JPH01235195A - Static electricity, and electromagnetic wave shielding material - Google Patents
Static electricity, and electromagnetic wave shielding materialInfo
- Publication number
- JPH01235195A JPH01235195A JP6286988A JP6286988A JPH01235195A JP H01235195 A JPH01235195 A JP H01235195A JP 6286988 A JP6286988 A JP 6286988A JP 6286988 A JP6286988 A JP 6286988A JP H01235195 A JPH01235195 A JP H01235195A
- Authority
- JP
- Japan
- Prior art keywords
- transparent
- conductive layer
- film
- static electricity
- adhesive agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 54
- 230000005611 electricity Effects 0.000 title claims abstract description 23
- 230000003068 static effect Effects 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 claims description 30
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 abstract description 8
- -1 polyethylene Polymers 0.000 abstract description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 239000002985 plastic film Substances 0.000 abstract description 2
- 229920006255 plastic film Polymers 0.000 abstract description 2
- 239000004698 Polyethylene Substances 0.000 abstract 1
- 229920000573 polyethylene Polymers 0.000 abstract 1
- 239000010408 film Substances 0.000 description 29
- 230000000694 effects Effects 0.000 description 8
- 239000011521 glass Substances 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 206010052128 Glare Diseases 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229930194542 Keto Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005421 electrostatic potential Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Landscapes
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Elimination Of Static Electricity (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、各種電子、通信装置、たとえばデイスプレ
ィデバイスなどを備えた装置に取付けられる静電気、電
磁波シールド材に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a static electricity and electromagnetic shielding material that is attached to various electronic and communication devices, such as devices equipped with display devices and the like.
従来から上記デイスプレィデバイスなどを備えた装置に
おけるたとえば窓材などとして用いられるシールド材と
しては、外部からデイスプレィ内部を目視できるような
高い可視光線透過能、つまりすぐれた透明性(視認性)
を有しているとともに、デイスプレィデバイスなどから
発生する静電気(高電圧)または電磁波などをシールド
しうるシールド特性を有していることが要求される。Conventionally, shielding materials used, for example, as window materials in devices equipped with the above-mentioned display devices, have a high visible light transmittance that allows the inside of the display to be seen from the outside, that is, excellent transparency (visibility).
It is also required to have shielding characteristics capable of shielding static electricity (high voltage) or electromagnetic waves generated from display devices and the like.
上記この種のシールド材としては、ガラス基板やポリカ
ーボネート基板などの透明部材上にメツシュタイプのカ
ーボン繊維や金属コーティング繊維を貼り合わせたもの
や、上記透明部材上に金属酸化物薄膜を直接的に形成さ
せたものなどが汎用されている。This type of shielding material mentioned above includes one in which mesh-type carbon fibers or metal-coated fibers are laminated onto a transparent member such as a glass substrate or a polycarbonate substrate, and one in which a metal oxide thin film is directly formed on the transparent member. It is widely used.
しかるに、上記従来のシールド材、すなわち、メツシュ
タイプのカーボン繊維や金属コーティング繊維を用いた
ものは、基板を透過する像や物体が該メツシュ部で切断
されたり、光の反射による散乱によりゆらぎを生じ視認
性を悪くさせるといった問題があり、一方、金属酸化物
を用いたものは、その作製に際し、遂−透明部材上に金
属酸化物膜を形成させる単一操作を繰返し行わねばなら
ないので、生産性が悪くコスト高となるだけでなく、上
記のようにガラス基板を用いた場合、該基板目体の性状
から作業時や使用時に容易に破損したり、かつ曲げ加工
ができないといった問題点を露呈する。さらに、プラス
チック基板を用いた場合でも、その金属酸化物膜形成作
業時に該薄膜にキズがつき易く、擦傷性の悪いものとな
っていた。However, with the conventional shielding materials mentioned above, that is, those using mesh-type carbon fibers or metal-coated fibers, the image or object that passes through the substrate is cut at the mesh part, or the light is scattered due to reflection, causing fluctuations and making it difficult to see. On the other hand, when manufacturing products using metal oxides, a single operation of forming a metal oxide film on a transparent member must be repeated, resulting in poor productivity. Not only is this bad and costs high, but when a glass substrate is used as described above, there are problems in that it is easily damaged during work or use due to the properties of the glass substrate, and it cannot be bent. Furthermore, even when a plastic substrate is used, the thin film is easily scratched during the metal oxide film formation process, resulting in poor abrasion resistance.
したがって、この発明は、上記従来の問題点の解消のた
め、高い可視光線透過能を有するとともに、上記装置の
デイスプレィデバイスなどから発生する静電気や電磁波
などをシールドしうるすぐれたシールド能を有し、かつ
、その作製時の作業性および耐擦傷性の良好な静電気、
電磁波シールド材を提供することを目的とする。Therefore, in order to solve the above-mentioned conventional problems, the present invention has a high visible light transmitting ability and an excellent shielding ability capable of shielding static electricity and electromagnetic waves generated from the display device of the above-mentioned device. , and static electricity with good workability and scratch resistance during production,
The purpose is to provide electromagnetic shielding materials.
この発明者らは、上記の目的を達成するために鋭意検討
した結果、透明なフィルム基材の一方の面に透明な導電
層を設け、透明導電フィルムを構成させ、この透明導電
フィルムの導電層を有しない開放面に粘着剤層を設ける
とともに、他の透明基板をこの粘着剤層を介して貼り合
わせることにより、可視光線透過能、静電気および電磁
波に対するシールド能のいずれの機能をも兼ね備えた部
材が得られて、しかもその作製時の作業性および耐擦傷
性が良好なものであることを知り、この発明を完成させ
るに至った。As a result of intensive studies to achieve the above object, the inventors provided a transparent conductive layer on one side of a transparent film base material to form a transparent conductive film, and the conductive layer of this transparent conductive film By providing an adhesive layer on the open surface that does not have a surface and bonding it with another transparent substrate via this adhesive layer, a member that has both the ability to transmit visible light and the ability to shield against static electricity and electromagnetic waves. It was found that the workability and scratch resistance during production were good, and the present invention was completed.
すなわち、この発明は、透明フィルム基材の一方の面に
透明な導電層を設け、他面に透明な粘着剤層を設けると
ともに、この粘着剤層を介して他の透明基板を貼り合わ
せてなる静電気、電磁波シールド材に係る。That is, this invention provides a transparent conductive layer on one side of a transparent film base material, a transparent adhesive layer on the other side, and adheres another transparent substrate via this adhesive layer. Related to static electricity and electromagnetic shielding materials.
この発明において使用する透明フィルム基材としては、
透明性を有するフィルムであれば広く適用でき、たとえ
ばポリエチレンテレフタレート(PET)、ポリイミド
(PI)、ポリエーテルサルフオン(PES)、ポリエ
ーテルエーテルケト7 (PEEK) 、ポリカーボネ
ート(PC) 、ポリプロピレン(PP)、ポリアミド
、アクリル、セルロースプロビオーネ(CP)などの厚
みが5〜300μm程度のプラスチックフィルムなどが
好ましく用いられる。The transparent film base material used in this invention is as follows:
Any transparent film can be widely applied, such as polyethylene terephthalate (PET), polyimide (PI), polyether sulfon (PES), polyether ether keto 7 (PEEK), polycarbonate (PC), and polypropylene (PP). Plastic films having a thickness of about 5 to 300 μm, such as polyamide, acrylic, cellulose probione (CP), etc., are preferably used.
上記フィルムの厚みが薄くなりすぎると、フィルムの機
械的強度が不足し、また厚くなりすぎるとフィルムのフ
レキシブル性が欠如し、たとえば、ロール状として連続
的に該フィルム表面に上記透明導電層、あるいは粘着剤
層を形成させることが難しくなる。また、フレキシブル
性がないために、上記透明基板を貼り合わせる際、両者
間に浮き現象や気泡が生じ易くなり密着性を阻害するの
で好ましくない。If the thickness of the film becomes too thin, the mechanical strength of the film will be insufficient, and if it becomes too thick, the film will lack flexibility. For example, the transparent conductive layer or It becomes difficult to form an adhesive layer. In addition, due to the lack of flexibility, when the transparent substrates are bonded together, floating phenomena and bubbles tend to occur between the two, which impairs adhesion, which is not preferable.
この発明において、上記フィルム基材の一方の面に設け
られる透明な導電層は、酸化第二スズ、酸化インジウム
、酸化チタン、酸化カドミウム、金属インジウム、金属
スズ、金、銀、白金、パラジウム、銅、アルミニウム、
ニッケル、クロム、チタン、鉄、コバルト、ヨウ化銅ま
たは、これらの混合物あるいは合金などから形成され、
その厚みは目的により適宜変更されるが、この発明に係
る用途などから勘案して、上記酸化物あるいはそれらの
混合物を導電層とする場合は80〜5.000人、また
上記金属あるいは合金を導電層とする場合は50〜40
0人程度とされる。In this invention, the transparent conductive layer provided on one surface of the film base material is made of stannic oxide, indium oxide, titanium oxide, cadmium oxide, metallic indium, metallic tin, gold, silver, platinum, palladium, copper, etc. ,aluminum,
Made from nickel, chromium, titanium, iron, cobalt, copper iodide, or mixtures or alloys thereof,
The thickness may be changed as appropriate depending on the purpose, but in consideration of the use of this invention, etc., when the above oxide or a mixture thereof is used as a conductive layer, the thickness is 80 to 5,000, and the above metal or alloy is used as a conductive layer. 50-40 if layered
It is estimated that there are about 0 people.
導電層が上記範囲より薄すぎると、膜構造上の欠陥によ
り静電気や電磁波に対するシールド性が低下し、また厚
くなりすぎると可視光線透過率が低下するため、いずれ
も好ましくない。If the conductive layer is too thin than the above range, the shielding property against static electricity and electromagnetic waves will be reduced due to defects in the film structure, and if it is too thick, the visible light transmittance will be reduced, both of which are not preferred.
上記導電層の表面抵抗は、特に静電シールド用として用
いる場合は、109Ω/口以下、また電磁波シールド用
として用いる場合は、1o3Ω/口以下が好ましい。The surface resistance of the conductive layer is preferably 10 9 Ω/hole or less when used for electrostatic shielding, and 10 3 Ω/hole or less when used for electromagnetic shielding.
このような導電膜は、たとえば真空蒸着法、スパッタリ
ング法、イオンブレーティング法、化学蒸着法、スプレ
ー熱分解法、化学メツキ法、電気メツキ法またはこれら
の組み合わせ法などの公知の薄膜形成技術により、容易
に形成することができる。Such a conductive film can be formed by a known thin film forming technique such as a vacuum evaporation method, a sputtering method, an ion blating method, a chemical vapor deposition method, a spray pyrolysis method, a chemical plating method, an electroplating method, or a combination thereof. Can be easily formed.
この発明において、フィルム基材の導電層を有しない片
面に設けられる粘着剤層としては、透明性を有するもの
であれば特に限定な(使用できるが、たとえばアクリル
系粘着剤などは好ましく用いられる。そして、この粘着
剤層の厚みは少なくとも2μm以上必要とされ、通常は
5〜500μmとされる。In this invention, the adhesive layer provided on one side of the film base material that does not have a conductive layer is not particularly limited as long as it has transparency (although it can be used, for example, acrylic adhesives are preferably used. The thickness of this adhesive layer is required to be at least 2 μm or more, and is usually 5 to 500 μm.
この粘着剤層の厚みは、この発明における重要な一つの
要素となるもので、たとえばシールド材の粘着剤の厚み
を2μm未満とした場合には、前記デイスプレィデバイ
スなどを備えた装置への取付けなどの際、該シールド材
における粘着剤層のクツション作用が期待できないため
上記透明フィルム基材上の導電層が押圧操作などにより
容易に損傷されるといった弊害につながり、また厚くし
すぎると、クツション効果は保有するものの、可視光線
透過性や作業性あるいはコストの面で好ましくないとい
った問題がある。The thickness of this adhesive layer is an important element in the present invention. For example, if the thickness of the adhesive of the shielding material is less than 2 μm, it may be difficult to attach it to an apparatus equipped with the display device, etc. In such cases, the cushioning effect of the adhesive layer in the shielding material cannot be expected, leading to problems such as the conductive layer on the transparent film base material being easily damaged by pressing operations, and if it is too thick, the cushioning effect However, there are problems in that it is unfavorable in terms of visible light transmittance, workability, and cost.
この発明における上記導電層を設けたフィルム基材の担
体となる透明基板は、その形状が平板状または曲形状な
どのものが採用され、たとえば厚みが通常1〜10m程
度のガラス板や、ポリカーボネート(PC)、セルロー
スプロビオーネ(CP)、アクリルなどの透明なプラス
チック板などが用いられる。The transparent substrate that serves as a carrier for the film base material provided with the conductive layer in this invention has a flat or curved shape, for example, a glass plate with a thickness of usually about 1 to 10 m, or a polycarbonate ( Transparent plastic plates such as PC), cellulose probione (CP), and acrylic are used.
なお、上記ガラス板とプラスチック板とを積層させて透
明基板を構成させてもよく、この場合には比較的脆く破
損され易いガラス板の破損時の飛散防止効果が付加され
る。Note that a transparent substrate may be constructed by laminating the above-mentioned glass plate and a plastic plate, and in this case, the glass plate, which is relatively brittle and easily broken, has an added effect of preventing scattering when broken.
第1図は、上記この発明に係る静電気、電磁波シールド
材の構成を示すもので、図中1は透明なフィルム基材2
の一方の面に設けられた透明な導電層で、3は上記フィ
ルム基材2の他面に設けられた透明な粘着剤層である。FIG. 1 shows the structure of the static electricity and electromagnetic shielding material according to the present invention, in which 1 is a transparent film base material 2.
3 is a transparent conductive layer provided on one surface of the film base material 2, and 3 is a transparent adhesive layer provided on the other surface of the film base material 2.
そして、4は上記粘着剤層3を介してフィルム基材2に
貼り合わされた透明基板である。4 is a transparent substrate bonded to the film base material 2 via the adhesive layer 3.
このようなシールド材は、電磁波シールド性を向上させ
る目的でその導電層1を接触させないように積層したり
、導電層1の保護などの目的で上記第1図のシールド材
を、さらに第2図に示すように、その導電層1面を互い
に接触させるようにして積層させて用いてもよい。Such a shielding material may be laminated so that the conductive layer 1 does not come into contact with each other in order to improve electromagnetic shielding properties, or may be laminated with the shielding material shown in FIG. As shown in FIG. 2, the conductive layers may be stacked so that their surfaces are in contact with each other.
また、透明基板4表面にアンチグレア−処理、すなわち
成形、サンドマット、塗工法などにより基板4表面を凹
凸形状にし、光の表面散乱および吸収を増加させること
により表面反射を少なくさせ、まぶしさをなくするよう
にして該基板4の視認性をさらに向上させるようにして
もよい。In addition, anti-glare treatment is applied to the surface of the transparent substrate 4, that is, the surface of the substrate 4 is made uneven by molding, sand matting, coating, etc., which increases surface scattering and absorption of light, reduces surface reflection, and eliminates glare. The visibility of the substrate 4 may be further improved in this manner.
以上のように、この発明の静電気、電磁波シールド材は
、可視光線透過能、静電気および電磁波シールド能のい
ずれかの機能をも兼ね備えたものであるため、たとえば
デイスプレィデバイスなどを備えた装置の窓材として通
用されれば、その透明性により装置内部の目視が容易と
なるとともに、装置内部から発生する静電気あるいは電
磁波を好適にシールドするという格別の効果が奏し得ら
れるものとなる。As described above, the static electricity and electromagnetic wave shielding material of the present invention has the functions of visible light transmission ability and static electricity and electromagnetic wave shielding ability, so it can be used as a window for devices equipped with display devices, etc. If it is used as a material, its transparency will make it easier to visually see the inside of the device, and it will have the special effect of shielding static electricity or electromagnetic waves generated from inside the device.
また、上記シールド材は、上述のように透明フィルム基
材を用いて構成しているため、たとえばロール状となし
た透明フィルム基材を使用し連続的に該フィルム基材上
に導電層、あるいは粘着剤層を形成させることができ、
かつ、該導電層と粘着剤層を形成したフィルム基材と、
上記透明基板とを連続して貼り合わせることも可能とな
る。In addition, since the above-mentioned shielding material is constructed using a transparent film base material as described above, for example, a roll-shaped transparent film base material is used and a conductive layer or a conductive layer is continuously applied on the film base material. It is possible to form an adhesive layer,
and a film base material on which the conductive layer and the adhesive layer are formed,
It is also possible to bond the above transparent substrate together continuously.
したがって、作業能率と、生産性の飛躍的な向上が期待
できるし、また作製されたシールド材は上記すぐれた特
性能とともに、既述した粘着剤層のクツション効果によ
り導電層の耐擦傷性が良好であるので、従来にない静電
気、電磁波シールド材として広い用途に適用され得るも
のとなる。Therefore, a dramatic improvement in work efficiency and productivity can be expected, and in addition to the above-mentioned excellent characteristics, the fabricated shielding material has good scratch resistance of the conductive layer due to the cushioning effect of the adhesive layer mentioned above. Therefore, it can be applied to a wide range of applications as an unprecedented static electricity and electromagnetic shielding material.
以下に、この発明の実施例を記載してより具体的に説明
する。なお、以下の特性試験は、つぎの方法にて行った
ものである。EXAMPLES Below, examples of the present invention will be described in more detail. In addition, the following characteristic tests were conducted using the following method.
〈表面抵抗〉 4端子法にて測定した。<Surface resistance> Measured using the 4-terminal method.
〈可視光線透過率〉
分光分析装置UV−240(品性製作所社製)を用いて
波長550nmにおける透過率を測定した。<Visible Light Transmittance> Transmittance at a wavelength of 550 nm was measured using a spectroscopic analyzer UV-240 (manufactured by Konsei Seisakusho Co., Ltd.).
〈静電気シールド特性〉
集電式電位測定器KS−325型(春日電気社製)を用
いて、テレビのブラウン管(CRT)表面にシールド材
を設置(アース付き)し、シールド材表面の静電気量(
テレビON時)を測定した。<Static electricity shielding characteristics> Using a current collector type potential measuring device KS-325 model (manufactured by Kasuga Denki Co., Ltd.), a shielding material was installed (grounded) on the surface of a cathode ray tube (CRT) of a television, and the amount of static electricity on the surface of the shielding material (
(when the TV was on) was measured.
なお、シールド材を設置しない場合は、40〜50kV
の静電気電位を持つ。In addition, if no shielding material is installed, the voltage will be 40 to 50 kV.
It has an electrostatic potential of .
く電磁波シールド特性〉
電磁波シールド効果測定装置TR−17301(アトパ
ンテスト社製)を用いて周波数107.10’、109
Hzの電界シールド効果(dB)を測定した。Electromagnetic shielding characteristics> Using an electromagnetic shielding effect measuring device TR-17301 (manufactured by Atopan Test Co., Ltd.),
The electric field shielding effect (dB) in Hz was measured.
実施例1
透明基材としての厚み75μmのPETフィルムの一面
にスパッタリング法により透明な導電層として厚み約6
00人のITO(Inz 03 :5noz=9:1
)からなる酸化物薄膜層を形成した。そして、上記導電
層を有しないPETフィルムの他面に厚み約20μmの
アクリル系粘着剤層を形成した。つぎに、上記フィルム
の粘着剤層を介して厚み2龍のアクリル板を該フィルム
と貼り合わせて静電気、電磁波シールド材を作製した。Example 1 A transparent conductive layer with a thickness of about 6 μm was formed by sputtering on one side of a 75 μm thick PET film as a transparent base material.
00 ITOs (Inz 03:5noz=9:1
) was formed. Then, an acrylic adhesive layer having a thickness of about 20 μm was formed on the other side of the PET film that did not have the conductive layer. Next, an acrylic plate having a thickness of 2 mm was bonded to the above film via the adhesive layer to produce a static electricity and electromagnetic shielding material.
実施例2
実施例1で用いた透明基材の一面に真空蒸着法により導
電層としてAuからなる厚さ約150人の金属’t”:
”1119層を形成した以外は、実施例1と同様な方法
で静電気、電(n波シールド材を作製した。Example 2 A conductive layer made of Au was deposited on one side of the transparent substrate used in Example 1 using a vacuum evaporation method to a thickness of about 150 mm:
``An electrostatic and electrostatic (n-wave) shielding material was produced in the same manner as in Example 1, except that the 1119 layer was formed.
実施例3
実施例1で用いた透明基材の一面に真空蒸着法により導
電層としてAgからなる厚さ約180人の金属薄膜層を
形成した以外は、実施例1と同様な方法で静電気、電磁
波シールド材を作製した。Example 3 Static electricity and electricity were removed in the same manner as in Example 1, except that a metal thin film layer made of Ag and having a thickness of approximately 180 mm was formed as a conductive layer on one surface of the transparent substrate used in Example 1 by vacuum evaporation. We created an electromagnetic shielding material.
上記実施例1〜3で作製した各シールド材の特性を第1
表に示す。The characteristics of each shield material produced in Examples 1 to 3 above were
Shown in the table.
第 1 表
以上の実施例1〜3に係るシールド材を、CRT、LC
Dなとのデイスプレィ前面に取付けて青用テストを行っ
たところ、良好な視認性が得られるとともに、静電気お
よび電磁波に対するすぐれたシールド性が発揮されるこ
とが確認された。The shielding materials according to Examples 1 to 3 shown in Table 1 and above were used for CRT, LC
A blue test was conducted by attaching it to the front of a D display, and it was confirmed that it not only provided good visibility, but also exhibited excellent shielding properties against static electricity and electromagnetic waves.
また、上記シールド材は、その製作に際し、上記導電層
を設けたフィルム基材を、該フィルム基材の粘着剤層を
介して透明基板と貼り合わせるだけでよく、作業性が良
好であるとともに、上記デイスプレィ前面への取付は時
においても、キズなどの発生はみられず、耐擦傷性も良
好であることが証明された。In addition, when manufacturing the shielding material, it is sufficient to simply bond the film base material provided with the conductive layer to a transparent substrate via the adhesive layer of the film base material, and the workability is good. Even when mounted on the front surface of the display, no scratches were observed, and the scratch resistance was also proven to be good.
第1図はこ・の発明の静電気、電磁波シールド材の一例
を示す断面図、第2図は第1図のシールド材を積層させ
た状態を示す断面図である。
1・・・透明な導電層、2・・・透明なフィルム基材、
3・・・透明な粘着剤層、4・・・透明基板特許出願人
日東電気工業株式会社
11品
嘱2 函
l:迅帽す葎ツ1
2 遂帽グフバルlx非セ
3: 誘明づ九笛な1層
4 凸萌蕗んFIG. 1 is a sectional view showing an example of the static electricity and electromagnetic wave shielding material of this invention, and FIG. 2 is a sectional view showing a state in which the shielding materials of FIG. 1 are laminated. 1... Transparent conductive layer, 2... Transparent film base material,
3...Transparent adhesive layer, 4...Transparent substrate Patent applicant: Nitto Electric Industry Co., Ltd. 11 items 2 Boxes: 1 x 1 2. Fue na 1 layer 4 convex moebun
Claims (1)
設け、他面に透明な粘着剤層を設けるとともに、この粘
着剤層を介して他の透明基板を貼り合わせてなることを
特徴とする静電気、電磁波シールド材。(1) A transparent conductive layer is provided on one side of a transparent film base material, a transparent adhesive layer is provided on the other side, and another transparent substrate is bonded via this adhesive layer. Features static electricity and electromagnetic shielding material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63062869A JP2983989B2 (en) | 1988-03-15 | 1988-03-15 | Static electricity, electromagnetic wave shielding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63062869A JP2983989B2 (en) | 1988-03-15 | 1988-03-15 | Static electricity, electromagnetic wave shielding material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01235195A true JPH01235195A (en) | 1989-09-20 |
JP2983989B2 JP2983989B2 (en) | 1999-11-29 |
Family
ID=13212716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63062869A Expired - Lifetime JP2983989B2 (en) | 1988-03-15 | 1988-03-15 | Static electricity, electromagnetic wave shielding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2983989B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6452331B1 (en) | 1996-09-26 | 2002-09-17 | Asahi Glass Company, Ltd. | Protective plate for a plasma display and a method for producing the same |
JP2022120897A (en) * | 2021-02-08 | 2022-08-19 | 三菱電線工業株式会社 | Translucent radio wave absorber |
-
1988
- 1988-03-15 JP JP63062869A patent/JP2983989B2/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6452331B1 (en) | 1996-09-26 | 2002-09-17 | Asahi Glass Company, Ltd. | Protective plate for a plasma display and a method for producing the same |
US7087308B2 (en) | 1996-09-26 | 2006-08-08 | Asahi Glass Company Ltd. | Protective plate for a plasma display and a method for producing the same |
US7264881B2 (en) | 1996-09-26 | 2007-09-04 | Asahi Glass Company Ltd. | Protective plate for a plasma display and a method for producing the same |
US8048531B2 (en) | 1996-09-26 | 2011-11-01 | Asahi Glass Company Ltd. | Protective plate for a plasma display and a method for producing the same |
JP2022120897A (en) * | 2021-02-08 | 2022-08-19 | 三菱電線工業株式会社 | Translucent radio wave absorber |
Also Published As
Publication number | Publication date |
---|---|
JP2983989B2 (en) | 1999-11-29 |
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