である2次凝集シリカ粉末を
10〜100重景%含む充填剤を用いることを特徴とす
るエポキシ樹脂組成物に関するものである。
The present invention is used as a filler in an epoxy resin composition for soil use in electronic parts, etc., which has an average particle size of 20 to 60 μm, an apparent density of o,t to 0.6 g/cc, and a specific surface area of 3 The present invention relates to an epoxy resin composition characterized in that it uses a filler containing 10 to 100 weight percent of secondary agglomerated silica powder having a rd/g or less.

本発明のエポキシ樹脂組成物は従来の封止用樹脂組成物
に比べて非常に優れた耐半田熱ストレス性を有したもの
である。
The epoxy resin composition of the present invention has extremely superior soldering heat stress resistance compared to conventional sealing resin compositions.

本発明に用いるエポキシ樹脂としては、その分子中にエ
ポキシ基をすくなくとも2個以上有する化合物であれば
分子構造、分子量などは特に制限はなり、一般に封止用
材料として使用されているものであり、例えばノボラッ
ク系エポキシ樹脂、ビスフェノール型の芳香族系、シク
ロヘキサン誘導体の脂環式系、更には多官能系、シリコ
ン変性樹脂系があげられ、これらのエポキシ樹脂は1種
又は2種以上混合して用いられる。
As long as the epoxy resin used in the present invention is a compound having at least two or more epoxy groups in its molecule, there are no particular restrictions on the molecular structure, molecular weight, etc., and the epoxy resin is generally used as a sealing material. Examples include novolac epoxy resins, bisphenol-type aromatic resins, alicyclic cyclohexane derivatives, polyfunctional resins, and silicone-modified resins. These epoxy resins can be used singly or in combination of two or more. It will be done.

又硬化剤としてはノボラック型フェノール樹脂系および
これらの変性樹脂であり、例えばフェノールノボラック
、0−タレゾールノボラックの他ア −ルキル変性した
フェノールノボラック樹脂等があげられ、これらは単独
もしくは2種以上混合して使用しても差し支えがない。
Curing agents include novolac type phenolic resins and modified resins thereof, such as phenol novolak, 0-talesol novolak, and alkyl-modified phenol novolac resins, which may be used alone or in combination of two or more. There is no problem in using it.

エポキシ樹脂と硬化剤の配合比はエポキシ樹脂のエポキ
シ基と硬化剤の水酸基との当量比が0.5〜5の範囲内
に有ることが望ましい。
As for the compounding ratio of the epoxy resin and the curing agent, it is desirable that the equivalent ratio of the epoxy groups of the epoxy resin to the hydroxyl groups of the curing agent be within the range of 0.5 to 5.

当量比が0.5未満又は5を越えたものは耐湿性、成形
作業性及び硬化物の電気特性が悪くなるので好ましくな
い。
If the equivalent ratio is less than 0.5 or more than 5, the moisture resistance, molding workability and electrical properties of the cured product will deteriorate, which is not preferred.

本発明に使用される硬化促進剤はエポキシ基とフェノー
ル性水酸基との反応を促進するものであればよ<、一般
に封止用材料に使用されているものを広く使用すること
ができ、例えばジアザビシクロウンデセン(DBU)、
トリフェニルホスフィン(TPP)、ジメチルベンジル
アミン(BDMA)や2メチルイミダゾール(2MZ)
等が単独もしくは2種以上混合して用いられる。
The curing accelerator used in the present invention may be one that promotes the reaction between the epoxy group and the phenolic hydroxyl group, and a wide variety of those commonly used in sealing materials can be used, such as diaphragm. Zabishikuroundesen (DBU),
Triphenylphosphine (TPP), dimethylbenzylamine (BDMA) and 2methylimidazole (2MZ)
etc. may be used alone or in combination of two or more.

本発明に用いられる充填剤としては、平均粒径が20〜
60μ精であり、見掛は密度が0.1〜0.6g / 
ccで、かつ比表面積が5nf/g以下である2次疑集
シリカ粉末を、使用する充填剤量の10〜100重量%
の範囲で使用する。
The filler used in the present invention has an average particle size of 20 to
60μ precision, and the apparent density is 0.1-0.6g/
cc and a specific surface area of 5 nf/g or less, 10 to 100% by weight of the amount of filler used.
Use within the range.

2次凝集シリカ粉末は、その平均粒径が20μ驕未満で
あると半田熱ストレスによるクラックが発生しやすくな
り、60μ驕を越えると成形性が低下しいずれの場合も
、好ましくない、又好ましくは、平均粒径が20〜40
μmの範囲であれば良い、見掛は密度が0.6 g /
 ccを越えると半田熱ストレスによるクランクが発生
し易くなり、耐湿性が低下してしまい好ましくない。
If the average particle size of the secondary agglomerated silica powder is less than 20 μm, cracks are likely to occur due to soldering heat stress, and if it exceeds 60 μm, the moldability decreases, and in either case, it is not preferable or preferably. , average particle size is 20-40
It is fine as long as it is in the μm range, and the apparent density is 0.6 g/
If it exceeds cc, cranking due to soldering heat stress tends to occur, and moisture resistance decreases, which is not preferable.

さらに比表面積が5n(7gを越えると半田づけ工程で
クラックが発生し易く、耐湿性が低下してしまうととも
に流動性がいちぢるしく低下してしまい好ましくない。
Furthermore, if the specific surface area exceeds 5n (7g), cracks are likely to occur during the soldering process, moisture resistance is reduced, and fluidity is significantly reduced, which is not preferable.

さらに2次凝集シリカ粉末が、使用充填剤の量の10重
量%以下であれば半田づけ工程でクランクが発生しやす
くなり、耐湿性が低下し、その目的とする特性が得られ
ない。
Further, if the secondary agglomerated silica powder is less than 10% by weight of the amount of filler used, cranking is likely to occur during the soldering process, moisture resistance is reduced, and the desired characteristics cannot be obtained.

これらの充填剤は全体として樹脂組成物の50〜90重
量%配合する事が望ましい、その配合量が50%未満で
あれば耐熱性、機械的特性および耐湿性が劣り、90%
以上であれば流動性が低下し、成形性が悪くなり実用に
は適さない。
It is desirable that these fillers be blended in an amount of 50 to 90% by weight of the resin composition as a whole; if the blending amount is less than 50%, heat resistance, mechanical properties, and moisture resistance will be poor;
If it is more than that, the fluidity will decrease and the moldability will deteriorate, making it unsuitable for practical use.

又、2次凝集シリカ粉末以外の充填剤としては通常のシ
リカ粉末やアルミナ等があげられ、とくに熔融シリカ粉
末が好ましい。
In addition, examples of fillers other than secondary agglomerated silica powder include ordinary silica powder and alumina, with fused silica powder being particularly preferred.

本発明の対土用エポキシ樹脂組成物はエポキシ樹脂、硬
化剤、硬化促進剤及び2次凝集シリカ粉末を含む充填剤
を必須成分とするが、これ以外に必要に応じてシランカ
ップリング剤、ブロム化エポキン樹脂、二酸化アンチモ
ン、ヘキサプロムベンゼン等の難燃剤、カーボンブラッ
ク、ベンガラ等の着色剤、天然ワックス、合成ワックス
等の離型剤及びシリコンオイル、ゴム等の低応力添加剤
等の種々の添加剤を適宜配合しても差し支えがない。
The epoxy resin composition for soil use of the present invention contains an epoxy resin, a curing agent, a curing accelerator, and a filler containing secondary agglomerated silica powder as essential components. Various additives such as flame retardants such as Epoquin resin, antimony dioxide, and hexaprombenzene, colorants such as carbon black and red iron, mold release agents such as natural wax and synthetic wax, and low stress additives such as silicone oil and rubber. There is no problem even if the agent is appropriately blended.

又、本発明の封止用エポキシ樹脂組成物を成形材料とし
て製造するには、エポキシ樹脂、硬化剤、硬化促進剤、
充填剤、その他の添加剤をミキサー等によって十分に均
一に混合した後、さらに熱ロールまたはニーダ−等で熔
融混練し、冷却後粉砕して成形材料とすることができる
。これらの成形材料は電子部品あるいは電子部品の封止
、被覆、絶縁等に適用することができる。
In addition, in order to produce the epoxy resin composition for sealing of the present invention as a molding material, an epoxy resin, a curing agent, a curing accelerator,
After the filler and other additives are thoroughly and uniformly mixed using a mixer or the like, the mixture can be further melt-kneaded using a heated roll or kneader, cooled, and then ground to obtain a molding material. These molding materials can be applied to electronic parts or for sealing, covering, insulating, etc. of electronic parts.

〔発明の効果〕〔Effect of the invention〕

本発明のエポキシ樹脂組成物は半田づけ工程による急激
な温度変化による熱ストレスを受けたときの耐クラツク
性に非常に優れ、耐湿性の良い組成物であり、電子、電
子部品の封止用、被覆用、絶縁用等に用いた場合、特に
表面実装パッケージに搭載された高集積大型チップIC
において信頬性が非常に高い製品を得ることができる。
The epoxy resin composition of the present invention has excellent crack resistance when subjected to heat stress due to sudden temperature changes during the soldering process, and has good moisture resistance. When used for coating, insulation, etc., especially for highly integrated large chip ICs mounted on surface mount packages.
It is possible to obtain a product with very high credibility.

〔実施例〕〔Example〕

実施例1 0−タレゾールノボラックエポキシ樹脂(軟化点65°
C、エポキシ当量200)100重量部 フェノールノボラック樹脂     55重量部Br化
ビスフェノールAエポキシ (Br含146重量%、当1360)    10重量
部トリフェニルホスフィン       II(1部二
酸化アンチモン粉末       1)重量部カルナバ
ワックス          2重量部カーボンブラッ
ク          2重量部熔融シリカ粉末   
      400重量部2次凝集シリカ粉末(平均粒
径35μ爾、見掛は密度0.3 g / cc、比表面
積3ボ/g)50重量部 γ−グリシドメトキシシラン     3重量部をヘン
シェルミキサーで常温で混合し、70〜t o o ’
cで2軸ロールにより混練し、冷却後粉砕し成形材料と
した。
Example 1 0-talesol novolac epoxy resin (softening point 65°
C, epoxy equivalent 200) 100 parts by weight Phenol novolac resin 55 parts by weight Br bisphenol A epoxy (Br content 146% by weight, 1360) 10 parts by weight Triphenylphosphine II (1 part antimony dioxide powder 1) Part by weight Carnauba wax 2 Parts by weight Carbon black 2 parts by weight Fused silica powder
400 parts by weight of secondary agglomerated silica powder (average particle size 35μ, apparent density 0.3 g/cc, specific surface area 3 bo/g) 50 parts by weight γ-glycidomethoxysilane 3 parts by weight were mixed at room temperature in a Henschel mixer. Mix at 70~t o '
The mixture was kneaded using a twin-screw roll at step c, cooled, and then ground to obtain a molding material.

得られた成形材料をタブレット化し、低圧トランスファ
ー成形機にて175℃、70 kg / ca、1)0
秒の条件で半田クランク試験用として6×6皿のチップ
を52Pパツケージに封止し、又半田両温性試験用とし
て3×6鵬のチップを16pSOPパツケージに封止し
た。
The obtained molding material was made into tablets and molded using a low-pressure transfer molding machine at 175°C, 70 kg/ca, 1)0
A 6 x 6 plate chip was sealed in a 52P package for a solder crank test under conditions of 10 seconds, and a 3 x 6 plate chip was sealed in a 16p SOP package for a solder ambidextrous test.

封止したテスト用素子について175°C18時間ポス
トキュアー後下記の半田クラック試験及び半田耐湿性試
験をおこなった。
After post-curing the sealed test device at 175° C. for 18 hours, the following solder crack test and solder moisture resistance test were conducted.

半田クランク試験:封止したテスト用素子を85°C1
85%RHの環境下で24Hrおよび48Hr処理し、
その後260°Cの半田槽にlO秒間浸漬後顕微鏡で外
部クランクを観察した。
Solder crank test: sealed test element at 85°C1
Treated for 24 hours and 48 hours in an environment of 85% RH,
Thereafter, the external crank was immersed in a solder bath at 260° C. for 10 seconds, and then observed under a microscope.

半田耐湿性試験:封止したテスト用素子を85°C18
5%RHの環境下で72)1r処理し、その後260 
’Cの半田槽に10秒間浸漬後プレッシャークー/h−
試験(1)5°c、  100 %RH)を行い回路の
オープン不良を測定した。
Solder moisture resistance test: sealed test element at 85°C18
72) 1r treatment in an environment of 5% RH, then 260
Pressure cool after immersing in 'C' solder bath for 10 seconds/h-
Test (1) (5°C, 100% RH) was conducted to measure open defects in the circuit.

試験結果を第1表に示す。The test results are shown in Table 1.

実施例2〜4 第1表の処方に従って配合し、実施例1と同様にして成
形材料を得て、この成形材料で試験用の封止したものを
得た。この成形材料を用いて実施例1と同様にテスト用
素子を封止して半田クラック試験及び半田耐湿性試験を
行った。
Examples 2 to 4 Molding materials were obtained in the same manner as in Example 1 by blending according to the formulations in Table 1, and sealed products for testing were obtained with this molding material. Using this molding material, a test element was sealed in the same manner as in Example 1, and a solder crack test and a solder moisture resistance test were conducted.

試験結果を第1表に示す。The test results are shown in Table 1.

比較例1 実施例1において充填剤をすべて熔融シリカとした以外
はすべて実施例1と同様にし試験を行った結果を第1表
に示す。
Comparative Example 1 Table 1 shows the results of a test conducted in the same manner as in Example 1 except that all the fillers were replaced with fused silica.

比較例2 実施例4の充填剤を総て熔融シリカとし、あとは実施例
4と同様にし、試験を行った結果を第1表に示す。
Comparative Example 2 A test was conducted in the same manner as in Example 4 except that all the fillers in Example 4 were fused silica. Table 1 shows the results.

比較例2 実施例4の充填剤を総て熔融シリカとし、あとは実施例
4と同様にし、試験を行った結果を第1表に示す。
Comparative Example 2 A test was conducted in the same manner as in Example 4 except that all the fillers in Example 4 were fused silica. Table 1 shows the results.

Claims (1)

【特許請求の範囲】[Claims] (1)エポキシ樹脂、硬化剤、硬化促進剤及び充填剤か
らなるエポキシ樹脂組成物において、平均粒径が20〜
60μm、見掛け密度が0.1〜0.6g/ccであり
、かつ比表面積が5m^2/g以下である2次凝集シリ
カ粉末を10〜100重量%含む充填剤を用いることを
特徴とするエポキシ樹脂組成物。
(1) In an epoxy resin composition consisting of an epoxy resin, a curing agent, a curing accelerator, and a filler, the average particle size is 20 to
It is characterized by using a filler containing 10 to 100% by weight of secondary agglomerated silica powder having a diameter of 60 μm, an apparent density of 0.1 to 0.6 g/cc, and a specific surface area of 5 m^2/g or less. Epoxy resin composition.
JP6189388A 1988-03-17 1988-03-17 Epoxy resin composition Expired - Fee Related JPH07107122B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6189388A JPH07107122B2 (en) 1988-03-17 1988-03-17 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6189388A JPH07107122B2 (en) 1988-03-17 1988-03-17 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPH01236263A true JPH01236263A (en) 1989-09-21
JPH07107122B2 JPH07107122B2 (en) 1995-11-15

Family

ID=13184278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6189388A Expired - Fee Related JPH07107122B2 (en) 1988-03-17 1988-03-17 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPH07107122B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device
JP2016128542A (en) * 2015-01-09 2016-07-14 三菱電機株式会社 Insulating resin composition, insulating member, electric rotary machine and electric power generator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device
JP2016128542A (en) * 2015-01-09 2016-07-14 三菱電機株式会社 Insulating resin composition, insulating member, electric rotary machine and electric power generator

Also Published As

Publication number Publication date
JPH07107122B2 (en) 1995-11-15

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